• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.31-34
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• 2016

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.6
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• pp.959-964
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• 2001

An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.55-60
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• 2009

Porous silicon film is fabricated by electrochemical etching in a chemical mixture of HF and ethanol. Effects of Si type, Si resistivity, ultrasonic frequency, current density and etching time on surface morphology of PS film were studied. Electrochemical etching in ultrasonic bath promotes the uniformity of porous layer of Si. Frequency of ultrasonic was increased from 40 kHz to 130 kHz to obtain uniform pores on the Si surface. When current density was higher, the sizes of pores were larger. The new etching cell using back contact metal and current shield help to overcome nonhomogeneity and current crowding effect, and then leads to fabricate uniform pores on the Si surface. The distribution of pore size shows no notable tendency with etching time.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.08a
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• pp.10-21
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• 1999

Recent progress in manufacture of hot and cold rolled steel strip products and their applications were reviewed. The main trend in the technological development has been to meet the customers' requests for quality improvement and cost reduction. The weight reduction to reduce the fuel consumption is the main issue in the automotive industry and, therefore, various steels have been developed to improve formability as well as strength. The steels include super-EDDQ steels, bainitic steels, TRIP steels, etc. In the oil industry, efforts have been focused to improve strength together with either low temperature toughness or HIC/SSCC resistance. The packaging industry is also a highly competitive market, and steel and canmaking companies have worked cooperatively to develop cost-effective canmaking processes as well as high performance steels. This type of cooperation has also been found important in other industries such as the appliance and electronic industries for the benefits of both steelmakers and customers.

• ETRI Journal
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• v.24 no.4
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• pp.290-298
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• 2002

We present, for the first time, a prototype active-matrix field emission display (AMFED) in which an amorphous silicon thin-film transistor (a-Si TFT) and a molybdenum-tip field emitter array (Mo-tip FEA) were monolithically integrated on a glass substrate for a novel active-matrix cathode (AMC) plate. The fabricated AMFED showed good display images with a low-voltage scan and data signals irrespective of a high voltage for field emissions. We introduced a light shield layer of metal into our AMC to reduce the photo leakage and back channel currents of the a-Si TFT. We designed the light shield to act as a focusing grid to focus emitted electron beams from the AMC onto the corresponding anode pixel. The thin film depositions in the a-Si TFTs were performed at a high temperature of above 360°C to guarantee the vacuum packaging of the AMC and anode plates. We also developed a novel wet etching process for $n^+-doped$ a-Si etching with high etch selectivity to intrinsic a-Si and used it in the fabrication of an inverted stagger TFT with a very thin active layer. The developed a-Si TFTs performed well enough to be used as control devices for AMCs. The gate bias of the a-Si TFTs well controlled the field emission currents of the AMC plates. The AMFED with these AMC plates showed low-voltage matrix addressing, good stability and reliability of field emission, and good light emissions from the anode plate with phosphors.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.20 no.2
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• pp.243-253
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• 2022

Spent filters with a high radiation dose rate of 2 mSv·hr^-1 or more are not easily managed. So far, the Korean policy for spent filter disposal is to store them temporarily at nuclear power plants until the waste filters can be easily managed. Nuclear power plant decommissioning in Korea is starting with Kori unit 1. Volume reduction of waste generated during decommissioning can reduce the cost and optimize the space usage at disposal site. Therefore, efficient volume reduction is a very important factor during the decommissioning process. A conceptual method, based on the experiences of developing 200 and 800 ton compactors at Orion EnC, has been developed considering worker exposure with the followings a crusher (upgrade of compaction efficiency), an automatic dose measuring system with a NaI(Tl) detector, a shield box, an inner drum to prepare for easy handling of drums and packaging, a 30 ton compactor, and an automatic robot system. This system achieves a volume reduction ratio of up to 85.7%; hence, the system can reduce the disposal cost and waste volume. It can be applied to other types of wastes that are not easily managed due to high dose rates and remote control operation necessity.