• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.10 s.181
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• pp.2461-2468
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• 2000

In this paper, single fiber pull-out test is used to measure the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory alloy composite with temperature. Fiber and matrix of $Ti_{50}-Ni_{50}$ shape memory alloy composite are respectively $Ti_{50}-Ni_{50}$ shape memory alloy and epoxy resin. To strengthen the interfacial bonding shear stress, various surface treatments are used. They are the hand-sanded surface treatment, the acid etched surface treatment and the silane coupled surface treatment etc.. The interfacial bonding shear strength of surface treated shape memory alloy fiber is greater than that of surface untreated shape memory alloy fiber by from 10% to 16%. It is assured that the hand-sanded surface treatment and the acid etched surface treatment are the best way to strengthen the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory composite. The best treatment condition of surface is 10% HNO$_3$ solution in the etching method to strengthen the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory alloy composite.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.49-54
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• 2007

Electropolishing, the anodic dissolution process without contact with tools, is a surface treatment method to make a surface planarization using an electrochemical reaction with low current density. Nitinol is a metal alloy composed of Ni and Ti around 50% respectively which has shape memory effect. Nitinol can be put various applications which require purity and high pricision surface of products. The aim of this study is to investigate the characteristic of electropolishing effect for nitinol workpieces. In order to analyze the characteristics of electropolishing effect, surface roughness and micro-burr size were measured in terms of machining conditions such as current density, machining time and electrode gap. The tendencies about improvement of surface roughness and deburring effect by electropolishing for nitinol workpieces were determined.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.881-886
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• 2009

Research into the replacement of injured systems and tissue in the human body is advancing rapidly. Recently, Ti-Ni shape memory alloys have shown excellent biofunctionality related to their shape memory effect and superelasticity. In this study, the effect of an acid or an alkali treatment on the bioactivity in 49Ti-Ni and 51.5Ti-48.5Ni alloys is investigated in an effort to utilize Ti-Ni alloy as a biomaterial. In addition, the biocompatibility in a SBF solution is assessed through in vitro testing. A porous surface was formed on the surface of both alloys after a chemical treatment. According to the in vitro test, apatite formed on the surfaces of both alloys. The forming rate of apatite in the Ti-rich alloy was faster that in the Ni-rich alloy. The formation of apatite provided proof of the bioactivity of the Ti-Ni alloy. A small quantity of Ni was eluted at the initial stage, whereas Ni was not found for 12 days in the Ti-rich alloy and for 8 days in the Ni-rich alloy. In the case of the treated 51.5Ti-Ni alloy, the shape memory property was worsened but the biocompatibility was improved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Electrical & Electronic Materials
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• v.10 no.9
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• pp.876-880
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• 1997

In this paper we investigated the transcription of liquid crystal (LC) alignment method by using memory effect of nematic(N) LCon polymide(PI) surface with side chain as for non-rubbing alignment techniques. That the monodomain alignment of aligned NLC is observed by microscope textures in the cells on PI surface with side chain. We obtained that the pretilt angle of NLC are generated about 3.7$^{\circ}$on PI surface. We suggest that the LC alignment by using transcription alingnment method is attributed to memory effect of NLC on PI surface.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.43-49
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• 2003

In this study, micro electrochemical machining method was introduced for accomplishment the fabrication technology of functional parts and smart structures using the Ni-Ti shape memory alloy. From the experimental result, the micro part which has very fine surface could be achieved by use of micro electrochemical process with point electrode method. Concretely, the optimal performance of micro electrochemical process in Ni-Ti SMA was obtained at the condition of approximately 100% of current efficiency and high frequency pulse current. That is, much finer surface integrity and shape memory effect can be obtained at the same condition mentioned above.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.424-429
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• 1996

Thin films of Ti-Ni alloy were formed by sputtering under various Ar gas pressures and r. f. powers to investigate the optimum sputtering conditions and to demonstrate their shape memory effect. The composition and structure of the films were examined by electron micro-probe analysis and scanning electron microscope. These films were annealed in order to crystallize them. The mechanical property of the annealed films was evaluated by a conventional bending test. The transformation tmeperatures were determined by differential scanning calorimetry. The shape memory behaviour was examined quantiatatively by changing in sample temperature under various constant loads. It was found that the Ar gas pressure had a critical effect on the mechanical property of the thin film,s although the r.f. power also affected it. The films formed at a high Ar gas pressure were too brittle to be bent successfully. However, the films formed at a low Ar gas pressur could be bent and their shape memory behavior was found to be comparable with that of bulk Ti-Ni alloys.

• Steel and Composite Structures
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• v.38 no.4
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• pp.447-462
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• 2021

In this work, we consider a problem in the context of thermoelectric materials with memory-dependent derivative for a half space which is assumed to have variable thermal conductivity depending on the temperature. The Lamé's modulii of the half space material is taken as a function of the vertical distance from the surface of the medium. The surface is traction free and subjected to a time dependent thermal shock. The problem was solved by using the Laplace transform method together with the perturbation technique. The obtained results are discussed and compared with the solution when Lamé's modulii are constants. Numerical results are computed and represented graphically for the temperature, displacement and stress distributions. Affectability investigation is performed to explore the thermal impacts of a kernel function and a time-delay parameter that are characteristic of memory dependent derivative heat transfer in the behavior of tissue temperature. The correlations are made with the results obtained in the case of the absence of memory-dependent derivative parameters.

• Polymer Science and Technology
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• v.17 no.2
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• pp.182-190
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• 2006

• The Journal of the Acoustical Society of Korea
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• v.3 no.2
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• pp.13-22
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• 1984

A surface acoustic wave signal processing device using the silicon surface state is presented and shown capable of storing a reference signal and later correlating another signal with the stored reference. The device memory consists of the storage of the spatial 2k pattern of an acoustic wave as stored charges in the surface state of silicon surface. Results of experiments are presented which characterize the operation of device. Simpliied models for charging process and nonlinear acoustoelectric interactions based on consideration of single surface state at the surface of silicon The validity of simplified model has been qualitatibely confirmed with experimental results and the application of this device to aprogrammable matched filter of communication is considered.