• Journal of Information Processing Systems
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• v.8 no.1
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• pp.101-118
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• 2012

Embedded products are becoming richer in features. Simulation tools facilitate low-costs and the efficient development of embedded systems. SID is an open source simulation software that includes a library of components for modeling hardware and software components. SID components were originally written using C/C++ and Tcl/Tk. Tcl/Tk has mainly been used for GUI simulation in the SID system. However, Tcl/Tk components are hampered by low performance, and GUI development using Tcl/Tk also has poor flexibility. Therefore, it would be desirable to use a more advanced programming language, such as Java, to provide simulations of cutting-edge products with rich graphics. Here, we describe the development of the Java Bridge Module as a middleware that will enable the use of Java Components in SID. We also extended the low-level SID API to Java. In addition, we have added classes that contain default implementations of the API. These classes are intended to ensure the compatibility and simplicity of SID components in Java.

• 제어로봇시스템학회:학술대회논문집
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• 2002.10a
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• pp.68.4-68
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• 2002

$\textbullet$ This report presents an implementation a set of reusable software components which use of fault-tolerance embedded controller for railway signalling systems. These components can be used in real-time applications without application reprogramming. $\textbullet$ This library runs under VxWorks operating system and is oriented on real-time embedded systems. The library includes fault detection, fault containment, checkpointing and recovery components. $\textbullet$ The library enables to support high-speed response to fault occurrence in application software. Garbage collector together with VxWorks Watchdog provides both dead tasks detection and useless resources removing to avoid an overflow. Control flow...

• ETRI Journal
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• v.31 no.6
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• pp.732-740
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• 2009

This paper describes the implementation of a digital audio effect system-on-a-chip (SoC), which integrates an embedded digital signal processor (DSP) core, audio codec intellectual property, a number of peripheral blocks, and various audio effect algorithms. The audio effect SoC is developed using a software and hardware co-design method. In the design of the SoC, the embedded DSP and some dedicated hardware blocks are developed as a hardware design, while the audio effect algorithms are realized using a software centric method. Most of the audio effect algorithms are implemented using a C code with primitive functions that run on the embedded DSP, while the equalization effect, which requires a large amount of computation, is implemented using a dedicated hardware block with high flexibility. For the optimized implementation of audio effects, we exploit the primitive functions of the embedded DSP compiler, which is a very efficient way to reduce the code size and computation. The audio effect SoC was fabricated using a 0.18 ${\mu}m$ CMOS process and evaluated successfully on a real-time test board.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.764-767
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• 2003

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.599-602
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• 2004

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• International Journal of Reliability and Applications
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• v.16 no.1
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• pp.35-53
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• 2015

This investigation deals with reliability and sensitivity analysis of a repairable embedded system with standby wherein repairman takes multiple vacations. The hardware system consists of 'M' operating and 'S' standby components. The repairman can leave for multiple vacations of random length during its idle time. Whenever any operating unit fails, it is immediately replaced by a standby unit if available. Moreover, governing equations of an embedded system are constructed using appropriate birth-death rates. The vacation and repair time of repairman are exponentially distributed. The matrix method is used to find the steady-state probabilities of the number of failed components in the embedded system as well as other performance measures. Reliability indexes are presented. Further, numerical experiments are carried out for various system characteristics to examine the effects of different parameter. Using a special class of neuro-fuzzy systems i.e. Adaptive Network-based Fuzzy Interference Systems (ANFIS), we also approximate various performance measures. Finally, the conclusions and future research directions are provided.

• Journal of KIISE:Software and Applications
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• v.36 no.8
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• pp.607-615
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• 2009

There has recently been a trend that IT industry is united with traditional industries such as military, aviation, automobile, and medical industry. Therefore, embedded software which controls hardware of the system should guarantee the high reliability, availability, and maintainability. To guarantee these properties, there are many attempts to develop the embedded software based on COTS (Commercial Off The Shelf) hardware components. However, it can cause additional faults due to software/hardware interactions beside general software faults in this methodology. We called the faults, Linkage Fault. These faults have high severity that makes overall system shutdown although their occurrence frequency is extremely low. In this paper, we propose a new software reliability model which considers those linkage faults in embedded software development with COTS hardware components. We use the Bayesian Analysis and Markov Chain Monte-Cairo method to validate the model. In addition, we analyze real linkage fault data to support the results of the theoretical model.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.13-18
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• 2000

Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.

• IEMEK Journal of Embedded Systems and Applications
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• v.7 no.5
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• pp.227-239
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• 2012

Recent advances in electronics have enabled various conventional products to incorporate with numerous powerful microcontroller. Generally, an embedded system is a computer system designed for specific control functions within a larger system, often with real-time computing constraints. The growing performance and reliability of hardware components and the possibilities brought by various design method enabled implementing complex functions that improve the comport of the system's occupant as well as their safety. A cyber physical system (CPS) is a system featuring a tight combination of, and coordination between, the system's computational and physical elements. The concept of cyber physical system, including physical elements, cyber elements, and shared networks, has been introduced due to two general reasons: design flexibility and reliability. This paper presents a cyber physical system where system components are connected to a shared network, and control functions are divided into small tasks that are distributed over a number of embedded controllers with limited computing capacity. In order to demonstrate the effectiveness of cyber physical system, an unmanned forklift with autonomous obstacle avoidance ability is implemented and its performance is experimentally evaluated.