• Title/Summary/Keyword: microstructure

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Microfracture Mechanism of Squeeze Cast AZ51-xSn Magnesium Alloys (용탕단조법으로 제조된 AZ51-xSn 마그네슘 합금의 미세파괴기구)

  • Kim, Byeong Ho;Do, Jeonghyeon;Lee, Sunghak;Park, Ikmin
    • Korean Journal of Metals and Materials
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    • v.47 no.12
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    • pp.797-810
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    • 2009
  • A study was made of the effects of a Sn addition on the microstructure and microfracture mechanism of squeeze cast AZ51-xSn magnesium alloys. Microstructural observation, in situ fracture testing, and fractographic observations were conducted on these alloys to clarify the microfracture process. The microstructural analyses indicated that $Mg_2Sn$ particles as well as $Mg_{17}Al_{12}$ particles precipitated mainly along the solidification cell boundaries; the volume fraction of these hard particles increased as the amount of added Sn increased, with increased the strength. From in situ fracture observations of the AZ51-7Sn alloy, coarse precipitates located on the cell boundaries worked as easy crack propagation sites and caused abrupt intercellular fracturing. On the other hand, the overall fracture properties of the AZ51-3Sn alloy improved because crack propagation proceeded into the Mg matrix rather than into the cell boundaries as twins developed actively, as confirmed by an R-curve analysis. These findings suggest that the addition of 3~5 wt.% Sn is effective in improving both the tensile and fracture properties on the basis of well-developed twins, the blocking of crack propagation, and crack blunting.

Property of Nano-thick Silicon Films Fabricated by Low Temperature Inductively Coupled Plasma Chemical Vapor Deposition Process (저온 ICP-CVD 공정으로 제조된 나노급 실리콘 박막의 물성)

  • Shen, Yun;Sim, Gapseop;Choi, Yongyoon;Song, Ohsung
    • Korean Journal of Metals and Materials
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    • v.49 no.4
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    • pp.313-320
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    • 2011
  • 100 nm-thick hydrogenated amorphous silicon $({\alpha}-Si:H)$ films were deposited on a glass and glass/30 nm Ni substrates by inductively-coupled plasma chemical vapor deposition (ICP-CVD) at temperatures ranging from 100 to $550^{\circ}C$. The sheet resistance, microstructure, phase transformation and surface roughness of the films were characterized using a four-point probe, AFM (atomic force microscope), TEM (transmission electron microscope), AES (Auger electron spectroscopy), HR-XRD(high resolution X-ray diffraction), and micro-Raman spectroscopy. A nano-thick NiSi phase was formed at substrate temperatures >$400^{\circ}C$. AFM confirmed that the surface roughness did not change as the substrate temperature increased, but it increased abruptly to 6.6 nm above $400^{\circ}C$ on the glass/30 nm Ni substrates. HR-XRD and micro-Raman spectroscopy showed that all the Si samples were amorphous on the glass substrates, whereas crystalline silicon appeared at $550^{\circ}C$ on the glass/30 nm Ni substrates. These results show that crystalline NiSi and Si can be prepared simultaneously on Ni-inserted substrates.

Homogeneity of Microstructure and Mechanical Properties of Ultrafine Grained OFHC Cu Bars Processed by ECAP (ECAP 가공에 의해 제조된 초미세립 OFHC Cu 봉재의 미세조직 및 기계적 특성의 균질성)

  • Ji, Jung Hoon;Park, Lee-Ju;Kim, Hyung Won;Hwang, Si Woo;Lee, Chong Soo;Park, Kyung Tae
    • Korean Journal of Metals and Materials
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    • v.49 no.6
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    • pp.474-487
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    • 2011
  • Bars of OFHC Cu with the diameter of 45 mm were processed by equal channel angular pressing up to 16 passes via route $B_c$, and homogeneity of their microstructures and mechanical properties was examined at every four passes which develop the equiaxed ultrafine grains. In general, overall hardness, yield strength and tensile strength increased by 3, 7, and 2 times respectively compared with those of unECAPed sample. Cross-sectional hardness exhibited a concentric distribution. Hardness was the highest at the center of bar and it decreased gradually from center to surface. After 16 passes, overall hardness decreased due to recovery and partial recrystallization. Regardless of the number of passage, yield strength and tensile strength were quite uniform at all positions, but elongation showed some degree of scattering. At 4 passes, coarse and ultrafine grains coexisted at all positions. After 4 passes, uniform equiaxed ultrafine grains were obtained at the center, while uniform elongated ultrafine grains were manifested at the upper half position. At the lower half position, grains were equiaxed but its size were inhomogeneous. It was found that inhomogeneity of grain morphology and grain size distribution at different positions are to be attributed to scattering in elongation but they did not affect strength. The present results reveal the high potential of practical application of equal channel angular pressing on fabrication of large-sized ultrafine grained bars with quite homogeneous mechanical properties.

Solidification and Segregation Behaviors with Solidification Rate in Co base superalloy, FSX-414 (일방향 응고된 Co기 초내열합금 FSX-414의 응고속도에 따른 응고조직 및 편석 거동)

  • Lee, Hyun-Jung;Lee, Je-Hyun;Seo, Seong-Moon;Jo, Chang-Young;Gwon, Seok-Hwan;Chang, Byeong-Moon
    • Korean Journal of Metals and Materials
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    • v.47 no.7
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    • pp.440-446
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    • 2009
  • Co base superalloys have been widely used for the parts of gas turbine due to their excellent strength, thermal fatigue, oxidation resistance and weldability at high temperature. In this study, directional solidifications were carried out at various solidification rates, including $0.5{\sim}300{\mu}m/s$ in the Co base superalloy FSX-414. The cellular interface were formed at a low solidification rate, $1{\mu}m/s$, and the dendritic interface was found at higher solidification rates, $5{\sim}300{\mu}m/s$. As the spacing of dendrite structure decreased, the size and spacing of eutectics decreased. Dendrite arm spacing decreased with increasing solidification rates and temperature gradient. It was interesting to find the $M_{23}C_{6}$ eutectic microstructure formed between $\gamma$ dendrites. Composition analysis showed that Cr and W were segregated severely between the dendrites, which resulted in the formation of Cr-rich $M_{23}C_{6}$ and W-rich MC carbides.

A Reduction Process of Palladium Oxide Thin Films and Hydrogen Gas Sensing Properties of Reduced Palladium Thin Films (PdO 박막의 환원과 환원된 Pd박막의 수소 감지 특성)

  • Lee, Young Tack;Kim, Yeon Ju;Lee, Jun Min;Joe, Jin Hyoun;Lee, Wooyoung
    • Korean Journal of Metals and Materials
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    • v.48 no.4
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    • pp.347-352
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    • 2010
  • This study reports a novel method off abricating highly sensitive hydrogen gas sensors based on PdO thin films. The PdO thin films with a thickness of 40 nm were deposited on Si substrates under Ar and $O_2$ ambient conditions using a reactive de magnetron sputtering system. Considerable changes in the resistance of the palladium oxide thin films were observed when they were initially exposed to hydrogen gas, as a result of the reduction process. The sensitivity of the PdO thin films was found to be as high as 90%. After the thin films were exposed to hydrogen gas, the nano-sized cracks were discovered to have formed on the surface of the PdO thin films. These types of nano-cracks that formed on the deoxidized PdO thin films are known to play a key role incausing a four-fold reduction of the response time of the absorption process. The results of this study demonstrate that deoxidized PdO thin films can be applied for use in the creation of high-sensitivity hydrogen sensors.

Comparison of Microstructure & Mechanical Properties between Mn-Mo-Ni and Ni-Mo-Cr Low Alloy Steels for Reactor Pressure Vessels (원자로 압력용기용 Mn-Mo-Ni계 및 Ni-Mo-Cr계 저합금강의 미세조직과 기계적 특성 비교)

  • Kim, Min-Chul;Park, Sang Gyu;Lee, Bong-Sang
    • Korean Journal of Metals and Materials
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    • v.48 no.3
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    • pp.194-202
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    • 2010
  • Application of a stronger and more durable material for reactor pressure vessels (RPVs) might be an effective way to insure the integrity and increase the efficiency of nuclear power plants. A series of research projects to apply the SA508 Gr.4 steel in ASME code to RPVs are in progress because of its excellent strength and durability compared to commercial RPV steel (SA508 Gr.3 steel). In this study, the microstructural characteristics and mechanical properties of SA508 Gr.3 Mn-Mo-Ni low alloy steel and SA508 Gr.4N Ni-Mo-Cr low alloy steel were investigated. The differences in the stable phases between these two low alloy steels were evaluated by means of a thermodynamic calculation using ThermoCalc. They were then compared to microstructural features and correlated with mechanical properties. Mn-Mo-Ni low alloy steel shows the upper bainite structure that has coarse cementite in the lath boundaries. However, Ni-Mo-Cr low alloy steel shows the mixture of lower bainite and tempered martensite structure that homogeneously precipitates the small carbides such as $M_{23}C_6$ and $M_7C_3$ due to an increase of hardenability and Cr addition. In the mechanical properties, Ni-Mo-Cr low alloy steel has higher strength and toughness than Mn-Mo-Ni low alloy steel. Ni and Cr additions increase the strength by solid solution hardening. In addition, microstructural changes from upper bainite to tempered martensite improve the strength of the low alloy steel by grain refining effect, and the changes in the precipitation behavior by Cr addition improve the ductile-brittle transition behavior along with a toughening effect of Ni addition.

Effect of Powder Preheating Temperature on the Properties of Cu based Amorphous Coatings by Cold Spray Deposition (저온분사로 제조된 Cu계 비정질 코팅층 특성에 미치는 분말 예열 온도의 영향)

  • Cho, Jin-Hyeon;Park, Dong-Yong;Lee, Jin-Kyu;Lee, Kee-Ahn
    • Korean Journal of Metals and Materials
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    • v.47 no.11
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    • pp.728-733
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    • 2009
  • Cu based amorphous ($Cu_{54}Zr_{22}Ti_{18}Ni_{6}$) powders were deposited onto Al 6061 substrates by cold spray process with different powder preheating temperatures (below glass transition temperature: $350^{\circ}C$, near glass transition temperature: $430^{\circ}C$ and near crystallization temperature: $500^{\circ}C$). The microstructure and macroscopic properties (hardness, wear and corrosion) of Cu based amorphous coating layers were also investigated. X-ray diffraction results showed that cold sprayed Cu based amorphous coating layers of $300{\sim}350{\mu}m$ thickness could be well manufactured regardless of powder preheating temperature. Porosity measurements revealed that the coating layers of $430^{\circ}C$ and $500^{\circ}C$ preheating temperature conditions had lower porosity contents (0.88%, 0.93%) than that of the $350^{\circ}C$ preheating condition (4.87%). Hardness was measured as 374.8 Hv ($350^{\circ}C$), 436.3 Hv ($430^{\circ}C$) and 455.4 Hv ($500^{\circ}C$) for the Cu based amorphous coating layers, respectively. The results of the suga test for the wear resistance property also corresponded well to the hardness results. The critical anodic current density ($i_{c}$) according to powder preheating temperature conditions of $430^{\circ}C$, $500^{\circ}C$ was lower than that of the sample preheated at $350^{\circ}C$, respectively. The higher hardness, wear and corrosion resistances of the preheating conditions of near $T_{g}$ and $T_{x}$, compared to the properties of below $T_{g}$, could be well explained by the lower porosity of coating layer.

Dielectric properties and microstructures of (CaxSr1-x)ZrO3 ceramics

  • Li, Yu-De;Chen, Jian-Ming;Lee, Ying-Chieh
    • Journal of Ceramic Processing Research
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    • v.19 no.6
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    • pp.461-466
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    • 2018
  • The effects of Ca/Sr ratio and the sintering temperature on the properties of $(Ca_xSr_{(1-x)})ZrO_3$ (CSZ) ceramics were investigated in this study. CSZ ceramics were prepared using solid-state reaction process, which were sintered in air at temperatures ranging from $1350^{\circ}C$ to $1450^{\circ}C$. Their structures were characterized by X-ray Diffraction (XRD), Scanning Electron Microscopy (SEM), and Transmission Electron Microscopy (TEM). The change in Ca/Sr ratio significantly affected the crystalline phase and the dielectric properties of the $(Ca_xSr_{(1-x)})ZrO_3$ ceramics. The secondary phase, $Ca_{0.15}Zr_{0.85}O_{1.85}$, was observed and increased correspondingly with the rising of sintering temperatures. In order to understand the effects of secondary phase on the dielectric properties of CSZ ceramics, the $Ca_{0.15}Zr_{0.85}O_{1.85}$ phase was prepared individually using solidstate method. The $Ca_{0.15}Zr_{0.85}O_{1.85}$ ceramics sintered at $1500^{\circ}C$ for 2 hours possessed a dielectric constant (${\varepsilon}_r$) of 21.7, a dielectric loss ($tan{\delta}$) of $49.510^{-4}$ and an Insulation Resistance (IR) of $2.1{\times}10^{10}{\Omega}$. The ($Ca_{0.7}Sr_{0.3})ZrO_3$ ceramics exhibited the best dielectric properties, with a permittivity of 29, a dielectric loss ($tan{\delta}$) of $2.7{\times}10^{-4}$, and an Insulation Resistance (IR) of $2.6{\times}10^{12}{\Omega}$.

IR Absorption Property in NaNo-thick Nickel Cobalt Composite Silicides (나노급 두께의 Ni50Co50 복합 실리사이드의 적외선 흡수 특성 연구)

  • Song, Oh Sung;Kim, Jong Ryul;Choi, Young Youn
    • Korean Journal of Metals and Materials
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    • v.46 no.2
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    • pp.88-96
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    • 2008
  • Thermal evaporated 10 nm-$Ni_{50}Co_{50}$/(70 nm-poly)Si films were deposited to examine the energy saving properties of silicides formed by rapid thermal annealing at temperature ranging from 500 to $1,100^{\circ}C$ for 40 seconds. Thermal evaporated 10 nm-Ni/(70 nm-poly)Si films were also deposited as a reference using the same method for depositing the 10 nm-$Ni_{50}Co_{50}$/(70 nm-poly)Si films. A four-point probe was used to examine the sheet resistance. Transmission electron microscopy (TEM) and X-ray diffraction XRD were used to determine cross sectional microstructure and phase changes, respectively. UV-VIS-NIR and FT-IR (Fourier transform infrared spectroscopy) were used to examine the near-infrared (NIR) and middle-infrared (MIR) absorbance. TEM analysis confirmed that the uniform nickel-cobalt composite silicide layers approximately 21 to 55 nm in thickness had formed on the single and polycrystalline silicon substrates as well as on the 25 to 100 nm thick nickel silicide layers. In particular, nickel-cobalt composite silicides showed a low sheet resistance, even after rapid annealing at $1,100^{\circ}C$. Nickel-cobalt composite silicide and nickel silicide films on the single silicon substrates showed similar absorbance in the near-IR region, while those on the polycrystalline silicon substrates showed excellent absorbance until the 1,750 nm region. Silicides on polycrystalline substrates showed high absorbance in the middle IR region. Nickel-cobalt composite silicides on the poly-Si substrates annealed at $1,000^{\circ}C$ superior IR absorption on both NIR and MIR region. These results suggest that the newly proposed $Ni_{50}Co_{50}$ composite silicides may be suitable for applications of IR absorption coatings.

Interfacial Reaction and Mechanical Property of BGA Solder Joints with LTCC Substrate (LTCC기판과 BGA 솔더접합부의 계면반응 및 기계적 특성)

  • Yoo, Choong-Sik;Ha, Sang-Su;Kim, Bae-Kyun;Jang, Jin-Kyu;Seo, Won-Chan;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.47 no.3
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    • pp.202-208
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    • 2009
  • The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.