• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Structural Engineering and Mechanics
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• v.18 no.3
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• pp.315-330
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• 2004

A four-point bending RC beam strengthened with FRP plate is investigated based on the theory of elasticity. Taking the adhesive layer into account but ignoring some secondary parameters, the analytical solutions of the normal stress and shear stress on concrete-adhesive interface are obtained and discussed. Besides, the pure bending region of the beam is analyzed and the ultimate load of the beam is predicted. The results obtained in the present paper agree very well with both the results of FEM and the experimental findings.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.

• Restorative Dentistry and Endodontics
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• v.46 no.2
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• pp.30.1-30.13
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• 2021

Objectives: This study was conducted to compare the microleakage and characteristics of the resin-tooth tissue interface between self-etch and etch-and-rinse adhesive systems after 48 hours and 3 months. Materials and Methods: 40 extracted premolar teeth were randomly divided into 2 groups: 1-step self-etch adhesive system - Optibond^TM All-In-One, and 2-step etch-and-rinse adhesive system - Adper^TM Single Bond 2. Both groups were subjected to 500 thermocycles (5℃-55℃) before scanning electron microscope (SEM) analysis or microleakage trial at 48-hour and 3-month time periods. Results: SEM images showed the hybrid layer thickness, diameter, and length of resin tags of the self-etch adhesive (0.42 ± 0.14 ㎛; 1.49 ± 0.45 ㎛; 16.35 ± 14.26 ㎛) were smaller than those of the etch-and-rinse adhesive (4.39 ± 1.52 ㎛; 3.49 ± 1 ㎛; 52.81 ± 35.81 ㎛). In dentin, the microleakage scores of the 2 adhesives were not different in both time periods (48 hours/3 months). However, the microleakage score of etch-and-rinse adhesive increased significantly after 3 months (0.8 ± 0.63 and 1.9 ± 0.88, p < 0.05). Conclusions: The self-etch adhesive exhibited better long-term sealing ability in dentin when compared to that of the etch-and-rinse adhesive. The greater hybrid layer thickness and dimensions of resin tags did not guarantee reliable, long-lasting sealing in the bonding area.

• Journal of Adhesion and Interface
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• v.4 no.2
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• pp.21-29
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• 2003

Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

• Journal of the Korean institute of surface engineering
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• v.22 no.4
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• pp.185-196
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• 1989

The surface modification of a mild and stainless steel by alumina sprayed coating were studied. The effects of surface roughness and bond coating layer on the adhesive strengthy and durability of sprayed specimens were also investiated. The adhesive strength of ceramic coating was affected by surface roughness and bond coating layer thinkness. That showed excellent undergrit blast time and bond coating layer; 60 sec and 0.15-0.33mm, respectively. The adhesive strength and densification of sprayed coating with air pressure were superior to those of without and fracture was mainly occured at alumina-bond coating interface. Under ambient atmosphere at $800^{\circ}C$, the oxides existed within bond coating layer promote diffusion of oxygen to lower durability of sprayed specimens. In this case, fracure was occured at sudstrate-bond coating interface.

• Structural Engineering and Mechanics
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• v.57 no.2
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• pp.295-313
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• 2016

In this study, the three-dimensional finite element method is used to determine the stress intensity factor in Mode I and Mixed mode of a centered crack in an aluminum specimen repaired by a composite patch using contour integral. Various mesh densities were used to achieve convergence of the results. The effect of adhesive joint thickness, patch thickness, patch-specimen interface and layer sequence on the SIF was highlighted. The results obtained show that the patch-specimen contact surface is the best indicator of the deceleration of crack propagation, and hence of SIF reduction. Thus, the reduction in rigidity of the patch especially at adhesive layer-patch interface, allows the lowering of shear and normal stresses in the adhesive joint. The choice of the orientation of the adhesive layer-patch contact is important in the evolution of the shear and peel stresses. The patch will be more beneficial and effective while using the cross-layer on the contact surface.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.13 no.1
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• pp.97-103
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• 2000

This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.

• Computational Structural Engineering
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• v.10 no.2
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• pp.131-138
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• 1997

This paper concerns the stress singularity at the interface corner of the viscoelastic adhesive layer bonded between rigid adherends, subjected to a uniform transverse tensile strain. The characteristic equation is derived in the Laplace transformed space, following Williams, and the transformed characteristic equation is inverted analytically into real time space for the viscoelastic model considered here. The order of the singularity is obtained numerically. The time-domain boundary element method is employed to investigate the nature of stresses along the interface. Numerical results show that the order of the singularity increases with time while the free-edge stress intensity factors are relaxed with time.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2012.05a
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• pp.230-237
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• 2012

The ultrasonic resonance method was applied to detect the disbond interface and empty layer between steel and FRP of the exit cone. The ultrasonic resonance method can easily detect the disbond interface and empty layer by amplifying the ultrasonic signal, but pulse echo method is difficult to distinguish adhesive interface from disbond interface or empty layer. The resonance frequency was predicted using the pressure reflection coefficient of 3-layered medium, and measured from ultrasonic signal of the test block using Fast Fourier Transform. The ultrasonic resonance proved that the predicted resonance frequency was in good agreement with the measured resonance frequency.