• Proceedings of the IEEK Conference
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• 2001.06a
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• pp.375-378
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• 2001

A 640Gb/s very advanced ATM switching system using 0.25um CMOS VLSI, 40 layer ceramic MCM and 10Gb/s, 8 wavelength 8$\times$8 optical WDM interconnection has been fabricated. To break though the interconnection bottleneck, optical WDM interconnection is used. It has 20Gb/s 8 wavelength 8$\times$8 interconnection capability. It realizes 640Gb/s interconnections within a very small size. Preliminary tests show that 800b1s ATM switch MCM and optical WDM interconnection technologies can be applied to future high speed broadband networks

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.7
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• pp.1129-1134
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• 2008

This paper proposes a reliability evaluation for interconnection planning using a tie line equivalent assisting generator model (TEAG) that considers the uncertainties of the interconnected transmission systems and the tie lines. Development of this model was triggered by the need to perform probabilistic reliability evaluations on the NEAREST (North East Asia Region Electric Systems Tied) interconnection. The TEAG is the basis for the newly developed interconnection systems reliability evaluation computer program, NEAREL. The model is capable of considering uncertainties associated with generators, tie lines, and the tied grids. Reliability evaluations for six interconnection scenarios involving the power systems of six countries in the Asian north eastern region were performed using NEAREL. Sensitivity analysis was used to determine reasonable tie line capacities for three interconnected country scenarios of the six countries. Test results and summarized comments of the scenarios are included in the paper.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.318-328
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• 2011

Stage-level reconfigurable chip multiprocessor (CMP) aims to achieve highly reliable and fault tolerant computing by using interwoven pipeline stages and on-chip interconnect for communicating with each other. The existing crossbar-switch based stage-level reconfigurable CMPs offer high reliability at the cost of significant area/power overheads. These overheads make realizing large CMPs prohibitive due to the area and power consumed by heavy interconnection networks. On other hand, area/power-efficient architectures offer less reliability and inefficient stage-level resource utilization. In this paper, I propose a hierarchical multiplexing interconnection structure in lieu of crossbar interconnect to design area/power-efficient stage-level reconfigurable CMP. The proposed approach is able to keep the reliability offered by the crossbar-switch while reducing the area and power overheads. Experimental results show that the proposed approach reduces area by up to 21% and power by up to 32% when compared with the crossbar-switch based interconnection network.

• Journal of Electrical Engineering and Technology
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• v.4 no.1
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• pp.35-42
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• 2009

When two adjacent AC systems operate at different frequency such as 50Hz and 60Hz, as in the case of ROK and Russia, the only way to practically obtain the advantages of power system interconnection is to use HVDC connection. In this paper, application of the VSC-HVDC transmission for power system interconnection between Russia and ROK is evaluated through the PSCAD/EMTDC modeling and analysis. The simulation results show the feasibility of proposed system for cross border power system interconnection.

• Journal of Power Electronics
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• v.10 no.1
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• pp.97-105
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• 2010

This paper presents the modeling, control and simulation of an interconnection system (ICS) of cascaded distributed generation (DG) modules for both grid-tied and stand-alone operations. The overall configuration of the interconnection system is given. The interconnection system consists of a cascaded DC/DC boost converters and a DC/AC inverter. Detailed modeling of the interconnection system incorporating a cascaded architecture has not been considered in previous research. In this paper, suitable control systems for the cascaded architecture of power electronic converters in an interconnection system have been studied and modeled in detail. A novel control system for DC/DC boost converters is presented based on a droop voltage controller. Also, a novel control strategy for DC/AC inverters based on the average large signal model to control the aggregated DG modules under both grid-tied and stand-alone modes is demonstrated. Simulation results indicate the effectiveness of the proposed control systems.

• Journal of Korea Technology Innovation Society
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• v.14 no.3
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• pp.622-646
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• 2011

This paper analyses the effects of mobile telecommunications market's interconnection charge on consumer welfare between 2000 and 2010 by estimating price elasticity of demand with using log linear model and augmented Alexander et al(2000)'s model. The results show that consumer welfare is about 6 trillion won in 2009 and an upward trend. In the 2nd analysis, the decline in interconnection charge raise consumer welfare but, asymmetric interconnection and current TD-BU LRIC system have negative(-) relation with consumer welfare. Hence we need to revise interconnection policy frame.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.123-127
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• 2009

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).

• Journal of Internet Computing and Services
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• v.21 no.5
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• pp.9-20
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• 2020

This study redefines the networks' connection behaviors and the terms confusion over the settlement in Netflix-SK Broadband's dispute through domestic and foreign legal references. Conflict parties, academics and the media use the terms "interconnection fee" or "Access fee" without uniformity, and in some cases mixes for strategic purposes. The use of different terms for the same phenomenon (or vice versa) has a high need for research in that it makes it difficult to reach a unified approach to the problem, to discuss it productively and rationally, and, moreover, to resolve disputes. Therefore, this study cross-referenced/analyzed terms related to network utilization and connectivity, namely "Use", "Access", "Interconnection" and thus cost-related terms as a counter-pay. In addition, it suggests that interconnection fees and access fees should be used separately, and allows them to function as a starting point in resolving future ICT sector issues. As a result of this study, the price against the network access/use between Netflix and SK Broadband is access fee or retail price, and proposes to be used uniformly in the term "interconnection fee" only for fees incurred in interconnection between ISPs that possess or operate networks.

• Proceedings of the Korea Contents Association Conference
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• 2009.05a
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• pp.45-50
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• 2009

The educational exchange through e-learning is working very well in such case as develop e-learning, development of various learning tools, cooperative practical use of e-learning contents, etc. However because there were no considerations of LMS(Learning Management System) interconnection when each systems were developed, the exchange through e-learning is starting to raise a problem. Especially the exchange through e-learning between university produced problem for a variety of reasons by absence of direct exchange in every case such as communication of students information, communication of lecture information, etc. Hence in this thesis, I will present designed model about efficient LMS interconnection through analysis case of exchange through e-learning and deduce problem. In the first place I define essential part for study such as lecture establishment data, lecture data, user data, class data, student learning tracking to interconnection data, then constituted data interconnection table used view by data interconnection prcess. By experiment result, the accessibility between students and professors was more convenience, and decreased work process by less data exchange. Henceforth there are researches in development of various essential parts for study, considered security of LMS interconnection.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.63-69
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• 2007

We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.