• 제목/요약/키워드: encapsulation

검색결과 810건 처리시간 0.027초

A Multi-Level Knowledge-Based Design System for Semiconductor Chip Encapsulation

  • Huh, Y.J.
    • 마이크로전자및패키징학회지
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    • 제9권1호
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    • pp.43-48
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    • 2002
  • Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

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이방 도전성 페이스트의 상온 보관성 향상을 위한 Imidazole 경화 촉매제의 Encapsulation (Encapsulation of an 2-methyl Imidazole Curing Accelerator for the Extended Pot Life of Anisotropic Conductive Pastes (ACPs))

  • 김주형;김준기;현창용;이종현
    • 마이크로전자및패키징학회지
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    • 제17권4호
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    • pp.41-48
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    • 2010
  • 본 연구에서는 일액형 이방 도전성 페이스트(anisotropic conductive paste, ACP) 혼합 조성의 상온 보관성을 향상시키기 위해 2-methyl imidazole 경화 촉매제를 5종의 각기 다른 물질로써 encapsulation하였다. Encapsulation용 분말 물질들은 DSC를 통해 그 융점을 관찰하였으며, 이를 통해 encapsulation용 분말 물질들을 액상으로 용융시켜 encapsulation하는 공정이 가능함을 확인할 수 있었다. Encapsulation된 2-methyl imidazole 분말을 포함한 ACP 혼합물질의 상온 보관성을 평가하기 위하여 시간에 따른 점도 변화가 관찰되었다. 그 결과, stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질에서 향상된 상온 보관성을 관찰할 수 있었으며, 이러한 formulation은 기본 혼합물질과도 유사한 경화 거동을 보임을 확인할 수 있었다. 최종적으로 stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질을 사용하여 RFID 칩을 제조된 안테나 패턴이 형성된 PET 기판에 고속 플립칩 본딩을 실시하였다. 이 경우 측정된 접합 강도는 기본 혼합물질에 비해 약 37%의 수준인 것으로 측정되었다.

봉지막이 박형 실리콘 칩의 파괴에 미치는 영향에 대한 수치해석 연구 (Effects of Encapsulation Layer on Center Crack and Fracture of Thin Silicon Chip using Numerical Analysis)

  • 좌성훈;장영문;이행수
    • 마이크로전자및패키징학회지
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    • 제25권1호
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    • pp.1-10
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    • 2018
  • 최근 플렉서블 OLED, 플렉서블 반도체, 플렉서블 태양전지와 같은 유연전자소자의 개발이 각광을 받고 있다. 유연소자에 밀봉 혹은 봉지(encapsulation) 기술이 매우 필요하며, 봉지 기술은 유연소자의 응력을 완화시키거나, 산소나 습기에 노출되는 것을 방지하기 위해 적용된다. 본 연구는 봉지막(encapsulation layer)이 반도체 칩의 내구성에 미치는 영향을 고찰하였다. 특히 다층 구조 패키지의 칩의 파괴성능에 미치는 영향을 칩의 center crack에 대한 파괴해석을 통하여 살펴보았다. 다층구조 패키지는 폭이 넓어 칩 위로만 봉지막이 덮고있는 "wide chip"과 칩의 폭이 좁아 봉지막이 칩과 기판을 모두 감싸고 있는 "narrow chip"의 모델로 구분하였다. Wide chip모델의 경우 작용하는 하중조건에 상관없이 봉지막의 두께가 두꺼울수록, 강성이 커질수록 칩의 파괴성능은 향상된다. 그러나 narrow chip모델에 인장이 작용할 때 봉지막의 두께가 두껍고 강성이 커질수록 파괴성능은 악화되는데 이는 외부하중이 바로 칩에 작용하지 않고 봉지막을 통하여 전달되기에 봉지막이 강하면 강한 외력이 칩내의 균열에 작용하기 때문이다. Narrow chip모델에 굽힘이 작용할 경우는 봉지막의 강성과 두께에 따라 균열에 미치는 영향이 달라지는데 봉지막의 두께가 작을 때는 봉지막이 없을 때보다 파괴성능이 나쁘지만 강성과 두께의 증가하면neutral axis가 점점 상승하여 균열이 있는 칩이 neutral axis에 가까워지게 되므로 균열에 작용하는 하중의 크기가 급격히 줄어들게 되어 파괴성능은 향상된다. 본 연구는 봉지막이 있는 다층 패키지 구조에 다양한 형태의 하중이 작용할 때 패키지의 파괴성능을 향상시키기 위한 봉지막의 설계가이드로 활용될 수 있다.

Cryopreservation of Zygotic Embryos of Herbaceous Peony (Paeonia lactiflora Pall.) by Encapsulation-Dehydration

  • Kim Hyun-Mi;Shin Jong-Hee;Sohn Jea-Keun
    • 한국작물학회지
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    • 제49권4호
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    • pp.354-357
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    • 2004
  • A simplified technique which cryoprotects zygotic embryos by encapsulation-dehydration was developed for the germplasm conservation of herbaceous peony (Paeonia lactiflora Pall.). The highest survival rate $(85\%)$ was obtained from embryos treated by encapsulation-dehydration. The zygotic embryos were precultured on MS medium containing 0.3mg/L $GA_3$ for 1 day. The precultured embryos were encapsulated in $3\%$ (w/v) alginate beads and immersed for 1 h in MS medium containing 2 M glycerol and 0.5 M sucrose. The encapsulated embryos were dehydrated for 5h by air drying prior to direct immersion in liquid nitrogen. This encapsulation-dehydration method appears to be a promising technique for germplasm cryopreservation of a herbaceous peony.

Silicone 봉지재를 이용한 태양광 모듈 제조 공정 및 평가에 대한 연구 (The study on evaluation for PV module development using the silicone encapsulation)

  • 정인성;이범수;양오봉;강성환;김종일
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2011년도 추계학술발표대회 논문집
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    • pp.137-142
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    • 2011
  • Individual solar cells must be connected together to give the appropriate current and voltage levels and they must also be protected from damage by the environment. [1] PV module consists of a glass/ polymer encapsulation/ solar cell string/ polymer encapsulation/ back sheet. Usually, encapsulation materials is used EVA(ethylene vinyl acetate), PVB(polyvinyl butyral), PO(polyolefin)sheet. This study is about fabrication of module using silicone material instead of above them. We got to know advantage that is fabrication time and efficiency of modules.

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Control of Encapsulation Efficiency and Initial Burst in Polymeric Microparticle Systems

  • Yeo, Yeon;Park, Ki-Nam
    • Archives of Pharmacal Research
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    • 제27권1호
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    • pp.1-12
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    • 2004
  • Initial burst is one of the major challenges in protein-encapsulated microparticle systems. Since protein release during the initial stage depends mostly on the diffusional escape of the protein, major approaches to prevent the initial burst have focused on efficient encapsulation of the protein within the microparticles. For this reason, control of encapsulation efficiency and the extent of initial burst are based on common formulation parameters. The present article provides a literature review of the formulation parameters that are known to influence the two properties in the emulsion-solvent evaporation/extraction method. Physical and chemical properties of encapsulating polymers, solvent systems, polymer-drug interactions, and properties of the continuous phase are some of the influential variables. Most parameters affect encapsulation efficiency and initial burst by modifying solidification rate of the dispersed phase. In order to prevent many unfavorable events such as pore formation, drug loss, and drug migration that occur while the dispersed phase is in the semi-solid state, it is important to understand and optimize these variables.

Thin Film Encapsulation with Organic-Inorganic Nano Laminate using Molecular Layer Deposition and Atomic Layer Deposition

  • 윤관혁;조보람;방지홍;성명모
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.270-270
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    • 2016
  • We fabricated an organic-inorganic nano laminated encapsulation layer using molecular layer deposition (MLD) combined with atomic layer deposition (ALD). The $Al_2O_3$ inorganic layers as an effective single encapsulation layer were deposited at 80 degree C using ALD with alternating surface-saturation reactions of TMA and $H_2O$. A self-assembled organic layers (SAOLs) were fabricated at the same temperature using MLD. MLD and ALD deposition process were performed in the same reaction chamber. The prepared SAOL-$Al_2O_3$ organic-inorganic nano laminate films exhibited good mechanical stability and excellent encapsulation property. The measurement of water vapor transmission rate (WVTR) was performed with Ca test. We controlled thickness-ratio of organic and inorganic layer, and specific ratio showed a lowest WVTR value. Also this encapsulation layer contained very few pin-holes or defects which were linked in whole area by defect test. To apply into real OLEDs panels, we controlled a film stress from tensile to compressive and flexibility defined as an elastic modulus with organic-inorganic ratio. It has shown that OLEDs panel encapsulated with nano laminate layer exhibits better properties than single layer encapsulated in acceleration conditions. These results indicate that the organic-inorganic nano laminate thin films have high potential for flexible display applications.

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PMOLED의 수명향상을 위한 단일박막구조의 봉지기술에 관한 연구 (A Study on Improvement Lifetime of Passive Matrix Organic Light Emitting Diode using Single Layer Thin Film)

  • 기현철;김선훈;김두근;김효진;김회종;홍경진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.282-283
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    • 2009
  • In the research, we have proposed a novel encapsulation with simple process and steady film for external environment in comparison with conventional encapsulation method. This was designed to cover the emitting organic material from air. Silicon 야oxide was used for thin film of encapsulation and the deposition thickness of the organic film was 220 nm. Operating voltage of green OLED with encapsulation was 5.5 V and luminance was 7.370 cd/$m^2$ at the applied voltage of 14.5 V. Luminance was measured in 10 hour intervals at the air-exposed condition. After 110 hours and 300 hours, luminances of green OLED were 7,368 and 7,367 cd/$m^2$, respectively. Luminance of green JLED doesn't decrease until 300 hours. As a results, proposed encapsulation can increase the life time of green OLED.

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PLGA 나노파티클의 Plasmid DNA 봉입: 폴록사머와 온도의 영향 (Encapsulation of Plasmid DNA in PLGA Nanoparticles: Effects of Poloxamer and Temperature)

  • 강현숙;류상화;명창선;황성주;박정숙
    • Journal of Pharmaceutical Investigation
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    • 제37권1호
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    • pp.39-43
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    • 2007
  • Previously, we have reported that PLGA nanoparticles were prepared for sustained release of water-soluble blue dextran and the particle size, in vitro release pattern and encapsulation were modulated by varying polymers. This study was designed to encapsulate plasmid DNA in PLGA nanoparticles and to investigate the effect of Polymers and temperatures. PLGA nanoparticles were fabricated with poloxamer 188 (P188) or poloxamer 407 (P407) by using spontaneous emulsification solvent diffusion method. As a model plasmid DNA, pCMV-Taq2B/1L-18 was encapsulated in PLGA nanoparticles. Then, the particle size, zeta potential and encapsulation efficiency of nanoparticles containing plasmid DNA were investigated. Particle sizes of PLGA nanoparticles prepared with P188 and P407 were in the range of 200-330 nm and 250-290 nm, respectively. Zeta potentials of nanoparticles were negative regardless of nanoparticle compositions. Encapsulation efficiency of P407 nanoparticles prepared at $30^{\circ}C$ was higher than those at other preparation condition. From the results, the PLGA nanoparticles prepared with poloxamers at different temperature, could modulate the particles size of nanoparticles, and encapsulation efficiency of plasmid DNA.

A DFT Study on Alkali and Alkaline Earth Metal Encapsulated Fullerene-Like BeO Cluster

  • Ravaei, Isa;Beheshtian, Javad
    • 대한화학회지
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    • 제61권6호
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    • pp.311-319
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    • 2017
  • By using Density Functional Theory (DFT), we have performed alkali metal and alkaline earth metal inside fullerene-like BeO cluster (FLBeOC) in terms of energetic, geometric, charge transfer, work function and electronic properties. It has been found that encapsulated processes of the alkali metal are exothermic and thermodynamically more favorable than alkaline earth metal encapsulation, so that interaction energy ($E_{int}$) of the alkali metal encapsulation FLBeOC is in the range of -0.02 to -1.15 eV at level of theory. It is found that, the electronic properties of the pristine fullerene-like BeO cluster are much more sensitive to the alkali metal encapsulation in comparison to alkaline earth metal encapsulation. The alkali and alkaline earth metal encapsulated fullerene-like BeO cluster systems exhibit good sensitivity, promising electronic properties which may be useful for a wide variety of next-generation nano-sensor device components. The encapsulation of alkali and alkali earth metal may increase the electron emission current from the FLBeOC surface by reducing of the work function.