• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1798-1802
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• 2007

Adhesion strength of single layer ceramic capacitor sheet was measured using a peel testing system developed in this study. The peel test specimens with various dimensions were prepared from the ceramic sheet cast on the PET film. In peel test, the sheet specimen was adhered on the glass jig floating on the liquid media, which was designed to minimize the friction, and the specimen was then pulled up by micro-actuator. During the separation of the sheet from the PET film, peel force was measured. To normalize the testing condition, 3 different widths of the specimen were selected: 5, 10 and 20 mm. was used Furthermore, testing speed effect was investigated in this study. From the resullts using various testing conditions, the standard method for the peel strength testing may be suggested. Based on the testing condition, effect of peel angle on the strength was experimentally examined. It was found that the adhesive strength for the ceramic sheet is nearly identical, irrespective of the specimen width ranged from 5 to 20 mm, while the adhesive strength was increased with increasing testing speed. Furthermore, the strength was shown to be dependent on the peel angle.

• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.4
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• pp.56-65
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• 1998

The bonding strength evaluation of the light weight materials for an electrical vehicle has been performed through the T-peel joint test in which the design paramete- rs such as joint style, adherend type, adherend thickness, adhesive thickness, and adhesive type are considered. It is experimentally observed that the peel strength of joint increases with the increase of the adherend thickness. With the increase of the adhesive thickness, however, the peel strength of joint increases a little. Aluminum-FRP adherend combination shows such higher peel strength than that of Aluminum-Aluminum adherend combination. For the adhesive bonded joint, the results of FEM analysis agree with those of experiment. The adhesive bonded joint reinfored with a rivet gives higher peel strength than that of the joint without rivet.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2005.05a
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• pp.933-937
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• 2005

FCBGA가 마더보드에 실장된 후 솔더 조인트에 균열이 생기면 단선이 발생한다. 솔더 조인트의 신뢰성을 평가하기 위한 방법 중 전단강도시험(shear test)은 약한 솔더 조인트를 판별하기 어려워 양품 로트와 불량 로트를 구별할 수 없으며, 인장강도시험(pull test)은 솔더 볼의 위치별 산포가 크고, peel test는 품질을 정량적으로 나타낼 수 없는 등의 문제가 있다. 새로운 시험 방법은 Area Pull Test(이하 APT)라 명명했으며 peel test와 pull test를 합한 개념으로서, 시험 샘플을 만드는 과정은 peel test와 동일하다. 솔더 조인트의 인장강도 측정은 지그를 만들어서 FCBGA 전체를 당겨서 측정하였다. 샘플은 Ni도금 두께를 3, 5, 8 ${\mu}m$로 제작하여 불량(3${\mu}m$), 양품으로 구분하였고, 양품 또한 품질 수준을 두가지(5,8${\mu}m$)로 나누었다. 그 결과 peel test 기준에 의거한 불량, 양품을 정량적인 수치(인장강도)로 판별할 수 있었으며, 솔더 조인트의 파괴모드별 인장강도를 구분 할 수 있었다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1567-1573
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• 2010

In printing systems, the reliability of printed material depends on the ability of the toner film to remain adhered to the paper surface. In order to measure the strength between the toner film and the paper surface, a peel-off test is often performed. After conducting the test, the amount of toner film remaining on the paper is measured in order to determine the interfacial strength. The results of this test can be affected by many factors such as the peeling rate, weight of the roller used, and dwell time of tape. Sensitivity analysis was performed with respect to peeling rate, weight of roller and dwell time of tape at different levels. It was found that the interfacial strength increased with an increase in these main parameters. On the other hand, the trend with respect to the percentage of toner loss was different. Further, the interfacial strength and percentage of toner loss were significantly affected by the peeling rate.

• Journal of Applied Biological Chemistry
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• v.44 no.3
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• pp.147-153
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• 2001

Methanol extracts from 51 fruits were tested for their fungicidal activities against six phytopathogenic fungi in a greenhouse. The efficacy varied with both the plant pathogen and fruit species used. At 10 and 5 mg/pot, methanol extracts of Poncirus trifoliata peel and seed gave over 80% control values against Pyricularia grisea, and strong fungicidal activities against Rhizoctonia solani were showed from the extracts of Citrus paradisi peel and Punica granatum leaf. In a test with Botrytis cinerea at 5 mg/pot, the extracts of C. sinensis seed and D. kaki leaf produced potent fungicidal activities, and the extracts of C. crenata peel and leaf, Ch. sinensis seed, P. trifoliata peel, and Z. jujuba leaf had strong fungicidal activities. At 5 mg/pot, strong fungicidal activities were produced in the extracts of P. trifoliata peel and seed against Phytophthora infestans and in the extracts of P. ussriensis var. macrostipes fruit and seed, C. crenata peel, C. crenata leaf, C. paradisi peel, P. trifoliata peel, P. granatum peel, and Z. jujuba leaf against Puccinia recondita. In a test with E. graminis, potent activities at 10 mg/pot were produced from the extracts of Ch. sinensis seed, C. sinensis seed, P. trifoliata leaf, P. ussriensis var. macrostipes fruit and seed, and Vitis vinifera seed. In the control effect of seven extracts against B. cinerea strains resistant to carbendazim, procymidone, and diethofencarb, extracts of C. crenata peel and leaf, Ch. sinensis seed, and P. trifoliata peel were highly effective against all strains of B. cinerea. Furthermore, potent fungicidal activities were produced from the extracts of C. sinensis seed and D. kaki leaf against the SSR, SRR, and RRS, and Z. jujuba leaf against the SSR and RRS strains. As a naturally occurring fungicide, these fruit-derived materials could be useful as new fungicidal products against phytopathogenic fungi.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12
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• pp.1142-1149
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• 2003

The strength and characteristics of the soldering interface of the power semiconductor chip in a power module has been firstly surveyed by the peel strength measurement method. A power module is combined with several power chips which generally has 30∼400$\textrm{mm}^2$ chip area to allow several tens or bigger amps in current rating, so that the traditional methods for interface characterization like shear test could not be applied to high power module. In this study power diode modules were fabricated by using lead-tin solder with 10${\times}$10$\textrm{mm}^2$ or 7${\times}$7$\textrm{mm}^2$ soldering interface. The peel strengths of soldered interfaces were measured and then the microscopic investigation on the fractured surfaces were followed. The peel test indicated that the crack propagated either through the bulk of the soft lead-tin solder which has 55-60 kgf/cm peel strength or along the interface between the solder and the plated nickel layer which has much lower 22 kgf/cm strength. This study showed that the peel test would be a useful method to quantify the solderability as well as to recognize which is the worst interface or the softest material in a power module with a large soldering area.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.3
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• pp.130-135
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• 2002

This study investigates the effect of curing method on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. Lap shear tests and T-peel tests were performed based on the procedure of ASTM 906-94a and ASTMD1876-95, respectively. Test samples were fabricated by using the co-curing method and the secondary curing method. The results showed that the shear strength of test samples made by the co-curing method was 2.5 times greater than that of test samples made by the secondary curing method. The T-peel strength of the co-curing method case was almost 2 times greater than that of the secondary curing method case.

• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.11-17
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• 2004

This research has been progressed for adhesive improvement of the Polyimide/Buffer layer/Cu at the COF(Chip On Film) which induced as the alternative plan about high concentration of a circuit or substrates according to demands of miniaturization and high efficiency of various electronic equipment. RF plasma equipment was applied to when plama pretreatment was performed for improvement of adhesive strength of PI and Cr as the buffer layer. Experimental fluents were a species of the buffer layer, depositied time and the ratio of $O_2$/Ar when performed to plasma pretreatment. The results are that Ni was superior to Cr at peel test according to a species of the buffer layer, peel strength and Cu THK were showed proportional relation to deposition structure of the same buffer layer and sample of the Cr depositied time(30 sec) and Cu depositied time(20 min) was showed good adhesion to peel test according to Cr's depositied time and Cu's depositied time. When perform PI's plasma pretreatment peel strength and $O_2$/Ar ratio were showed proportional relation. But $O_2$/Ar(2/5) was best condition since then decreased.

• Journal of the Korean institute of surface engineering
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• v.28 no.4
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• pp.219-224
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• 1995

The peel adhesion and plastic deformation in Cu-Cr alloy films, sputter-deposited onto polyimide films, have been studied as a function of Cr content in the film. The adhesion strength has been measured by T-peel test and the amount of plastic deformation in the peeled metal strip was determined qualitatively by XRD technique. Peel adhesion strength has a maximum in the film containing 22-33wt.% Cr and the peel strength of pure Cr film is lower than the maximum. The film having the highest peel strength is deformed most heavily. The effect of Cr content on the peel strength is discussed in terms of the interfacial bond strength and mechanical properties of Cu-Cr alloy film.

• Korean journal of food and cookery science
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• v.30 no.5
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• pp.620-630
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• 2014

Traditionally, the persimmon Gojongsi (Diospyros kaki Thunb) is peeled to make dried persimmons and the skins are thrown away. In this study, the quality characteristics of cookies containing persimmon peel powder were tested for recycling of the persimmon peels. The amounts of persimmon peel powder added to the cookies were about 0, 5, 7, 9 and 11%. The densities of the cookies of the control group and the persimmon peel powder containing experimental group were 1.25 and 1.25~1.37 respectively. The pH was 6.02 for the control group and 5.95~6.01 for the experimental group. Significant differences in the moisture content were observed between groups at 3.34 and 2.16~3.31 for the control and experimental groups, respectively (p<0.05). The spreadabilities and loss rates of the cookies increased with increasing amounts of persimmon peel powder (p<0.05). In contrast, the loss rates and leavening rate of the cookies decreased significantly with decreasing amounts of persimmon peel powder (p<0.05). The lightness of the cookies showed significant decrease (p<0.05), while the redness and yellowness increased with increasing amounts of persimmon peel powder. The hardness (kg) of the control group was 0.847 while that of the experimental group was 0.904~1.110. In the QDA, the results of sensory characteristic analysis showed that the experimental group earned 11% higher scores for color, flavor, taste, and bitterness, 7% higher for appearance and 9% higher for after taste. The consumer acceptance test revealed the experimental group to have a 7% more positive evaluation for color, favor, taste and texture than the control group. On the grounds of the experiment above, the optimal mixture ratio from the sensory test was found to be 7% persimmon peel powder in the cookies.