• Proceedings of the Korean Institute of Building Construction Conference
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• 2008.11a
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• pp.49-52
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• 2008

The present study was to develop a dry PFB method similar to the existing gypsum board construction method in order to apply the existing wet PFB method that uses fire-resistant adhesive. It was found that the existing wet method can produce concrete compressive strength of 80MPa and fire resistance of 3 hours with 30mm PF boards. The goal of development in this study was fire resistance of 3 hours through dry construction of 15mm fire-resistant boards. 1. Improved PF board was prepared by adding inorganic fiber to existing board and using aggregate with grain size of 3mm or less. Molding was done at temperature higher than that for existing PF board molding. While wet curing is used for existing PF boards, this study used dry curing in order to enhance heat insulation performance. 2. According to the results of fire resistance test, when the dry PF method was applied, the temperature of the main reinforcing bar was 116℃ in 15mm, 103.8℃ in 20mm, and 94℃ in 25mm, and these results satisfied the current standards for fire resistance control presented by the Ministry of Land, Transport and Maritime Affairs. When a 3-hour fire resistance test was performed and the external properties of the specimen were examined, the outermost gypsum board hardly remained and internal PF board maintained its form without thermal strain.

• Steel and Composite Structures
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• v.42 no.1
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• pp.33-48
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• 2022

This paper researches a lightweight composite structure referred to as the Profiled Steel Sheeting Dry Board (PSSDB). It is fundamentally produced by connecting a Profiled Steel Sheeting to Dry Board using mechanical screws. It is mainly employed as floor panels. However, almost all studies have focused on researching the one-way structural performance. Therefore, this study focuses on the bending behaviour of the two-way PSSDB floor system using both of Finite Element (FE) and Experimental analysis. Four panels were used in the experimental tests, and a mild steel plate has been applied at the bottom for two panels. For the FE process, models were created using ABAQUS software. 4 parametric studies have been utilized to understand the system's influential elements. From the experimental tests, it was found that using Steel Plate shall optimize the two-way action of the system and depending on the type of dry board the improvement in stiffness may reach up to 38%. It was shown from the FE analysis that the dry board, profiled steel sheeting and steel plat can affect the system by up to 10 %, 17% and 3% respectively, while applying a uniform load demonstrate a better two-way action.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.04a
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• pp.407-412
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• 2013

In dry wall, noise is passed through gypsum board and stud. Noise makes gypsum board vibration. Then, the vibration passes through stud and gypsum board as resonation. And radiation as noise from surface of gypsum board into adjacent room. At this moment, according to thickness, placement and cross-section of stud, noise transmission ratio changes. Thicker stud has better sound insulation performance. Studs are apart from each other, has better sound insulation performance. But, single stud structure has restriction of thickness and arrange of studs. In this article, Sound insulation performance varies depending on the shape of the studs were studied.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2001.11a
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• pp.8-13
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• 2001

In recently, polishing tile(porcelain homogeneous polished tile) was used in the construction field as a finishing material. But, there happened some problems such as tile exfoliation by construction condition in early ages. Also, in the dry wall system which used to lightweight wall, for use of polishing tile on dry wall, the examination of adhesive stability of polishing tile is needed. In this Paper, adhesive strength of Polishing tile was investigated by tile bond types on gypsum board and non asbestos board coated by tar-urethane and polymer modified cementitious waterproofing membrane(Series I). Then, the effect of heat stress and vibration was estimated on gypsum and non asbestos board(Series II).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• Proceedings of the Korean Institute Of Construction Engineering and Management
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• 2008.11a
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• pp.914-917
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• 2008

This paper was to discuss the case and cause of debonding defect of wood floor board in apartment house by investigating actual survey. Most frequent defect in wood floor board was debonding of floor board. Scratch, gap and crack of floor board were also found in floor board installment work. Causes of debonding of floor board is shrinkage of cement mortar beneath floor board and expansion of floor board. Haste in floor board work did not provide enough time to dry cement mortar fully, which led to continue to dry after the installment of floor board. It caused moisture movement toward wood floor board. Accordingly, Before floor board work, careful consideration on moisture condition of cement mortar and enough curing time to eliminate the effect of moisture are taken into.

• Journal of the Korea Institute of Building Construction
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• v.16 no.3
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• pp.193-199
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• 2016

This study is a research about performance of fireproof board using industrial waste such as oyster shell and dry process bottom ash through the heating test and conclusions were obtained as follows. Test samples show back side temperatures as follows : in $300^{\circ}C$, $103.1{\sim}125.1^{\circ}C$, in $600^{\circ}C$, $201.1{\sim}210.1^{\circ}C$, in $900^{\circ}C$, $249.2{\sim}276.9^{\circ}C$. In the test, temperature increases of specimens of fireproof board are kept at certain temperatures hence it could be concluded that the specimens withstand high temperatures. According to the test, it could be concluded that fireproof board made by smaller particles shows better performance up to $600^{\circ}C$ while at higher temperatures, fireproof board made by bigger particles shows better performance. It is estimated that fireproof board made by particles of bigger size has more pore structure and it delays heat conduction.

• Proceedings of the Korea Concrete Institute Conference
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• 2008.11a
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• pp.953-956
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• 2008

The present study was to develop a dry PFB method similar to the existing gypsum board construction method in order to apply the existing wet PFB method that uses fire.resistant adhesive. It was found that the existing wet method can produce concrete compressive strength of 80MPa and fire resistance of 3 hours with 30mm PF boards. The goal of development in this study was fire resistance of 3 hours through dry construction of 15mm fire.resistant boards.According to the results of fire resistance test, when the dry PF method was applied, the temperature of the main reinforcing bar was 116$^{\circ}$C in 15mm, 103.8$^{\circ}$C in 20mm, and 94$^{\circ}$C in 25mm, and these results satisfied the current standards for fire resistance control presented by the Ministry of Land, Transport and Maritime Affairs. When a 3.hour fire resistance test was performed and the external properties of the specimen were examined, the outermost gypsum board hardly remained and internal PF board maintained its form without thermal strain.

• Journal of the Korea Institute of Building Construction
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• v.2 no.3
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• pp.163-170
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• 2002

Recently, polishing tile(porcelain homogeneous polished tile) was used in the construction field as a finishing material. But, there happened some problems such as tile exfoliation by construction condition in early ages. Also, for use of polishing tile in the dry wall system which used to lightweight wall, the examination of adhesive stability of polishing tile is needed. In this study, adhesive strength of Polishing tile was investigated by tile bond types on gypsum board and non asbestos board coated by tar-urethane and Polymer modified cementitious waterproofing membrane(Series I). Then, the effect of heat stress and vibration was estimated on gypsum and non asbestos board(Series II). As the result of study are the follows; (1) Polishing tile(600$\times$400mm) construction on waterproofing layer : Both laboratory estimation and spot examination sieve were happened that fall of tile because their hardening speed is late. (2) To using powder style adhesives in the dry wail with waterproofing layer : Adhesive strength of tile is Influenced by interface bond area and base side condition. (3) Shock and heat stresses : obvious decline of adhesive strength is not happened