• Proceedings of the Korea Concrete Institute Conference
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• 2000.10a
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• pp.409-412
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• 2000

Many researchers have been trying to evaluate the diffusion coefficient of chloride ion in concrete by using qualitative and quantitative electro-migration tests. Up to now, however, there has been no sufficient method to closely determine the diffusion coefficient of chloride ion through electro-migration test. In this paper, the diffusion coefficient of chloride ion in concrete was investigated through an electro-migration test, that is, AASHTO T 277, Dhir's method, Tang's method and Andrade's method. And the results of these test were compared with each other.

• Journal of the Korean Ceramic Society
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• v.46 no.2
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• pp.155-160
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• 2009

The reliability could be one of the essential properties for multilayer ceramic capacitor (MLCC) using in various electronic devices and the concentration and mobility of oxygen vacancy would play important role in the reliability. To investigate the migration behavior of oxygen vacancies, thermally stimulated depolarization current (TSDC) is adopted. In dielectric material of X5R MLCC, the TSD-Current peak observed around 150$^{\circ}C$ and 200$^{\circ}C$ which represented the migration of oxygen vacancy. Substituting Yttrium for Dysprosium in X5R MLCC showed higher migration activation energy and lower TSD current density.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.687-691
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• 2011

In this paper, we design an 8-bit eSuse OTP (one-time programmable) memory in consideration of EM (electro-migration) and eFuse resistance variation based on a $0.18{\mu}m$ generic process, which is used for an analog trimming application. First, we use an external program voltage to increase the program power applied an eFuse. Secondly, we apply a scheme of precharging BL to VSS prior to RWL (read word line) activation and optimize read NMOS transistors to reduce the read current flowing through a non-programmed cell. Thirdly, we design a sensing margin test circuit with a variable pull-up load out of consideration for the eFuse resistance variation of a programmed eFuse. Finally, we increase program yield of eFuse OTP memory by splitting the length of an eFuse link.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.2
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• pp.88-94
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• 2011

In this paper, we design a 1-kb OTP (Onetime programmable) memory IP in consideration of BCD process based EM (Electro-migration) and resistance variations of eFuse. We propose a method of precharging BL to VSS before activation of RWL (Read word-line) and an optimized design of read NMOS transistor to reduce read current through a non-programmed cell. Also, we propose a sensing margin test circuit with a variable pull-up load out of consideration for resistance variations of programmed eFuse. Peak current through the non-programmed eFuse is reduced from 728 ${\mu}A$ to 61 ${\mu}A$ when a simulation is done in the read mode. Furthermore, BL (Bit-line) sensing is possible even if sensed resistance of eFuse has fallen by about 9 $k{\Omega}$ in a wafer read test through a variable pull-up load resistance of BL S/A (Sense amplifier).

• Proceedings of the Korea Concrete Institute Conference
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• 2002.10a
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• pp.17-22
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• 2002

Chloride ions have a tendency to penetrate into concrete and proceed the corrosion by depassivating rebar surface. Thus the deteriorated concrete is subject to experience severe degrading of durability under marine environment. Physical properties of mortar, such as, compressive strength and penetration depth of chloride ion were investigated. And to investigate the effect of containing SG, FA in mortar, the diffusion coefficient of chloride was measured through an electro - migration test. The diffusion coefficient of chloride was decreased with the increase of replacement ratio of SG compared with plain specimen.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.11a
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• pp.793-796
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• 2001

Physical properties of concrete, Such as, compressive strength, permeable pore and penetration depth of chloride ion were investigated. And to investigate the effect of containing GGBF in concrete, the diffusion coefficient of chloride was measured through an electro- migration test. The diffusion coefficient of chloride was decreased with increase of replacement ratios of GGBF when compared to OPC. Relation coefficients between physical properties of concrete and diffusion coefficient of chloride were more than 0.9.

• Journal of Navigation and Port Research
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• v.34 no.10
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• pp.787-792
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• 2010

It is necessary to predict the penetration of chloride ions for designing RC construction in marine environments. However, it takes a long time to obtain chloride migration coefficients. Therefore, the rapid chloride penetration test (RCPT) is generally used to shorten the test time. But there is a difference between chloride migration coefficients determined by rapid chloride penetration tests and those based on exposure in marine environments. In this study, we evaluated the effect on the chloride ion migration coefficient caused by a change in voltage and NaCl concentration. We also compared the relationship between the chloride ion migration coefficient by RCPT and that by exposure in marine environments. As a result of the experiments, we found that there is only a small change in the experimental factors based on changes in voltage and NaCl concentration and since they are so small, we can conclude that they are in the range of experimental error and test results from chloride ion migration coefficients by RCPT and exposure were very different from each other. In the exposure experiments, when the water-cement ratio was increased, the smaller fine air gaps in concrete affected the chloride ion migration coefficient.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.47-53
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• 2015

By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test ($85^{\circ}C$/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $CuCl_x$ were formed and grown on Cu trace during the $170^{\circ}C$/3hrs and that $CuCl_x$ was decomposed into Cu dendrite and $Cl_2$ gas during the $85^{\circ}C$/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.

• Journal of the Korea Safety Management & Science
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• v.15 no.1
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• pp.109-120
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• 2013

As information-oriented industry has been developed and electronic devices has come to be smaller, lighter, multifunctional, and high speed, the components used to the devices need to be much high density and should have find pattern due to high integration. Also, diverse reliability problems happen as user environment is getting harsher. For this reasons, establishing and securing products and components reliability comes to key factor in company's competitiveness. It makes accelerated test important to check product reliability in fast way. Out of fine pattern failure modes, failure of Electrochemical Migration(ECM) is kind of degradation of insulation resistance by electro-chemical reaction, which it comes to be accelerated by biased voltage in high temperature and high humidity environment. In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, $20/20{\mu}m$ pattern width/space applied by Semi Additive Process, was performed, and through this test, the investigation of failure mechanism and the life-time prediction evaluation under actual user environment was implemented. The result of accelerated test has been compared and estimated with life distribution and life stress relatively by using Minitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life has been estimated under 95% confidence level of failure data happened in each test conditions. And the life in actual usage environment has been predicted by using generalized Eyring model considering temperature and humidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have been calculated.

• Journal of Electrical Engineering and Technology
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• v.12 no.1
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• pp.302-309
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• 2017

The ageing of XLPE cable insulation will lead to the accelerating accumulation of space charge, which will greatly affect the safe operation of the HVDC cable. In order to investigate the influence of different ageing modes on the space charge distribution of the HVDC cable, thermal stressed, electrical stressed and electro-thermal stressed endurance tests were carried out on the XLPE peelings. The tested XLPE peelings were obtained from 160kV HVDC cable insulation. The endurance tests were carried at thermal stress of 363K, electrical stress of 20kV/mm DC and a combination of both. The Pulsed Electro-Acoustic (PEA) method was used to measure the space charge distribution of the samples. The influences of ageing on the trap energy distribution were analyzed based on the isothermal relaxation theory and the decay characteristics of the space charge. The results showed that thermal ageing would help to improve the crystalline morphologies of the XLPE at the early stage. The total amount of space charge decreased compared to the ones before thermal ageing. The long term of electrical stress would result in the cleavage of polymer molecule chains which would intensify the accumulation of space charge and increase the density and depth of electron traps. With a combination of electrical and thermal stress, the injection and migration of space charge were more significant. Besides, the depth and density of electron traps increased rapidly with the increase of endurance time.