• 한국통신학회논문지
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• 제12권4호
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• pp.357-364
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• 1987

본 논문에서는 다중프로세서 시스템을 구성하는 중요한 요소인 다단상호결합 네트웍의 성능을 고찰한다. Baseline 네트웍을 이용한 Star네트웍 시스템의 Hardware적인 구성을 고찰하며 Analytical Model로 Request가 받아들여질 확률과 Clustering 확률을 구한다. 그리고 Baseline네트웍 대신에 Delta네트웍을 이용하여 위에서 언급한 확률을 구한 다음 네트웍의 성능을 비교한다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전력기술부문
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• pp.277-279
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• 2002

Recently, power requirement has been increasing. But the large generation unit is hardly installed because of economic and environment problem. Therefore, the concern for DG(distributed generation) is growing. Present, allowable interconnection capacity of DG for composite distributed generation is studied. In this paper, it is studied that the new interconnection capacity of DG for composite distribution system interconnected DG. We study new allowable interconnection capacity by power factor and placement. We study SERV(sending end reference voltage) variation and allowable interconnection capacity interconnected new DG.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 A
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• pp.527-529
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• 2001

Interfaces are the point of interconnection between distributed generation and the energy infrastructure. These interfaces are generally physical but can include a market dimension as well. While there are issues surrounding various interfaces, the most important issues in the short term are on the electrical interface. Much of the discussion and debate surrounding distributed generation interconnection has centered on technical issues. However, there are two elements of Interconnection that merit equal consideration-process and contractual issues. The solution of distributed generation Interconnection issues depends on whether existing requirements can be modified to make them more efficient, transparent, and standardized while maintaining the grid's reliability and safety. In this paper, two main courses, standardization and third party participation, are suggested for the resolution of these issues.

• 반도체디스플레이기술학회지
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• 제3권3호
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• pp.31-35
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• 2004

A blue light emitting diode with 8 periods InGaN/GaN multi-quantum well structure grown by metal-organic chemical vapor deposition was fabricated with the inclusion of the metal-interconnection process in order to integrate the chips for light lamp. The quantum well structure provides the blue light photoluminescence peaked at 479.2 nm at room temperature. As decreasing the temperature to 20 K, the main peak was shifted to 469.7 nm and a minor peak at 441.9 nm appeared indicating the quantum dot formation in quantum wells. The current-voltage measurement for the fabricated LED chips shows that the metal-interconnection provides good current path with ohmic resistance of 41 $\Omega$.

• 한국IT서비스학회지
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• 제7권1호
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• pp.131-149
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• 2008

Bandwidth Trading(BT) represents a potential market with over 1 trillion USD across the world and high growth potential. BT is also likely to accelerate globalization of the telecommunications industry and massive restructuring driven by unbundling rush. However, systematic researches on BT remain at an infant stage. This study starts with structure analysis of the Internet industry, and discusses significance of Internet interconnection with respect to BT Issues. We also describe the bandwidth commoditization trends and review technical requirements for effective Internet interconnection with BT capability. Taking a step further, this study explores the possibility of improving efficiency of network providers and increasing user convenience by developing an architectural prototype of Hub-&-Spoke interconnection model required to facilitate BT. The BT market provides an Innovative base to ease rigidity of two-party contract and Increase service efficiency. However, as fair, efficient operation by third party is required, this research finally proposes an exchanging hub named NIBX(New Internet Business eXchange).

• Journal of information and communication convergence engineering
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• 제20권3호
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• pp.160-165
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• 2022

This paper proposes an efficient method of reconstructing interconnections when the terminals of each plane change in real-time situations where randomly divided planes are interconnected. To connect all terminals when the terminals of each plane are changed, we usually reconstruct the interconnections between all terminals. This ensures a minimum connection length, but it takes considerable time to reconstruct the interconnection for the entire terminal. This paper proposes a solution to obtain an optimal tree close to the minimum spanning tree (MST) in a short time. The construction of interconnections has been used in various design-related areas, from networks to architecture. One of these areas is an ad hoc network that only consists of mobile hosts and communicates with each other without a fixed wired network. Each host of an ad hoc network may appear or disappear frequently. Therefore, the heuristic proposed in this paper may expect various cost savings through faster interconnection reconstruction using the given information in situations where the connection target is changing.

• Journal of Welding and Joining
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• 제29권3호
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• pp.27-34
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• 2011

• 한국진공학회:학술대회논문집
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• 한국진공학회 1993년도 제5회 학술발표회 논문개요집
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• pp.58-59
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• 1993

• 조명전기설비학회논문지
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• 제21권3호
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• pp.107-116
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• 2007

정부의 신 재생 에너지 관련 정책으로 인해 앞으로 국내에서 신 재생에너지원은 보급은 증가할 것으로 예상된다. 신 재생에너지원은 전원의 특성상 전력계통에 연계되어 운전하는 것이 일반적이지만 이러한 연계 운전은 전력계통 계획 및 운영상에 상당한 영향을 미치게 된다. 기존 배전계통의 전력조류는 변전소에서 수용가를 향한 단방향이며 이를 기반으로 계통운영이 이루어지고 있으나, 신 재생에너지원의 연계로 배전계통에 양방향의 전력조류가 형성되므로 기존의 보호시스템의 신뢰성 및 전력품질이 저하될 수 있다. 따라서 신 재생에너지원의 연계평가에 대한 기술적 평가절차가 필요하다. 본 논문에서는 국내 배전계통의 전형적인 보호기기인 자동 재폐로 차단기와 구분개폐기의 특성을 살펴보고, 현재의 자동재폐로 차단기-구분개폐기 보호시스템에서 분산전원의 연계용량을 검토하는 방안을 제시하고자 한다.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.