• Title/Summary/Keyword: photolithography

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Precision Control of Linear BLDC Motor for Photolithography (Photolithography용 선형 BLDC 전동기의 정밀제어)

  • Jeon, J.W.;Kang, D.H.;Kim, J.W.;Jeon, Y.W.;Hwang, D.H.;Park, D.Y.;Kim, Y.J.
    • Proceedings of the KIEE Conference
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    • 2001.07b
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    • pp.798-800
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    • 2001
  • Precision control technologies are required for photolithography. The linear BLDC motor is used for the stage operations. The stage that is installed in a photolithography device is basically controlled in three directions(x, y, z axes). This paper presents precision control technologies of the linear BLDC motor in one direction by computer simulations. A position control system with linear BLDC motor is now being tested.

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Friction Characteristics for Density of Micro Dimples Using Photolithography (포토리소그라피를 이용한 마이크로 딤플의 밀도에 따른 마찰 특성)

  • Kim Seock-sam;Chae Young-hun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.3 s.234
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    • pp.411-417
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    • 2005
  • Surface texturing of tribological application is another attractive technology of friction reducing. Also, reduction of friction is therefore considered to be a necessary requirement for improved efficiency of machine. In this paper attempts to investigate the effect of density for micro-scale dimple pattern using photolithography on bearing steel flat mated with pin-on-disk. We demonstrated the lubrication mechanism for a Stribeck curve, which has a relationship between the friction coefficient and a dimensionless parameter for lubrication condition. It is found that friction coefficient is depended on the density of surface pattern. It was thus verified that micro-scale dimple could affect the friction reduction considerably under mixed and hydrodynamic lubrication conditions from based on friction map. Lubrication condition regime has an influence on the friction coefficient induced the density of micro dimple.

A Study on the 3-D Airflow and Dynamic Cross Contamination in the Photolithography Process Cleanroom (광식각공정이 있는 클린룸에서의 3차원 기류 및 동적교차오염에 관한 연구)

  • Noh, Kwang-Chul;Oh, Myung-Do;Lee, Seung-Chul
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.5
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    • pp.560-568
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    • 2004
  • We performed the numerical study on the characteristics of the 3-D airflow and dynamic cross contamination in the photolithography process cleanroom. The nonunifurmity, the deflection angle and the global cross contamination were used for analyzing the characteristics and performances of cleanroom. From the numerical results, we knew that the airflow characteristics of the cleanrooms are largely affected by the porosity of panel and the adjustment of dampers and the global cross contamination varies with the location of source and the passage of time through the concentration ratio.

A Numerical Study on the Characteristics of Airflow and Cross Contamination in the Photolithography Process Cleanroom (광식각공정 클린룸에서의 기류 및 교차오염에 대한 수치적 연구)

  • Noh, Kwang-Chul;Lee, Seung-Chul;Oh, Myung-Do
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.151-156
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    • 2003
  • We performed the numerical study on the characteristics of the airflow and cross contamination in the photolithography process cleanroom. The nonuniformity, the deflection angle and the global cross contamination were used for analyzing the characteristics and performances of cleanroom. We knew that the airflow characteristics of the cleanrooms are largely affected by the porosity of panel and the adjustment of dampers. And the numerical result showed that the global cross contamination varies with the location of source and the passage of time.

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Dedication Load Based Dispatching Rule for Load Balancing of Photolithography Machines in Wafer FABs (반도체 생산 공정에서 포토장비의 부하 밸런싱을 위한 Dedication 부하 기반 디스패칭 룰)

  • Cho, Kang Hoon;Chung, Yong ho;Park, Sang Chul
    • Korean Journal of Computational Design and Engineering
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    • v.22 no.1
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    • pp.1-9
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    • 2017
  • This research develops dispatching rule for a wafer FABs with dedication constraints. Dedication, mostly considered in a photolithography step, is a feature in a modern FABs in order to increase the yield of machines and achieve the advance of manufacturing technology. However, the dedication has the critical problem because it causes dedication load of machines to unbalance. In this paper, we proposes the dedication load based dispatching rule for load balancing in order to resolve the problem. The objective of this paper is to balance dedication load of photo machines in wafer FABs with dedication constraint. Simulation experiments show that the proposed rule improves the performance of wafer FABs as well as load balance for dedication machines compared to open-loop control based conventional dispatching rule.

Selective surface modification for biochip with micromirror array (마이크로미러를 사용한 바이오칩의 선택적 표면 개질을 위한 광변조 실험)

  • Lee, Kook-Nyung;Sin, Dong-Sik;Lee, Yoon-Sik;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.2257-2259
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    • 2000
  • This paper reports on the design, fabrication and driving experiment of micro mirror array(MMA) for lithography process to apply to biochip fabrication Photolithography technology is applied to activate specific area on the surface of modified glass surface, DNA monomers are bound on the activated area of the glass surface. After repeat of DNA monomer synthesizing process, DNA single strand probes could be solid-synthesized on the glass substrate. Without using photomask, photolithography process is tried using micro mirror array(MMA). Photomask or mask alignment is not required in maskless photolithography process using micro mirror array.

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Micropatterning of Peptides to Solid Surface by Deep-UV Lithography using N-hydroxysuccinimidyl phenol azide (N-hydroxysuccinimidyl phenyl azide와 광반응을 이용한 펩타이드의 마이크로형태 고정화)

  • 김진희;김현정;김종원;장준근;민병구;최태부
    • Journal of Biomedical Engineering Research
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    • v.19 no.5
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    • pp.441-448
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    • 1998
  • Defined spatial localization of biomolecules on the polymer surface Is potentially powerful method to generate biocompatible surface. Photolithography and photochemistry can be used to immobilize peptides only al a given region of the surface. In this study, peptide RGDS, one of the endothelial cells recognition sites of fibronectin, was covalently immobilized on the polystyrene coated surface with micropattern. It was performed by photochemical reactivity of a synthesized N-hydroxysuccinimidyl phenyl azide. The micropatterning was confirmed by staining with fluorescent dye, aminoacetamido fluorescein. Endothelial cell adhesion was observed only on the RGDS immobilized areas.

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FIB milling on nanostencil membrane (나노스텐실 제작을 위한 FIB 밀링 특성)

  • Kim G.M.;Chung S.I.;Oh H.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.318-321
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    • 2005
  • FIB (Focused ion Beam) milling on a 500-nm-thick silicon nitride membrane was studied in order to fabricate a high-resolution shadow mask, or called a nanostencil. The silicon nitride membrane was fabricated by MEMS processes of LPCVD, photolithography, ICP etching and bulk silicon etching. The apertures made by FIB milling and normal photolithography were compared. The square metal pattern deposited through FIB milled shadow mask showed 6 times smaller comer radius than the case of photolithography. The results show high resolution patterning could be achieved by local deposition through FIB milled shadow-mask.

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Photolithography Process of Organic Thin Film with A New Water Soluble Photoresist

  • Kim, Kwang-Hyun;Song, Chung-Kun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.1038-1039
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    • 2004
  • We developed a new photoresist which was composed of polyaniline, uv-curing agent, N-methyl-2- pyrrolidine (NMP) and N-Butyl alcohol (BuOH) as solution. The photoresist is characterized by the capability of being developed in water. We successfully patterned pentacene thin film, which was vulnerable to organic solvent and thus could not be patterned by the conventional photolithography process, with the water soluble photoresist and the minimum feature size was found to be 2um.

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Design for High Voltage Generator of Electron Beam Manufacturing System (전자빔 가공기를 위한 고전압 발생 장치 설계)

  • 임선종;강재훈;이찬홍
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.564-567
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    • 2004
  • In the manufacture of integrated circuits, photolithography is the lowest yield step in present production lines. Electron beams form a powerful set of tools with which to attack this problem. Electron beams can be used to make patterns that are smaller than can a photolithography. We design a high voltage generator of electron beam manufacturing system. For this purpose, first, the configuration of electron beam manufacturing system was analyzed. Second, the basic configuration of a high voltage generator and test results were presented.

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