• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.11
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• pp.905-910
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• 2011

To study encapsulation method for large-area organic light emitting diodes (OLEDs), red emitting OLEDs were fabricated, on which LiF and Al were deposited as inorganic protective films. And then the OLED was attached to flat glass by printing method using epoxy. In case of direct coating of epoxy onto OLED by printing method, luminance and current efficiency were remarkably decreased because of the damage to the OLED by epoxy. In case of depositing LiF and Al as inorganic protective films and then coating of epoxy onto OLED, luminance and current efficiency were not changed. OLED lifetime was more increased through inorganic protective films between OLED and flat glass than that without any encapsulation (8.8 h), i.e., 47 (LiF/Al/epoxy/glass), 62 (LiF/Al/LiF/epoxy/glass), and 84 h (LiF/Al/Al/epoxy/glass). The characteristics of OLED encapsulated with inorganic protective films (attached to flat glass) showed the possibility of application of protective films.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.217-249
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• 2003

• Macromolecular Research
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• v.13 no.3
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• pp.223-228
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• 2005

In the present work, a low-density polyethylene (LDPE) composite, filled with Zn-ion coated structural silica encapsulated with the diglycidyl ether of bisphenol-A (DGEBA), was synthesized using the conventional melt-blending technique in a sigma internal mixer. The catalytic activity of the Zn-ions (originating from the structural silica) towards the oxirane group (diglycidyl ether of bisphenol-A (DGEBA): encapsulating agent) was assessed by infrared spectroscopy. Two composites, each with a filler content of $2.5 wt\%$ were developed. The first one was obtained by melt blending the Zn-ion coated structural silica with LDPE in a co-rotating sigma internal mixer. The second one was obtained by melt blending the same LDPE, but with DGEBA encapsulated Zn-ion coated structural silica. Epoxy resin encapsulation of the Zn-ion coated structural silica resulted in its having good interfacial adhesion and a homogeneous dispersion in the polymer matrix. Furthermore, the encapsulation of epoxy resin over the Zn-ion coated structural silica showed improvements in both the mechanical and thermal properties, viz. a $33\%$ increase in the elastic modulus and a rise in the onset degradation temperature from 355 to $371^{\circ}C$, in comparison to the Zn-ion coated structural silica.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.39-44
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• 2006

A new kind of silicone-epoxy composite is reported in this research. The silicone-epoxy resin was synthesized by the hydrosilylation of tetramethycyclotetrasiloxane and 4-vinyl-1-cyclohexene 1,2-epoxy with a high reaction yield. It was found that the obtained silicone-epoxy resin shows a high reactive activity to the aluminum complex-silanol catalyst. The resin could be cured under the catalysis of $(Al(acac)_3/Ph_2Si(OH)_2$ at a concentration below 0.1 wt% to give a hard cured resin showing excellent optical clarity, UV resistance and thermal stability. It was also found that the Si-H groups facilitated the curing reaction and the silicone-epoxy resin bearing Si-H group could be cured effectively even if $Ph_2Si(OH)_2h$ was absent. Moreover, the UV resistance and thermal stability were improved significantly by the introduction of Si-H groups. This is possibly due to the reductive property of Si-H groups which can annihilate radical and peroxide effectively. This kind of silicone-containing epoxy composite might have very promising applications as optical resin, optical adhesive and encapsulation materials for electronic devices.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1995.10a
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• pp.64-67
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• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

• Journal of the Korean institute of surface engineering
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• v.46 no.3
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• pp.111-115
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• 2013

To study the encapsulation method for large-area organic light emitting devices (OLEDs), OLED of ITO / 2-TNATA / NPB / $Alq_3$:Rubrene / $Alq_3$ / LiF / Al structure was fabricated, which on $Alq_3$/LiF/Al as protective layer of OLED was deposited to protect the damage of OLED, and subsequently it was encapsulated using attaching film and flat glass. The current density and luminance of encapsulated OLED using attaching film and flat glass has similar characteristics compared with non-encapsulated OLED when thickness of Al as a protective layer was 1200 nm, otherwise power efficiency of encapsulated OLED was better than non-encapsulated OLED. Encapsulation process using attaching film and flat glass did not have any effects on the emission spectrum and the Commission International de L'Eclairage (CIE) coordinate. The lifetime of encapsulated OLED using attaching film and flat glass was 287 hours in 1200 nm Al thickness, which was increased according to thickness of Al protective layer, and was improved 54% compared with 186 hours in same Al thickness, lifetime of encapsulated OLED using epoxy and flat glass. As a result, it showed the improved efficiency and the long lifetime, because the encapsulation method using attaching film and flat glass could minimize the impact on OLED caused through UV hardening process in case of glass encapsulation using epoxy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.5
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• pp.381-386
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• 2012

To study encapsulation method for large-area organic light emitting diodes (OLEDs), red emitting OLEDs were fabricated, on which $Alq_3$ as organic buffer layer and LiF and Al as inorganic protective layers were deposited to protect the damage of OLED by epoxy. And then the OLEDs were attached to flat glass by printing method using epoxy. The basic structure of OLED doped with rubrene of 1 vol.% as emitting layer is ITO(150 nm) / 2-TNATA(50 nm) / ${\alpha}$-NPD(30 nm) / $Alq_3$:Rubrene(30 nm) / $Alq_3$(30 nm) / LiF(0.7 nm) / Al(100 nm). In case of depositing $Alq_3$, LiF and Al and then attaching of flat glass onto OLED, current density, luminance, efficiency and driving voltage were not changed and lifetime was increased according to thickness of Al as inorganic protective layers. The lifetime of OLED/$Alq_3$/LiF/Al_4/glass structure was 139 hours increased by 15.8 times more than bare OLED of 8.8 hours and 1.6 times more than edge sealed OLED of 54.5 hours.

• Journal of the Korean Institute of Telematics and Electronics
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• v.18 no.5
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• pp.22-29
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• 1981

An ion sensitive field effect transistor employing a special HCI heat treatment for the gate oxide layer along with tungsten metallization and multilayer encapsulation using fumed silica epoxy mixture was fabricated and its performance characteristics have been investigated. A theoretical model for the device operation is discussed, and it is shown that the experimental results are in good agreement with the theory. The fabricated device has excellent performance characteristics showing the fast response, long operation-life, small pH hysteresis, high sensitivity, etc. Especially, its stability has been greatly improved.

• Journal of the Semiconductor & Display Technology
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• v.13 no.4
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• pp.27-32
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• 2014

The cure properties of self-extinguishing epoxy resin systems with different charge transfer type latent catalysts were investigated, which are composed of YX4000H as a biphenyl epoxy resin, MEH-7800SS as a hardener, and charge transfer type latent catalysts. We designed and used five kinds of charge transfer type latent catalyst and compared to epoxy resin systems with Triphenylphosphine-Benzoquinone(TPP-BQ) as reference system. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The epoxy resin systems with Triphenylphosphine-Quinhydrone(TPP-QH), Triphenylphosphine-Benzanthrone(TPP-BT) and Triphenylphosphine-Anthrone(TPP-AT) as a charge transfer type latent catalyst showed a cure conversion rate of equal or higher rate than those with TPP-BQ. These systems with TPP-QH and Triphenylphosphine-Tetracyanoethylene(TPP-TCE) showed a critical cure reaction conversion of equal or higher conversion than those with TPP-BQ. The increases of cure conversion rates could be explained by the decrease of the activation energy of these epoxy resin systems. It can be considered that the increases of critical cure reaction conversion would be dependent on the crystallinity of the biphenyl epoxy resin systems.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.1
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• pp.1-4
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• 2003

This paper presents an attempt to develop probabilistic multistress life models to evaluate the lifetime characteristics of epoxy-encapsulated magnet wire with heavy build polyurethane enamel. A set of accelerated life tests were conducted over a wide range of pulsating voltages, temperatures, and frequencies. Samples of fine gauge twisted pairs of the encapsulated magnet wire were tested us-ing a pulse endurance dielectric test system. An electrical-thermal lifetime function was combined with the Weibull distribution of lifetimes. The parameters of the combined Weibull-electrical-thermal model were estimated using maximum likelihood estimation. Likewise, a generalized electrical-thermal-frequency life model was also developed. The parameters of this new model were estimated using multiple linear regression technique. It was found in this paper that lifetime estimates of the two proposed probabilistic multistress life models are good enough. This suggests the suitability of using the general electrical-thermal-frequency model to estimate the lifetime of the encapsulated magnet wire over a wide range of voltages, temperatures and pulsating frequencies.