• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Food Science and Preservation
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• v.2 no.2
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• pp.285-291
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• 1995

This study was performed to investigate the optimum moisture content and the best packaging method of dried persimmons for long term storage at room temperature. The package material to be used were 0.05mm polyethylene film, Wrap film, 0.08mm LDPE film exchanged nitrogen gas, and non package for untreated control. Before the storage, the initial moisture contents of dried persimmons were treated with 40%, 35% and 30%, respectively; 40% as traditional dryness, 35% as extending dry period one more week, and 30% as for two more weeks. The best package method was 0.08mm LDPE film exchanged nitrogen gas, and the optimum moisture control was 35%

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.768-771
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• 2003

Nowadays, the study on the ceramic components and modules used in telecommunication system is being performed. Duplexer is the one of the most important components and has the role of dividing Rx and Tx signal. Duplexer including the FBAR is being done vigorously LTCC is used for package like SAW package, duplexer package. In our research, LTCC material is used for FBAR duplexer package and photo-lithography for the fine line phase shifter. The good characteristics, low loss and good isolation, of duplexer is obtained by the fine line phase shifter having high characteristic impedance of stripline.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.4 no.2
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• pp.20-28
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• 2008

According to IAEA regulations, a transportation package of radioactive material should perform its intended function of containing the radioactive contents after the drop test, which is one of hypothetical accident conditions. Impact limiters attached to a transport cask absorb the most of impact energy. So, it is appreciated to determine properly the shape, size and material of impact limiters. A material data needed in this determination is a dynamic one. In this study, several materials considered as those of impact limiters were tested by a drop weight facility to acquire dynamic material characteristics data. Impact absorbing volume of the impact limiter was derived mathematically for each drop condition. A size optimization of impact limiter was conducted. The derived impact absorbing volumes were applied as constraints. These volumes should be less than critical volumes generated based on the dynamic material characteristics. The derived procedure to decide the shape of impact limiter can be useful at the preliminary design stage when the transportation package's outline is roughly determined and applied as input value.

• Transactions on Electrical and Electronic Materials
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• v.2 no.3
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• pp.28-32
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• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.

• Journal of Korean Institute of Architectural Sustainable Environment and Building Systems
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• v.12 no.6
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• pp.543-556
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• 2018

Zero energy building was attended for energy consumption minimization by the energy saving technology about building heating and cooling energy consumption and the renewable energy production facility. So the government has supported the zero energy building supply for decreasing green gas emissions. The study about inventory of zero energy building has many proceeding. That inventory need the information of material and equipment. So information of material and equipment about zero energy building must be included for the zero energy building realization. Actually the database of zero energy building inventory construction through the inventory established studies has difficult because the database need many information. In this study, author proposed the test methods and performance reference for upload at inventory. It was constructed to material - module - package. Also the author analyzed the construction of the technical package for zero energy building. The author separated performance category to the energy performance for energy analysis and other performance for confirmed the durability, stability and etc. This performance category proposed the table. The test methods of material and equipment in the passive package and active package proposed to the international standard and korea standard basically korea standard. Also the performance reference was proposed to korea legal standard and various standard by this study results. And the authors proposed the table of performance value, test methods, performance reference. By result of this study, the test methods and performance reference will be used the basic data for inventory of zero energy building.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.