• Journal of Korea Society of Industrial Information Systems
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• v.19 no.2
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• pp.51-58
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• 2014

As WSNs(Wireless Sensor Networks) are being deployed widely in diverse application areas, their management and maintenance become more important. Recent sensor node software takes modular software architectures in pursuit of flexible software management and energy efficient reprogramming. To realize an flexible and efficient modular architecture particularly on resource constrained mote-class sensor nodes that are implemented with MCUs(Micro-Controller Units) of a single address space. an appropriate module linking model is essential to resolve and bind the inter-module global symbols. This paper identifies a design space of module linking model and respectively their implementation frameworks. We then establish a taxonomy for module linking models by exploring the design space of module linking models. Finally, we suggest an implementation framework respectively for each module linking model in the taxonomy. We expect that this work lays the foundations for systematic innovation toward more flexible and efficient modular software architectures for WSNs.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1979-1981
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• 2002

새로운 방식의 일체형 flexible sensor module을 제작하였다. MEMS공정을 이용하여 제작된이 센서 모듈은 배선기판은 물론 strain sensor 역시 임의의 곡면에 실장을 위해 자유로운 굽힘이 가능하도록 제작되었다. 실리콘웨이퍼에 구현된 piezoresistor 스트레인 센서는 release-etch 방법을 통해 웨이퍼로부터 분리되어, 폴리이미드를 기판으로 하는 Flexible Sensor Array Module로 완성되었다. 소자와 기판을 따로 제작한 후 조립하는 기존의 방식에 비해, 웨이퍼 위에서 flexible 기판을 형성하여 수율이 높고 사진공정의 정밀도를 그대로 보전한 기판과 센서 어레이의 패키징이 가능하였으며, 칩을 기판에 실장하기 위한 정밀한 조립공정도 불필요하였다. 폴리이미드 기판은 전기도금을 통해 회로를 구성하여 1단계 패키징 (die to chip carrier)과 2단계 패키징 (chip to substrate)을 웨이퍼 레벨에서 완성하였다. 마지막으로 불산 용액을 통해 희생층을 제거함으로서 웨이퍼로 부터 센서어레이 모듈을 분리 하였다.

• Smart Structures and Systems
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• v.9 no.6
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• pp.535-547
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• 2012

Controlling the balance of motion in a context involving a biped robot navigating a rugged surface or a step is a difficult task. In the present study, a $3{\times}5$ flexible piezoelectric tactile sensor array is developed to provide a foot pressure map and zero moment point for a biped robot. We introduce an innovative concept involving structural electrodes on a piezoelectric film in order to improve the sensitivity. The tactile sensor consists of a polymer piezoelectric film, PVDF, between two patterned flexible print circuit substrates (FPC). Additionally, a silicon rubber bump-like structure is attached to the FPC and covered by a polydimethylsiloxane (PDMS) layer. Experimental results show that the output signal of the sensor exhibits a linear behavior within 0.2 N ~ 9 N, while its sensitivity is approximately 42 mV/N. According to the characteristic of the tactile sensor, the readout module is designed for an in-situ display of the pressure magnitudes and distribution within $3{\times}5$ taxels. Furthermore, the trajectory of the zero moment point (ZMP) can also be calculated by this program. Consequently, our tactile sensor module can provide the pressure map and ZMP information to the in-situ feedback to control the balance of moment for a biped robot.

• Journal of Sensor Science and Technology
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• v.26 no.5
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• pp.301-305
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• 2017

This paper presents a wearable human health-monitoring band. The band consists of a body temperature detector (BTD) and a hear rate detector (HRD). The BTD and HRD are realized using an inkjet-printed flexible temperature sensor and a commercial heart rate sensor module, respectively. The sensitivity of the fabricated BTD was found to be $-31/^{\circ}C$ with a linearity of 99.82%. The HRD using the commercial heart rate sensor module has a good performance with a standard deviation of 0.85 between the data of a commercial smart watch and the fabricated HRD.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.74-78
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• 2002

MEMS공정을 이용하여 폴리실리콘의 piezoresistivity를 이용한 스트레인 센서어레이를 제작하였고, 이 센서 어레이를 flexible substrate에 패키징하는 공정을 개발하였다. 실리콘 웨이퍼에 표면 가공(surface micromachining)된 센서는 폴리이미드 코팅, release-etch 방법을 통해 웨이퍼로부터 분리되어 폴리이미드를 기판으로 하는 flexible sensor array module을 완성할 수 있었다. 공정은 희생층과 절연층을 증착하고 폴리실리콘 0.5 $\mu\textrm{m}$을 증착, 도핑 및 패터닝하여 센서 어레이를 구성하였다. 이 센서어레이를 flexible substrate에 패키징 하기 위해서 폴리이미드를 코팅하여 15 $\mu\textrm{m}$의 막을 구성하였고, 100% $O_2$RIE를 이용한 선택적 식각 방법으로 via hole을 구성하였다. 이후 전기도금을 통해 회로를 구성하여 1단계 패키징(die to chip carrier)과 2단계 패키징(chip to substrate)을 웨이퍼 레벨에서 완성하였다. 희생층을 제거함으로서 웨이퍼로부터 센서어레이 모듈을 분리하였다. 제작되어진 센서 모듈은 임의의 곡면에 실장이 가능하도록 충분한 flexibility를 얻을 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.413-416
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• 1998

Sensitivity and calibration considerations are most important in the design and implementation of real control systems. Ideally parameter changes due to various causes should not appreciably affect the system's performances. But all the values of physical components of the plants and controllers as well as the relevant environmental conditions change in time, thus the output performance can be deteriorated during the operating span of the system. Naturally the duty of calibration or the prevention of performance deterioration due to excessive component sensitivity should be provided to the control system. In this paper, we propose a digital controller which has the capability of calibration and gain adjustment as well as the execution of control law. Specifically the problems of gain adjustment and offset calibration in the light source and CdS sensor module for position measurement in a flexible link system are considerably resolved. The parameters of measurement module are prone to change due to environmental brightness conditions resulting in poor steady state performance of the overall control system. Thus a proper method is necessary to provide correction to the changed values of gain and offset in the position measurement module. The proposed controller, whenever necessary, measures the open-loop characteristics, andthen calculates the offset and sensor gain correction values based on the prepared standard measurements. It is applied to the control of a flexible link system with the gain and offset calibration porblems in the light sensor module for position to show the applicability.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1524-1525
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• 2007

A flexible tactile sensor module based on polyimide matrix integrated with sensing elements and pluggable terminals connector was fabricated by polymer micromachining technology for robotic applications. The tactile sensor arrays are composed of $4{\times}4$, $8{\times}8$ and $16{\times}16$ sensing elements connected with pluggable terminals connector, respectively. Especially, both the tactile sensor array and the pluggable terminals are formed in the sensor module during the fabrication process. The fabricated tactile sensor module is measured continuously in the normal force range of $0{\sim}1N$ with tactile sensor auto-evaluation system. The value of resistance is relatively increased linearly with normal force in the overall range. The variation rate of resistance is about 2.0%/N in the range of $0{\sim}0.6N$ and 1.5%/N in the range of $0.6{\sim}1N$. Also, the flexibility of the sensing module is adequate to be placed on any curved surface as cylinder because the matrix consists of polymer and metal thin film.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.13-13
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• 2003

• International Journal of Advanced Culture Technology
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• v.2 no.2
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• pp.1-6
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• 2014

In this paper, we propose an intelligent streetlight system that has a complex sensor module of temperature, humidity, luminance and motion detection and controlled by the fuzzy logic based central monitoring system in order to get flexible and precise manipulation of the streetlight system in USN environment. The proposed streetlight system provides low power consumption and high efficiency by using sensed data from the complex sensor module, which were collected, processed, and analyzed by the fuzzy logic based central monitoring system. The performance of the proposed streetlight system is to be evaluated by a simulation study in terms of power savings and safety at the fields constructed as a test-bed under several suggested scenarios. Finally, we know that the proposed intelligent streetlight system can maximize the energy savings efficiently with the fuzzy logic based central monitoring system and selective remote dimming control by connecting it to the wireless ubiquitous sensor network (USN) using a Zigbee module.