• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1581-1583
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• 1999

Epoxy Compound has been used as insulation material in cable accessories. During the applying voltage to cable, heat shock is induced to accessory by the temperature difference between atmosphere and conductor. In this study, crack resistance, thermal and mechanical properties were evaluated about conventional epoxy compound and rubber toughened epoxy compound. Because rubber absorbs the stress caused by heat shock, crack resistance of rubber toughened epoxy compound is high. In the case of low thermal expansion coefficient, the compound shows high crack resistance because of low volumetric change.

• 한국염색가공학회지
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• 제5권1호
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• pp.10-18
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• 1993

Epoxy compound was synthesized from bisphellol-A with epichlorophydrine. Epoxy compound and siloxane were emulsified conjugative one or another. The water repellency of silk fabrics was also highly improved by the treatment of epoxy-siloxane mixed emulsions containing stannic chloride and zirconium oxychloride. The maximum wrinkle recovery was obtained from the fabrics treated under the condition 2.5%-epoxy-siloxane emulsion at 16$0^{\circ}C$. The breaking elongation, the reflectance, the tensile strength and the bending properties of silk fabrics were not degraded severely by the treatment of epoxy-siloxane emulsion.

• 청정기술
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• 제23권4호
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• pp.378-387
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• 2017

영구적 난연성기를 함유한 에폭시 수지를 얻기 위하여, 본 연구에서는 디하이드록시를 함유한 인 화합물[10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phospha phenanthrene-10-oxide, DOPO-HQ]과 디하이드록시를 함유한 실리콘 화합물(polydimethylsiloxane, hydroxyl terminated, PDMS)를 경화하지 않은 에폭시 프리폴리머(diglycidyl ether of bisphenol A, DGEBA)와 반응시킨 다음, 경화제(4,4-diaminodiphenylmethane, DDM)를 사용하여 경화반응 시킨 에폭시 수지를 제조하였다. 제조된 에폭시 수지의 각종 특성을 적외선 분광분석기(FTIR), 시차주사열량기(DSC), 열중량 분석기(TGA), 한계산소지수(LOI)/수직 연소 시험(UL 94-V test), 인장 및 충격 시험을 이용하여 분석하였다. 그리고 사용한 인 및 실리콘 화합물의 함량이 에폭시 경화물의 열적/기계적 성질 및 난연성에 미치는 영향을 조사하였다. 인 및 실리콘 성분이 함유된 에폭시 수지의 열적 및 기계적 물성이 단순 에폭시 수지의 물성에 비교하여 크게 향상되었다는 것을 알 수 있었다. 그리고 인 및 실리콘을 함유한 모든 에폭시 수지는 29.9 ~ 31.8%의 LOI 및 V-0 수준의 UL 94-V로 난연성 기준(LOI: 30% 이상, UL 94-V: V-0)을 통과한 반면, 단순 에폭시 수지는 LOI: 21.4% 및 UL 94-V: no rating으로 난연성 기준에 크게 못 미치는 것을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.226-229
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• 1999

Epoxy compound has been used as insulation material in electrical equipment for a long time because of its excellent electrical, mechanical and chemical properties. Nowdays, becoming higher voltage system, the properties of interface between epoxy and metal insert become more important. The breakdown voltage of epoxy compound for electric material is variable according to the surface roughness of metal insert. Generally, with metal insert sanding, the adhesion strength is enhanced and the breakdown strength is reduced. But in this study, we knew that the adhesion strength became enhanced but the breakdown strength didn\`t reduced with metal insert sanding. So in this study sanding. So in this study, we suggest the optimum interface condition by adjusting the surface roughness.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Journal of Welding and Joining
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• 제18권2호
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• Bulletin of the Korean Chemical Society
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• 제31권8호
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• pp.2272-2278
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• 2010

A new hybrid thermosetting maleimido epoxy compound 4-(N-maleimidophenyl) glycidylether (N-MPGE) is prepared by reacting N-(4-hydroxyphenyl) maleimide (HPM) with Epichlorohydrin by using benzyltrimethylammonium chloride as a catalyst. The resulting compound possesses both the oxirane ring and maleimide group. The curing reaction of these maleimidophenyl glycidylether epoxy compound (N-MPGE) with amines as curing agents such as ethylendiamine (EDA), diethylentriamine (DETA) and triethylenetetramine (TETA), aminoethylpiperazine (AEP) and isophoronediamine, IPDA), are studied. Incorporation of maleimide groups in the epichlorohydrin provides cyclic imide structure and high cross-linking density to the cured resins. The cured samples exhibited good thermal stability, excellent chemical (acid/alkali/solvent) and water absorption resistance. Morphological studies by the SEM technique further confirmed the phase homogeneity net work of the cured systems.

• E2M - 전기 전자와 첨단 소재
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• 제5권4호
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• pp.393-399
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• 1992

In order to increase the coupling strength between bisphenol-A type epoxy resin and filler SiO$_{2}$ it was treated to filler with silane coupling agent[KBM-603]. To observe how silane coupling agent effects on dielectric breakdown strength of Epoxy/SiO$_{2}$ compound material, specimens of eight type were made like following. (A-1, A-2), (B-1, B-2), (C-1, C-2), (D-1, D-2) (see 2-2. Specimen) Specimen treated with silane coupling agent had always bigger dielectric breakdown strength than non-treated specimen. Under the influence of silane coupling agent, increment ratio of dielectric breakdown strength at specimen manufactured by hand drill was very bigger than that of specimen inserted spherical electrode. Therefore, as the specimen shape was varied, it was studied on effect that silane coupling agent affects on dielectric breakdown strength of Epoxy/SiO$_{2}$ compound material.

• 접착 및 계면
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• 제12권4호
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• pp.138-143
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• 2011

특수한 방향족 화합물인 biphenylene 성분이 도입된 novolac 유도체를 기본 골격으로 하는 에폭시 수지 경화물은 난연제의 도움 없이도 자기소화성을 발현하며, 최근에 친환경 EMC (Epoxy Molding Compound) 소재로 상용화되고 있다. 본 연구에서는 이들을 골격으로 하는 에폭시수지와 경화제로 이루어진 경화물을 제조하여 DSC, DMA, TMA, TGA로부터 phenol 유도체의 분자구조와 반응성, 열팽창성, 탄성율 및 열분해성 등을 검토하였다. 주제와 경화제의 골격구조로 biphenyl novolac 구조가 모두 함유할 때 저팽창성, 기계적 성능 및 연소지연성 등이 우수하게 나타났다.