• Korean Journal of Materials Research
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• v.12 no.6
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• pp.508-512
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• 2002

$2000{\AA}-SiO_2/Si(100)$ and $560{\AA}-Si_3N_4/Si(100)$ wafers, which are 10 cm in diameter, were directly bonded using a rapid thermal annealing method. We fixed the anneal time of 30 second and varied the anneal temperatures from 600 to $1200^{\circ}C$. The bond strength of bonded wafer pairs at given anneal temperature were evaluated by a razor blade crack opening method and a four-point bonding method, respectively. The results clearly slow that the four-point bending method is more suitable for evaluating the small bond strength of 80~430 mJ/$\m^2$ compared to the razor blade crack opening method, which shows no anneal temperature dependence in small bond strength.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.688-693
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• 2002

Adhesive bonding is becoming one of the popular joining techniques in metal industries, since it has some advantages over other techniques such as welding and diffusion bonding, e.g., any dissimilar metals are easily adhesive-bonded together. In this study, the experiments were carried out in order to provide the statistical data with strength evaluation methods: tension, shear and four-point bending tests for thermoplastic epoxy resin based adhesive-bonded metal joints. We should certificate on the probability of the adhesive strength that has the tendency of brittle fracture, the adhesive bonding strength between metals with thermoplastic adhesive has the best probability at four-point bending test. The strength testing method that has higher probability is four-point bending test, shear test and tensile test in order.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• Korean Journal of Materials Research
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• v.18 no.4
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• pp.204-210
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• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

• International Journal of Naval Architecture and Ocean Engineering
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• v.13 no.1
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• pp.136-146
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• 2021

This paper aims to numerically estimate the dynamic ice load on a conical structure. The Discrete Element Method (DEM) is employed to model the level ice as the assembly of numerous spherical particles. To mimic the realistic fracture mechanism of ice, the parallel bonding method is introduced. Cases with four different ice drifting velocities are considered in time domain. For validation, the statistics of time-varying ice forces and their frequencies obtained by numerical simulations are extensively compared against the physical model-test results. Ice properties are directly adopted from the targeted experimental test set up. The additional parameters for DEM simulations are systematically determined by a numerical three-point bending test. The findings reveal that the numerical simulation estimates the dynamic ice force in a reasonably acceptable range and its results agree well with experimental data.

• Journal of Technologic Dentistry
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• v.33 no.1
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• pp.25-35
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• 2011

Purpose: There are some advantages of the acrylic resin denture base ; appropriate strength, volume safety, simple processing apparatus, and low cost. But, it have a weakness for fracture by intense pressure or shock. However, the repairs for resin denture base are possible using various materials and techniques. There is a few studies in repairs for resin denture base, but not clinical researches. And there is no studies in absorbed saliva into the region of fracture and bond strength. This study is to observe re-bond strength of resin denture base after repairing under saliva absorption. Methods: The samples were made of heat curing resin and the rectangular parallelepiped specimens which were 50mm long, 10mm wide and 3mm high. The four different groups immersed in the artificial saliva for 2 weeks were prepared, 1) no repaired control samples, 2) immediately repaired samples, 3) repaired samples after 1 day dry, and 4) repaired samples after 3 days dry. The prepared samples were repaired by two different curing materials, self curing resin and heat curing resin method. Each groups composed of 10 specimens were experimented with the three point bending tests for bonding strength measuring Results: There were under condition absorbed in the artificial saliva and repaired by self curing resin method, repaired specimens after 1 day and 3 days dry groups had higher values of bonding strengths than control group, and bonding strengths of immediately repaired samples were similar to those of control samples (p<0.05). There were under condition immersed in the artificial saliva and repaired by heat curing resin method, immediately repaired samples showed similar values to bonding strengths of control groups, and repaired samples after 1 day and 3 days dry groups were lower than those of control group (p>0.05). Conclusion: In this study, the repairs for resin denture base were remarkably high values of bonding strengths than those of the past, and showed that have stable bonding strengths independent of saliva absorption of denture base, so present repairs for resin denture base can be performed, regardless of saliva conditions.

• Ocean Systems Engineering
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• v.11 no.4
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• pp.313-330
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• 2021

In this study, the dynamic interaction between an Arctic Spar and drifting level ice is examined in time domain using the newly developed ice-hull-mooring coupled dynamics program. The in-house program, CHARM3D, which is the hull-riser-mooring coupled dynamic simulator is extended by coupling with the open-source discrete element method (DEM) simulator, LIGGGHTS. In the LIGGGHTS module, the parallel-bonding method is implemented to model the level ice using an assembly of multiple bonded spherical particles. As a case study, a spread-moored Artic Spar platform, whose hull surface near waterline is the inverted conical shape, is chosen. To determine the breaking-related DEM parameter (the critical bonding strength), the four-point numerical bending test is used. A series of numerical simulations is systematically performed under the various ice conditions including ice drift velocity, flexural strength, and thickness. Then, the effects of these parameters on the ice force, platform motions, and mooring tensions are discussed. The simulations reveal various features of dynamic interactions between the drifting ice and moored platform for various ice conditions including the novel synchronous resonance at low ice speed. The newly developed simulator is promising and can repeatedly be used for the future design and analysis including ice-floater-mooring coupled dynamics.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.26-31
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• 2012

Three-dimensional integrated circuit (3D IC) technology has become increasingly important due to the demand for high system performance and functionality. We have evaluated the effect of Buffered oxide etch (BOE) on the interfacial bonding strength of Cu-Cu pattern direct bonding. X-ray photoelectron spectroscopy (XPS) analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE 2min. Two 8-inch Cu pattern wafers were bonded at $400^{\circ}C$ via the thermo-compression method. The interfacial adhesion energy of Cu-Cu bonding was quantitatively measured by the four-point bending method. After BOE 2min wet etching, the measured interfacial adhesion energies of pattern density for 0.06, 0.09, and 0.23 were $4.52J/m^2$, $5.06J/m^2$ and $3.42J/m^2$, respectively, which were lower than $5J/m^2$. Therefore, the effective removal of Cu surface oxide is critical to have reliable bonding quality of Cu pattern direct bonds.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• The Journal of Korean Academy of Prosthodontics
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• v.43 no.4
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• pp.415-425
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• 2005

Statement of problem : Fracture of composite resin core will be occulted by progress of crack. Bonding interface of different materials has large possibility of starting point of crack line. Therefore, the bond strength of glass fiber post to composite resin core is important for prevention of fracture. Purpose: This in vitro study tried to find out how to get the higher strength of glass fiber post to composite resin core through surveying the maximum load that fractures the post and cote complex. Materials and methods: 40 specimens made with glass fiber Posts(Style $post^{(R)}$, Metalor, Swiss) and composite resin core ($Z-100^{(R)}$, 3M, USA) were prepared and loaded to failure with push-out type shear-bond strength test in a universal test machine. The maximum fracture load and fracture mode were investigated in the specimens that were restored with four different surface treatments. With the data. ANOVA test was used to validate the significance between the test groups, and Bonferroni method was used to check if there is any significant statistical difference between each test group. Evely analysis was approved with 95% reliance. Results: On measuring the maximum fracture load of specimens, both the treatments of sandblasted and acid-etched one statistically showed the strength increase rather than the control group (p<0.005). The scanning electric microscope revealed that sand blasting made more micro-retention form not only on the resin matrix but on the glass fiber, and acid-etching contributed to increase in surface retention form, eliminated the inorganic particles in resin matrix. Specimen fracture modes investigation represented that sand blasted groups showed lower bonding failure than no-sand blasted groups. Conclusion: Referring to the values of maximum fracture load of specimens, the bonding strength was increased by sand blasting and acid-etching.