• Journal of Sensor Science and Technology
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• v.31 no.1
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• Journal of Software Assessment and Valuation
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• v.17 no.1
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• pp.11-16
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• 2021

The importance of software is increasing due to the development of information and communication, and software copyright disputes are also increasing. In this paper, the source of the submitted programs and the files necessary for the execution of the program were taken as the scope of analysis. The large-capacity file transfer solution program to be analyzed provides additional functions such as confidentiality, integrity, user authentication, and non-repudiation functions through digital signature and encryption of data.In this paper, we analyze the program A, program B, and the program C. In order to calculate the program similarity rate, the following contents are analyzed. Analyze the similarity of the package structure, package name, source file name in each package, variable name in source file, function name, function implementation source code, and product environment variable information. It also calculates the overall similarity rate of the program. In order to check the degree of agreement between the package structure and the package name, the similarity was determined by comparing the folder structure. It also analyzes the extent to which the package structure and package name match and the extent to which the source file (class) name within each package matches.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.650-654
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• 1997

This paper presents the experimental results of air pressure analysis around a high speed and large package pirn. The experimental system is constructed to measure around air pressure of a rotating pirn in highspeed. The experiment is carred out for the varios speeds. The results that, air pressure around rotating pirn increases as the speed increase, air prissure on the midle of the prin is larger than that on the both ends, and the force direction is opposite to the rotation dirction. The present results a useful to design the high speed, large package pirn winder.

• Plant Journal
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• v.6 no.3
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• pp.40-45
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• 2010

Necessity to install control towers has been studied to acquire overseas energy resources and to secure funds. At present, domestic energy companies do business independently. Institutions which support plant EPC companies as partners of package deal are separated. This causes the low records at package deal for overseas resources acquisition. Except UK and USA, nations which have major companies developed overseas energy resources early by promoting a large national company. Consequently, they currently have good records. This study suggests the necessities to install integrated control tower for overseas energy resources acquisition and securing funds and the following are the ways ; 1) promote a large national company by consolidation of separate energy companies, 2) install plant EPC promotion department which support private plant EPC companies, 3) make a integrated control tower in high level government office to connect between a large national company and plant EPC promotion department.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.57-60
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• 2015

Electric power in large devices is controlled by digital circuits, such as switching mode power supply. This kind of power circuits require accurate current sensor for power distribution. We studied characteristics of shunt resistor, which has many advantages for commercial application compared to Hall-effect current sensor. We applied ceramic package to the shunt resistor. Ceramic package has good thermal conductivity compared to plastic package, and this point is important for space requirement in Printed Circuit Board (PCB). Another advantage of the ceramic package is that surface mount technology (SMT) can be used for production. Our experimental results showed that the ceramic packaged resistor showed about 50% lower temperature than the plastic packaged one. Burning point and frequency characteristics are also discussed.

• Korean Journal of Agricultural Science
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• v.39 no.1
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• pp.151-159
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• 2012

This paper analyzes the consumers' preference for packaged apple and derives the measures to vitalize the distribution of packaged apple. To do this, survey was conducted for consumers in large cities, Seoul, Busan, and Daegu to observe their purchasing behavior and satisfaction both for packaged and unpackaged apple. Survey was focused to how they are satisfied with several attributes of package such as size, appearance, content, material, and label. On the basis of the survey results, the values of the package attributes were estimated. Survey results show that consumers tend to buy unpackaged apple rather than packaged apple. About 34 percent out of 313 respondents have ever purchased apple packed with paper box while only 10.5 percent have an experience to buy packaged apple with transparent box. Most respondents answered they preferred the package of five to six apples and 1.3 kilograms most. They preferred mid or large size apple. Estimation of the values of the package attributes using the conjoint analysis shows that consumers are giving the highest value to the price of packing material. It means that consumers are reluctant to the extra payment resulted from packing the apple. Therefore, the efforts to reduce the cost of packing apple should be made steadily. In order to vitalize the distribution of small packaged apple, the package should contain high quality apple with high sugar content, proper size, good appearance, and so on. And it needs to be promoted to the consumers that small packaged apple are not inferior to apple packed with paper box.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.2
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• pp.128-135
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• 2004

Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 ％.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.53 no.2
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• pp.111-120
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• 2004

This paper presents an application of Unified Modeling Language(UML) software technique for developing transmission pricing evaluation package. Also, this paper describes a transmission pricing algorithm applicable to a large-scale power system. The usage-based transmission pricing mechanism is very complex since it requires power flow analysis, fault current analysis, sensitivity evaluation of a transmission line, penalty factors calculation, transmission asset databases, and cost allocation rules, etc. For the efficient and flexible development of the transmission pricing package, a UML. approach is applied, which is composed of a use-case diagram, interaction diagram, class diagram, and package diagram using Rational Rose Unified Process(RUP). The designed transmission pricing package can be efficiently modified and reused as the market environments evolves since it is designed by Object-Oriented Programming(OOP).