• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2174-2183
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• 2000

In this paper, the evaluation method of interfacial fracture toughness to apply the fracture toughness was investigated in adhesively bonded joints of AI/Ced./A1. Four types of adhesively bonded double-cantilever beam(DCB) joints with the interface crack were prepared for the test of interfacial fracture toughness. The experiments to measure the interfacial fracture toughness were performed under the various mixed-mode conditions. The critical energy release rate, Gc, was obtained by the experimental measurement of compliances. From the experimental results, the interfacial fracture toughness for the mixed-mode specimens is well characterized by the energy release rate, and the method of strength evaluation by the interfacial fracture toughness was discussed in adhesively bonded joints.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.199-202
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• 2002

Interfacial properties and electrical sensing for fiber fracture in carbon and SiC fibers/epoxy composites were investigated by the electrical resistance measurement and fragmentation test. As fiber-embedded angle increased, interfacial shear strength (IFSS) of two-type fiber composites decreased, and the elapsed time was long to the infinity in electrical resistivity. The initial slope of electrical resistivity increased rapidly to the infinity at higher angle, whereas electrical resistivity increased gradually at small angle. Furthermore, both fiber composites with small embedded angle showed a fully-developed stress whitening pattern, whereas both composites with higher embedded angle exhibited a less developed stress whitening pattern. As embedded angle decreased, the gap between the fragments increased and the debonded length was wider for both fiber composites. Electro-micromechanical technique can be a feasible nondestructive evaluation to measure interfacial sensing properties depending on the fiber-embedded angle in conductive fiber reinforced composites.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.220-226
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• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.42-45
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• 2005

Interfacial evaluation of various combinations of both Flax and Hemp fibers/polypropylene were performed by using micromechanical test and nondestructive acoustic emission (AE). It can be because interfacial adhesion between the natural fiber surface and matrix plays an important role in controlling the overall mechanical properties of polymer composite materials by transferring the stress from the matrix to the fiber. It is necessary to characterize the interphase and the level of adhesion to understand the performance of the composites properly. Microfailure mechanism of single Flax fiber bundles were investigated using the combination of single fiber tensile test and nondestructive acoustic emission. Microfailure modes of the different natural fiber/polypropylene systems were observed using optical microscope and determined indirectly by AE and their FFT analysis.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.141-144
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• 2005

Sensing and interfacial evaluation of Ni nanowire strands/polymer composites were investigated using Electro-micromechanical technique. Electro-micromechanical techniques can be used as sensing method for micro damage, loading, temperature of interfacial properties. Using Ni nanowire strands/silicone composites with different content, load sensing response of electrical contact resistivity was investigated under tensile and compression condition. The mechanical properties of Ni nanowire strands with different type/epoxy composites were measured using uniformed cyclic loading and tensile test. Ni nanowire strands/epoxy composites showed humidity and temperature sensing within limited ranges, 20 vol% reinforcement. Some new information on temperature and humidity sensing plus loading sensing of Ni nanowire strands/polymer composites could be obtained from the electrical resistance measurement as a new concept of the nondestructive interfacial evaluation.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.36-41
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• 2004

A method to measure the interfacial toughness of film/substrate by nanoindenter is proposed. As the thickness of the film decreases, the measurement of the interfacial toughness requires the more sophisticated equipment such as nanoindenter. In this study, the nanoindenter is applied to the substrate near the interface of film/substrate in the direction perpendicular to the normal of the interface, causing the cohesive fracture of the substrate, followed by the interfacial cracking. The specimen of Cu($0.56 {\mu}m$)/Si(530 ${\mu}$) are made by sputtering the copper onto the silicon wafer. By scratching the copper surface, we can make the easy interfacial cracking during the nanoindentation. It is found that the averaged values of the interfacial toughness of the Cu/Si is $0.664{\pm}0.3\;J/m^2$ . The phase angle of the specimen in this study is ${\psi}{\simeq}-36.8^{\circ}$, computed by the method of Suo and Hutchinson.[1]

• Polymer(Korea)
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• v.27 no.3
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• pp.189-194
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• 2003

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermo setting composite with different curing processes were investigated using electro-micromechanical test. After curing, the residual stress was monitored by measurement of electrical resistance and then compared to various curing processes. In thermal curing case, matrix tensile strength, modulus and interfacial shear strength were higher than those of ultraviolet curing case. The shrinkage measured during thermal curing occurred significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient. The apparent modulus measured in the thermal curing indicated that mechanical and interfacial properties were highly improved. The reaching time to the same stress of thermal curing was faster than that of UV curing case.

• Composites Research
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• v.12 no.2
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• pp.10-25
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• 1999

A new evaluation method for the interfacial properties of fibrous composites based on a fragmentation technique is proposed by using the gradual multi-fiber composite, in which the inter-fiber spacing is gradually changed. The results showed that as the inter-fiber distance increased, the aspect ratio of broken fibers decreased while the interfacial shear strength between the fiber and matrix increased. When the reciprocal of the inter-fiber destance was taken for the above relations, both the aspect ratio and interfacial shear strength showed a saturated value. This means that the gradual multi-fiber composite indicates an upper bound in aspect ratio and an upper bound in interfacial shear strength. It was concluded that this fragmentation test could be a new method for composite evaluation, since reducing a difference between these two bounds is effective for composite strengthening. In addition an elastoplastic finite element analysis was carried out to relate the above results with fiber stress a distribution around fiber breaks. It was proved that the bound obtained in the gradual multi-fiber composite test is closely related to stress concentrations caused by a group of multi-fiber breaks.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.6
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• pp.504-511
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• 2008

This paper proposes an ultrasonic measurement method for measurement of linear interfacial stiffness of contacting surface between two steel plates subjected to nominal compression pressures. Interfacial stiffness was evaluated by using shear waves reflected at contact interface of two identical solid plates. Three consecutive reflection waves from solid-solid surface are captured by pulse-echo method to evaluate the state of contact interface. A non-dimensional parameter defined as the ratio of their peak-to-peak amplitudes are formulated and used to calculate the quantitative stiffness of interface. Mathematical model for 1-D wave propagation across interfaces is developed to formulate the reflection and transmission waves across the interface and to determine the interfacial stiffness. Two identical plates are fabricated and assembled to form contacting surface and to measure interfacial stiffness at different states of contact pressure by means of bolt fastening. It is found from experiment that the amplitude of interfacial stiffness is dependent on the pressure and successfully determined by employing pulse-echo ultrasonic method without measuring through-transmission waves.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.6
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• pp.1187-1193
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• 2002

Anodic bonding process has been quantitatively evaluated based on the Taguchi analysis of the interfacial fracture toughness, measured at the interface of anodically bonded silicon-glass bimorphs. A new test specimen with a pre-inserted blade has been devised for interfacial fracture toughness measurement. A set of 81 different anodic bonding conditions has been generated based on the three different conditions for four different process parameters of bonding load, bonding temperature, anodic voltage and voltage supply time. Taguchi method has been used to reduce the number of experiments required for the bonding strength evaluation, thus obtaining nine independent cases out of the 81 possible combinations. The interfacial fracture toughness has been measured for the nine cases in the range of 0.03∼6.12 J/㎡. Among the four process parameters, the bonding temperature causes the most dominant influence to the bonding strength with the influence factor of 67.7%. The influence factors of other process parameters, such as anodic voltage and voltage supply time, bonding load, are evaluated as 18%, 12% and 2.3%, respectively. The maximum bonding strength of 7.23 J/㎡ has been achieved at the bonding temperature of 460$\^{C}$ with the bonding load of 45gf/㎠, the applied voltage of 600v and the voltage supply time of 25minites.