• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.10 s.181
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• pp.2461-2468
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• 2000

In this paper, single fiber pull-out test is used to measure the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory alloy composite with temperature. Fiber and matrix of $Ti_{50}-Ni_{50}$ shape memory alloy composite are respectively $Ti_{50}-Ni_{50}$ shape memory alloy and epoxy resin. To strengthen the interfacial bonding shear stress, various surface treatments are used. They are the hand-sanded surface treatment, the acid etched surface treatment and the silane coupled surface treatment etc.. The interfacial bonding shear strength of surface treated shape memory alloy fiber is greater than that of surface untreated shape memory alloy fiber by from 10% to 16%. It is assured that the hand-sanded surface treatment and the acid etched surface treatment are the best way to strengthen the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory composite. The best treatment condition of surface is 10% HNO$_3$ solution in the etching method to strengthen the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory alloy composite.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.6
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• pp.1187-1193
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• 2002

Anodic bonding process has been quantitatively evaluated based on the Taguchi analysis of the interfacial fracture toughness, measured at the interface of anodically bonded silicon-glass bimorphs. A new test specimen with a pre-inserted blade has been devised for interfacial fracture toughness measurement. A set of 81 different anodic bonding conditions has been generated based on the three different conditions for four different process parameters of bonding load, bonding temperature, anodic voltage and voltage supply time. Taguchi method has been used to reduce the number of experiments required for the bonding strength evaluation, thus obtaining nine independent cases out of the 81 possible combinations. The interfacial fracture toughness has been measured for the nine cases in the range of 0.03∼6.12 J/㎡. Among the four process parameters, the bonding temperature causes the most dominant influence to the bonding strength with the influence factor of 67.7%. The influence factors of other process parameters, such as anodic voltage and voltage supply time, bonding load, are evaluated as 18%, 12% and 2.3%, respectively. The maximum bonding strength of 7.23 J/㎡ has been achieved at the bonding temperature of 460$\^{C}$ with the bonding load of 45gf/㎠, the applied voltage of 600v and the voltage supply time of 25minites.

• Composites Research
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• v.31 no.6
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• pp.299-303
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• 2018

In order to improve the interfacial bonding force and reaction polymerization degree of the carbon fiber reinforced nylon 6 composite material, the surface of the existing epoxy-sizing carbon fiber was desized to remove the epoxy and treated with urethane, nylon and phenoxy sizing agent, was observed. The interfacial bond strength of the resized carbon fiber was confirmed by IFSS (Interfacial Shear Strength) and the fracture surface was observed by scanning electron microscope. The results showed that the interfacial bonding strength of the carbon fiber treated with nylon and phenoxy sizing agents was higher than that of urethane - based sizing. It has been found that the urethane - type resizing carbon fiber has lower interfacial bonding strength than the conventional epoxy - sizing carbon fiber. This result shows that the interfacial bonding between carbon fiber and nylon 6 is improved by removing low activity and smoothness of existing carbon fiber.

• Korean Journal of Materials Research
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• v.12 no.10
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• pp.820-824
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• 2002

It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

• Transactions of Materials Processing
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• v.27 no.5
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• pp.267-275
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• 2018

The clad sheet material is produced by a roll-bonding process of one or more materials with different properties. Good formability of clad sheet material is an essential property in to deform a clad metal sheet into a part or component. Performance of the clad sheet material largely depends on interfacial bond strength between different materials. In this study, interfacial bond strength of STS/Al clad sheet was analyzed by varying experimental parameters using a blanking process. Experimental parameters are the punching speed, clearance, and stacking order of plate materials. In addition, blanking test results were compared with bond strengths measured by the T-peel test, that analyzes interface bonding strength of the standard clad sheet. The blanking process was analyzed by the finite element method under the sticking condition of interface of different materials, and experimental results and analysis results were compared.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1359-1360
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• 2011

• Journal of Technologic Dentistry
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• v.24 no.1
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• pp.65-71
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• 2002

This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker's hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

• Journal of Technologic Dentistry
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• v.23 no.1
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• pp.31-43
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• 2001

This study was performed to observe the micro-structure change of surface, behavior of oxide change of element, the component transformation of the alloy and the bonding strength between the porcelain interface in order to investigate effects of indium, tin on interfacial properties of porcelain fused to low gold alloy. Hardness of castings was measured with a micro-Vicker's hardness tester. The compositional change of the surface of heat-treated specimen was analyzed with an EDS and an EPMA. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The results were as follows: 1) The hardness value of alloy increased as increasing amount of indium addition. 2) The formation of oxidation increased as increasing indium and tin contents after heat treatment. 3) Diffusion of indium and tin elements increased as increasing indium and tin contents in metal-porcelain surface after porcelain fused to metal firing. 4) The most interfacial shear bonding strength was increased as increasing a composition of adding elements, and a heat-treatment time, and an oxygen partial pressure. From the results of this study it was found that the addition of alloying elements such as indium and tin increase hardness of as-cast alloy, produce surface oxide layer of adding elements by heat-treatment which may improve interfacial bonding strength between alloy and porcelain.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.7
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• pp.1132-1137
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• 2003

This study dealt with the suppression of interfacial reaction between Nb and MoSi$_2$ for the fabrication of high toughness Nb/MoSi$_2$ laminate composites, based on the results of a thermodynamical estimation. Especially, the effect of ZrO$_2$ particle on the interfacial reaction of Nb/MoSi$_2$ bonding materials has been examined. Nb/MoSi$_2$ bonding materials have been successfully fabricated by alternatively stacking matrix mixtures and Nb sheets and hot pressing in the graphite mould. The addition of ZrO$_2$ particle to MoSi$_2$ matrix is obviously effective for promoting both the interfacial reaction suppression and the sintered density of Nb/MoSi$_2$ bonding materials, since it is caused by the formation of ZrSiO$_4$ in the MoSi$_2$-ZrO$_2$ matrix mixture. The interfacial shear strength of Nb/MoSi$_2$ bonding materials also decreases with the reduction of interfacial reaction layer associated with the content of ZrO$_2$ particle and the fabrication temperature.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1197-1201
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• 1994

The fracture strength and fracture modes were studied in 3Y-TZP/NiNi bonding which change their interfacial structure with bonding condition. Average 4-point bending strength of 200 MPa to 400 MPa were achieved. The formation of Ti-oxide phase at the interface critically influenced the bonding strength and fracture mode. The fracture surface of Ti-oxide free interface contained multiphase in some case including ZrO2. From the result it was confirmed that in order to maximize the bonding strength crack deflection from interface to ceramic was required.