• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.24 no.12
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• pp.57-63
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• 2010

The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes.

• Journal of Applied Biological Chemistry
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• v.62 no.2
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• pp.181-186
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• 2019

The optimum design of LED device for irradiation of 460 nm blue light on extruded rice cake using simulation and the effect of the blue light on the inactivation of Bacillus cereus (B. cereus) group on the rice cake were investigated. The irradiated light intensity patterns on the surface area of the sample were simulated with three different LED arrays (centered, cross, and evenly spaced) and at various distances (22, 32, 42 mm) between the LED modules and the sample. In addition, the uniformity was calculated as Petri factor. The evenly spaced array resulted the most uniform light intensity pattern in the simulation, and the Petri factor of 32 and 42 mm of the distances showed higher than 0.9, which represents the ideal uniformity of LED device. The bacterial population of the rice cake decreased to less than the initial bacterial population during exposure to LED blue light, whereas the bacterial population of the control sample increased. The bacterial count of the rice cake after blue light irradiation for 24 h was 1.21 log CFU/g lower than the control sample. Petri factor increased with increase of the distance between the light source and sample, however, the reduction rate of B. cereus group decreased. Therefore, the design of LED device, that represented the Petri factor higher than 0.9 and inactivated the population of B. cereus group, with evenly spaced and 32 mm of distance between the light source and sample was suitable for extending shelf-life of rice cake.

• Transactions on Electrical and Electronic Materials
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• v.9 no.3
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• pp.110-115
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• 2008

In this paper, we have designated a 42-inch RGB LED BLU, 80 % above illuminance. A desirable brightness performance was attained, by doing anti-parallel configuration, a fitting of LED's strip distance and a height of the top of LED to the back of the LCD. We get the 85.81 % of the brightness uniformity which has 12.8 mm away from LED's top and LCD's back and 51.41 mm of the same spacing between LED's strip in simulation and 82.24 % in experiment.

• Journal of the Korean Vacuum Society
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• v.21 no.4
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• pp.185-192
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• 2012

p-n junction temperature and thermal resistance of Light Emitting Diode (LED) package are affected by the chip size due to the change of the thermal density and the external quantum efficiency considering the heat dissipation through conduction. In this study, forward voltage was measured for two different size LED chips, 24 mil and 40 mil, which consist constitute 16-chip package. p-n junction temperature and thermal resistance were determined by thermal transient analysis, which were discussed in connection with the electrical characteristics of the LED chip and the structure of the LED package.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.91-101
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• 2017

In this study, we conducted the preliminary research for high speed laser cutting of LED module. In particular, the feasibility of ultra-high speed laser cutting of 100 mm/s which exceeds the cutting speed of conventional dicing saw was examined. For this, copper/ceramic and silicone/ceramic hybrid substrates, which are the components of the LED module, were fabricated, and the surface morphology, surface roughness and flexural strength of the laser-cut samples were investigate and compared with the dicing-cut samples. To investigate optimal laser cutting conditions for hybrid substrates, the effects of various laser cutting conditions on cutting surface characteristics were studied using single ceramic and copper substrate. Optimal laser cutting conditions of the hybrid substrates were the use of Ar assist gas, high laser power and high assist gas pressure. Comparing the cutting surface of the hybrid substrates, the surface characteristics of the laser-cut samples are slightly inferior to those of the dicing-cut samples. The average surface roughness of the laser-cut samples was about $9{\mu}m$, and that of the dicing-cut samples was about $4{\mu}m$. However, considering very low cutting speed (3 mm/s) of the dicing saw, the surface morphology of the laser-cut sample was relatively uniform, and the surface roughness was not much different from that of the dicing-cut sample. The flexural strength of the laser-cut samples was equivalent to or slightly inferior to the flexural strength of dicing-cut samples. However, if the laser processing conditions are sufficiently optimized, the ultra-high speed laser cutting of the LED module will be possible.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.2
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• pp.217-223
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• 2015

In this paper, the performance of a system was analyzed according to the design parameters of a LED secondary lens that can be applied at a very close range, e.g., for direct lighting or display systems. We designed the secondary lens of the very-close-range LED using an aspheric equation and analyzed its performance-particularly the angle of the beam spread, central luminous intensity, and light uniformity-with respect to the thickness of lens, radius, conic constant, and asphericity (4th). Our analysis shows that four parameters affect the performance. The simulation results indicate an optimal thickness of 1 mm and show that a larger radius yields higher performance. The optimal range for the conic constant was determined as -1.21 to -1.25, the optimal range for the asphericity was determined as 0.0047xx to 0.0049xx (4th).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.3
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• Design & Manufacturing
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• v.11 no.2
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• pp.29-36
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• 2017

In this study, the non-contact type bicycle generator system considering the recharge is developed to use the eco-friendly energy source when the bicycle is operating. The following three main factors are considered in this study. One of factors is that the intensity of the rotating magnet is in the range of 2,700~4,300 [Gause]. The next factor is that the separation distance of rotating magnet and bicycle rim is in the range of 1.5-3.0 mm. The last factor is that the pedaling speed is in the range of 55 RPM [Wheel speed 5.6Km]~150 RPM [Wheel speed 15.25Km] consirering with the 5 staged gear transmission. The obtained results are as followed. (1) The generator output voltage gradually increases from 3V to 10V with the pedaling speed increases, at the separation distance is less than 2.5 mm and the operating voltage of the LED lamp is generated at a pedaling speed of 60 RPM or more. (2) The output current of the generator increases from 20mA to 40mA with the pedaling speed increases, at a separation distance is less than 2.0 mm and the operating current of the LED lamp is generated at a pedaling speed of 60 RPM or more. (3) When the separation distance was 3.0 mm, the output voltage and current are significantly lower than those of the bicycle LED lamp is generated. (4) The charging time is expected to be 12.24 ~ 17.65 hours when the magnitude of the magnet is 3,400[Gauss] at a pedaling speed of 55 RPM or more. (5) As a result of this study, it is thought that the non-contact type bicycle generator system considering the recharge can replace the conventional friction power generation system.

• Proceedings of the Plant Resources Society of Korea Conference
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• 2020.12a
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• pp.61-61
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• 2020

This experiment was carried out using artificial bed soil and LED in the plastic film house(irradiation time: 07:00-17:00/day). Seedlings(n=63 per 3.3 m²) of ginseng was planted on May 17, 2018. LED was combined with red and blue light in a 3:1 ratio and irradiated with different light intensity(40-160 µmol/m²/s). Average air temperature from April to September according to the light intensity test was 20.4℃-20.9℃. Average artificial bed soil temperature was 20.1℃-21.7℃. The test area where fluorescent lamp was irradiated tended to be somewhat lower than the LED irradiation area. The chemical properties of the test soil was as follows. pH levels was 6.6-6.7, EC levels 0.9-1.3 dS/m and OM levels 30.6-32.0%. The available P₂O₅ contents was 73.3-302.3 mg/kg. Exchangeable cations K and Ca contents were higher than the allowable ranges and mg content was high in the fluorescent lamp treatment. The photometric characteristics of LED light intensity are as follows. The greater the light intensity, the higher the PPFD(Photosynthetic Photon Flux Density) value, illuminance and solar irradiation. Fluorescent lamp treatment had high illuminance value, but PPFD and solar irradiation were lower than LED intensity 40 µmol/m²/s treatment. The photosynthetic rate increased(2.0-3.8 µmolCO²/m²/s) as the amount of light intensity increased, peaking at 120 µmol/m²/s, and then decreasing. The SPAD (chlorophyll content) value decreased as the amount of light intensity increased, and was the highest at 36.1 in fluorescent lamp treatment. Ginseng germination started on April 5 and took 14-17 days to germinate. The overall germination rate was 68.8-73.6%. The growth of aerial parts(plant height etc.) were generally excellent in the treatment of light intensity of 120-160 µmol/m²/s. The plant height was 41.9 cm, stem length was 24.1 cm, leaf length was 9.8 cm and stem diameter was 5.6 mm. The growth of underground part (root length etc.) was the best in the treatment with 120 µmol/m²/s of light intensity. Due to the root length was long(24.8 cm) and diameter of taproot was thick(18.7 mm), the fresh root weight was the heaviest at 24.8 g. There were no disease incidence such as Alternaria blight, Gray mold and Anthracnose. Disease of Damping-off caused by Rhizoctonia solani occurred 0.6-1.5% and incidence ratio of rusty root ginseng was 30.8-62.3%. It is believed that the reason for the high incidence of rusty root ginseng is that the amount of field moisture capacity of artificial bed soil is larger than the soil. Leaf discoloration rate was 13.7-32.3%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.234-239
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• 2011

In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 $[mm^2]$. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.