• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.228-228
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• 2008

본 논문에서는 epoxy bonding film의 phenoxy resin의 함량변화에 따른 특성 변화에 대하여 연구하였다. epoxy bonding film은 미세패턴 구현을 위해서 사용되는 기판재료로써 epoxy, hardener, silica, phenoxy resin 등이 첨가되어진다. phenoxy resin 함량을 변화를 주면서 tape casting 방법을 통해서 flim 형성을 한 후, 제작된 film의 phenoxy resin 함량변화에 따른 조도 특성의 연구를 위해서 sweller, desmear 공정을 후 RA(Roughness Average)를 측정하고, SEM으로 표면을 관찰하였다. 또한 제작된 bonding film을 가열 가압 후 구리 도금공정을 거쳐 peel strength를 측정하였다. phenoxy resin 함량이 증가 할수록 RA가 증가되어지는 것이 관찰되어졌고, 또 한 peel strength 증가하였다.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.549-554
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• 2016

Low melting metals are difficult to weld because it is vaporized. But epoxy resin make bonding possible using low melting material and dismissal materials. This study is to improve the bonding strength of epoxy and substrate by mechanical and electrochemical methods. In case of mechanical work, bonding strength is 17.6MPa and in case of pre-work, bonding strength is 15.3MPa. When anodizing and mechanical work is applied, bonding strength is 25.3Mpa is increased 165%. When anodizing is applied, bonding strength is 27.6Mpa.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.1
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• pp.34-40
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• 2012

In this study, effects of bonding agent, e.g. epoxy, on the behavior of fundamental guided wave modes propagated in FRP plate bonded on a concrete, are investigated. Global matrix model of multilayered FRP-epoxy-concrete system was constructed to obtain the velocity and attenuation dispersion curves of the fundamental A0 and S0 modes. Two variables, thickness and elastic modulus of epoxy layer, were considered in the dispersion analysis. It was found that both the thickness and the elastic modulus of epoxy layer greatly affect the phase velocity and attenuation of S0 mode while those are negligible for A0 mode. Based on the results, it was concluded that S0 mode is more effective than A0 mode for bonding condition assessment for FRP plate bonded concrete.

• The korean journal of orthodontics
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• v.3 no.1
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• pp.21-28
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• 1972

저자는 direct bonding system의 pretreatment액 처리후 Epoxy adhesive의 bonding strength의 변화를 측정하기 위해서 발거된 상악 전치 진면 법랑질 표면에 pretreatment액으로서 $65\%$ phosphoric acid를 도포한 실험군과 도포하지 않은 비교군을 비교연구하고 임상에 적용하여 다음과 같은 결과를 얻었다. 1. 법랑질 표면에 pumicing과 $65\%$ phosphoric acid를 도포했을때 joint strength는 현저히 상승했다. 2. Epoxy adhesive의 bonding strength는 plastic attachment를 치아면에 접착유지시키기에 충분하며 임상적으로 이용할 수 있다. 3. Joint area가 클 수록 bonding strength는 증가했다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.663-667
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• 2005

Surface modified carbon nanotubes were applied into the epoxy composites to investigate its tribological property. Carbon nanotubes reinforced epoxy composites were fabricated by casting. Effects to the tribological property of loading concentrations and types of surface modification of carbon nanotubes were investigated under sliding condition using linear reciprocal sliding wear tester. The results show that the small amount of carbon nanotubes into the epoxy exhibited lower weight loss than the pure epoxy. It is concluded that the effect of an enormous aspect ratio of carbon nanotubes surface area which wider than conventional fillers that react as interface for stress transfer. As increased the contents of carbon nanotubes, the weight loss from the wear test was reduced. And the surface modified carbon nanotubes show better tribological property than as produced carbon nanotubes. It is due that a surface modification of carbon nanotubes increases the interfacial bonding between carbon nanotubes and epoxy matrix through chemical bonding. Changes in worn surface morphology are also observed by optical microscope and SEM for investigating wear behaviors. Carbon nanotubes in the epoxy matrix near the surface are exposed, because it becomes the lubricating working film on the worn surface. It reduces the friction and results in the lower surface roughness morphology in the epoxy matrix as increasing the contents of the carbon nanotubes.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

• Proceedings of the Korea Concrete Institute Conference
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• 2004.11a
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• pp.813-816
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• 2004

This study was performed to investigate bonding performance of epoxy resins for repairing of cracks in concrete, as a part of project to establish quality control standard for epoxy resins. In the slant shear strength test for hard and soft type epoxy, hard type was higher about 3 times than soft one. From the results, it is thought that hard type is suitable for load carrying. Injection of epoxy resin in the notch made flexural strength increase about $47\%$ over the specimen that epoxy resin is not injected. There were no differences in bonding performances with viscosity. Application of epoxy resin on the wet concrete surface made slant shear strength decrease about $46\%$, but similar performance to the case of application on the dry surface appeared by using epoxy resin for wet condition.

• Steel and Composite Structures
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• v.19 no.3
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• pp.735-757
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• 2015

Composite bonding steel plate (CBSP) is a newly developed type of structure strengthened technique applicable to the existing RC beam. This composite structure is applicable to strengthening the existing beam bearing high load. The strengthened beam consists of two layers of epoxy bonding prestressed steel plates and the RC beam sandwiched in between. The bonding enclosed and prestressed U-shaped steel jackets are applied at the beam sides. This technique is adopted in case of structures with high longitudinal reinforcing bar ratio and impracticable unloading. The prestress can be generated on the strengthening steel plates and jackets by using the CBSP technique before loading. The test results of full-scale CBSP strengthened beams show that the strength and stiffness are enhanced without reduction of their ductility. It is demonstrated that the strain hysteresis effect can be effectively overcome after prestressing on the steel plates by using such technique. The applied plates and jackets can jointly behave together with the existing beam under the action of epoxy bonding and the mechanical anchorage of the steel jackets. The simplified formulas are proposed to calculate the prestress and the ultimate capacities of strengthened beams. The accuracy of formulas was verified with the experimental results.