• Title/Summary/Keyword: minority-carrier recombination

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A Simulated Study of Silicon Solar Cell Power Output as a Function of Minority-Carrier Recombination Lifetime and Substrate Thickness

  • Choe, Kwang Su
    • Korean Journal of Materials Research
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    • v.25 no.9
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    • pp.487-491
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    • 2015
  • In photovoltaic power generation where minority carrier generation via light absorption is competing against minority carrier recombination, the substrate thickness and material quality are interdependent, and appropriate combination of the two variables is important in obtaining the maximum output power generation. Medici, a two-dimensional semiconductor device simulation tool, is used to investigate the interdependency in relation to the maximum power output in front-lit Si solar cells. Qualitatively, the results indicate that a high quality substrate must be thick and that a low quality substrate must be thin in order to achieve the maximum power generation in the respective materials. The dividing point is $70{\mu}m/5{\times}10^{-6}sec$. That is, for materials with a minority carrier recombination lifetime longer than $5{\times}10^{-6}sec$, the substrate must be thicker than $70{\mu}m$, while for materials with a lifetime shorter than $5{\times}10^{-6}sec$, the substrate must be thinner than $70{\mu}m$. In substrate fabrication, the thinner the wafer, the lower the cost of material, but the higher the cost of wafer fabrication. Thus, the optimum thickness/lifetime combinations are defined in this study along with the substrate cost considerations as part of the factors to be considered in material selection.

Evaluation of Mechanical Backside Damage of Silicon Wafer by Minority Carrier Recombination Lifetime and Photo-Acoustic Displacement Method

  • Park, Chi-Young;Cho, Sang-Hee
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1997.10a
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    • pp.155-159
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    • 1997
  • We investigated the effect of mechanical backside damage in Czochralski silicon wafer. The intensity of mechanical damage were evaluated by minority carrier recombination lifetime by a laser excitation/microwave reflection photoconductance decay method, photo-acoustic displacement method, X-ray section topography, and wet oxidation/preferential etch methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the photoacoustic displacement values are also increased proportionally.

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Simulated Study on the Effects of Substrate Thickness and Minority-Carrier Lifetime in Back Contact and Back Junction Si Solar Cells

  • Choe, Kwang Su
    • Korean Journal of Materials Research
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    • v.27 no.2
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    • pp.107-112
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    • 2017
  • The BCBJ (Back Contact and Back Junction) or back-lit solar cell design eliminates shading loss by placing the pn junction and metal electrode contacts all on one side that faces away from the sun. However, as the electron-hole generation sites now are located very far from the pn junction, loss by minority-carrier recombination can be a significant issue. Utilizing Medici, a 2-dimensional semiconductor device simulation tool, the interdependency between the substrate thickness and the minority-carrier recombination lifetime was studied in terms of how these factors affect the solar cell power output. Qualitatively speaking, the results indicate that a very high quality substrate with a long recombination lifetime is needed to maintain the maximum power generation. The quantitative value of the recombination lifetime of minority-carriers, i.e., electrons in p-type substrates, required in the BCBJ cell is about one order of magnitude longer than that in the front-lit cell, i.e., $5{\times}10^{-4}sec$ vs. $5{\times}10^{-5}sec$. Regardless of substrate thickness up to $150{\mu}m$, the power output in the BCBJ cell stays at nearly the maximum value of about $1.8{\times}10^{-2}W{\cdot}cm^{-2}$, or $18mW{\cdot}cm^{-2}$, as long as the recombination lifetime is $5{\times}10^{-4}s$ or longer. The output power, however, declines steeply to as low as $10mW{\cdot}cm^{-2}$ when the recombination lifetime becomes significantly shorter than $5{\times}10^{-4}sec$. Substrate thinning is found to be not as effective as in the front-lit case in stemming the decline in the output power. In view of these results, for BCBJ applications, the substrate needs to be only mono-crystalline Si of very high quality. This bars the use of poly-crystalline Si, which is gaining wider acceptance in standard front-lit solar cells.

Effect of mechanical backside damage upon minority carrier recombination lifetime measurement by laser/microwave photoconductance technique (기계적 후면 손상이 레이저/극초단파 광전도 기법에 의한 소수 반송자 재결합 수명 측정에 미치는 영향)

  • 조상희;최치영;조기현
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.5 no.4
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    • pp.408-413
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    • 1995
  • We investigated the effect of mechanical backside damage upon minority carrier recombination lifetime measurement in Czochralski silicon substrate by laser excitation/microwave reflection photoconductance decay method. The intensity of mechanical damage was evaluated by X-ray double crystal rocking curve, X-ray section topography and wet oxidation/preferential etch methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the threshold full width at half maximum value which affect minority carrier lifetime measurement is about 13 secs.

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Study on the Passivation of Si Surface by Incorporation of Nitrogen in Al2O3 Thin Films Grown by Atomic Layer Deposition (원자층 증착법으로 형성된 Al2O3 박막의 질소 도핑에 따른 실리콘 표면의 부동화 특성 연구)

  • Hong, Hee Kyeung;Heo, Jaeyeong
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.111-115
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    • 2015
  • To improve the efficiency of the Si solar cell, high minority carrier life time is required. Therefore, the passivation technology is important to eliminate point defects on the silicon surface, causing the loss of minority carrier recombination. PECVD or post-annealing of thermally-grown $SiO_2$ is commonly used to form the passivation layer, but a high-temperature process and low thermal stability is a critical factor of low minority carrier lifetime. In this study, atomic layer deposition was used to grow the $Al_2O_3$ passivation layer at low temperature process. $Al_2O_3$ was selected as a passivation layer which has a low surface recombination velocity because of the fixed charge density. For the high charge density, an improved minority carrier lifetime, and a low surface recombination, nitrogen was doped in the $Al_2O_3$ thin film and the improvement of passivation was studied.

Relationships between Carrier Lifetime and Surface Roughness in Silicon Wafer by Mechanical Damage (기계적 손상에 의한 실리콘 웨이퍼의 반송자 수명과 표면 거칠기와의 관계)

  • 최치영;조상희
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.12 no.1
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    • pp.27-34
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    • 1999
  • We investigated the effect of mechanical back side damage in viewpoint of electrical and surface morphological characteristics in Czochralski silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductance decay technique, atomic force microscope, optical microscope, wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage degree, the lower the minority carrier lifetime, and surface roughness, damage depth and density of oxidation induced stacking fault increased proportionally.

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The study of High-efficiency method usign Tri-crystalline Silicon solar cells (삼결정 실리콘 태양전지의 19%변환 효율 최적요건 고찰에 관한 연구)

  • 이욱재;박성현;고재경;김경해;이준신
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.318-321
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    • 2002
  • This paper presents a proper condition to achieve high conversion efficiency using PC1D simulator on sri-crystalline Si solar cells. Various efficiency influencing parameters such as rear surface recombination velocity and minority carrier diffusion length in the base region, front surface recombination velocity, junction depth and doping concentration in the Emitter layer, BSF thickness and doping concentration were investigated. Optimized cell parameters were given as rear surface recombination of 1000 cm/s, minority carrier diffusion length in the base region 200 $\mu\textrm{m}$, front surface recombination velocity 100 cm/s, sheet resistivity of emitter layer 100 Ω/$\square$, BSF thickness 5 $\mu\textrm{m}$, doping concentration 5${\times}$10$\^$19/ cm$\^$-3/. Among the investigated variables, we learn that a diffusion length of base layer acts as a key factor to achieve conversion efficiency higher than 19 %.

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A Study on Optimal Design of Silicon Solar Cell (실리콘 태양전지 최적설계에 관한 연구)

  • ;;;Suresh Kumar Dhungel
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.4
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    • pp.187-191
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    • 2004
  • In this work, we used the PCID simulator for simulation of solar cell and examined the effect of front-back surface recombination velocity, minority carrier diffusion length, junction depth and emitter sheet-resistance. As the effect of base thickness, the efficiency decreased by the increase in series resistance with the increase of the thickness and found decrease in efficiency by decrease of the current as the effect of the recombination. Also, as the effect of base resistivity, the efficiency increased somewhat with the decrease in resistivity, but when the resistivity exceeded certain value, the efficiency decreased as a increase in the recombination ratio. The optimum efficiency was obtained at the resistivity 0.5 $\Omega$-cm, and thickness $100\mu\textrm{m}$. We have successfully achieved 10.8% and 13.7% efficiency large area($103mm{\times}103mm$) mono-crystalline silicon solar cells without and with PECVD silicon nitride antireflection coating.

Estimation of mechanical damage by minority carrier recombination lifetime and near surface micro defect in silicon wafer (실리콘 웨이퍼에서 소수 반송자 재결합 수명과 표면 부위 미세 결함에 의한 기계적 손상 평가)

  • 최치영;조상희
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.2
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    • pp.157-161
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    • 1999
  • We investigated the effect of mechanical back side damage in Czochralski silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductance decay ($\mu$-PCD) technique, wet oxidation/preferential etching methods, near surface micro defect (NSMD) analysis, and X-ray section topography. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and NSMD density increased proportionally, also correlated to the oxidation induced stacking fault (OISF) density. Thus, NSMD technique can be used separately from conventional etching method in OISF measurement.

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Evaluation of mechanical backside damage by minority carrier recombination lifetime and photo-acoustic displacement method in silicon wafer (실리콘 웨이퍼에서 광열 변위법과 소수 반송자 재결합 수명 측정에 의한 기계적 후면 손상 평가)

  • 최치영;조상희
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.8 no.1
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    • pp.117-123
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    • 1998
  • We investigated the effect of mechanical backside damage in Czochralski grown silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductivity decay method, photo-acoustic displacement method, X-ray section topography, and wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the photo-acoustic displacement values increased proportionally, and it was at Grade 1: Grade 2:Grade 3 = 1:19.6:41 that the normalized relative quantization ratio of excess photo-acoustic displacement in damaged wafer was calculated, which are normalized to the excess PAD from sample Grade 1.

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