• Title/Summary/Keyword: photolithography

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MEMS 및 니켈 전해도금 공정을 이용한 프로브카드 제작 및 연구

  • Choe, U-Jin;Jang, Gyeong-Su;Baek, Gyeong-Hyeon;Min, Sang-Hong;Lee, Jun-Sin;Kim, Chang-Gyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.180-180
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    • 2011
  • 본 연구에서는 MEMS 공정 기술 및 니켈 전해도금 공정을 이용한 프로브 카드를 제작 및 연구 했으며 MEMS기술을 사용함에 따라 다양한 형상의 프로브 카드를 구현하였다. 본 연구를 진행하면서 Photolithography공정 중 스핀코팅, 노광의 세기 및 도금시간의 변화를 각각 다르게 했을 때 도금용 Thick PR Mold 높이에 큰 영향이 있는 것을 알 수 있었다. 실리콘 웨이퍼를 대신하여 Pi필름 상에 Thick PR를 이용하여 Mold를 형성하고, 그 위에 니켈 도금법에 의해 니켈 박막을 형성한 후, Lapping에 의해 두께 평탄도를 조정한다면 일정한 두께편차, 직각에 가까운 수직도 및 항상 일정한 치수 정밀도를 갖는 저단가 니켈 소재의 프로브 카드를 제작 할 수 있을 것이며, 높은 효율을 기대 할 수 있다.

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Ag, Al and Cu metal mesh films prepared by photolithography for touch screen panel (Photolithography 공정으로 제작한 touch screen panel 용 Ag, Al, Cu metal mesh film)

  • Kim, Seo-Han;Yu, Mi-Yeong;Song, Pung-Geun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.11a
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    • pp.287-288
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    • 2015
  • 최근 투명 산화물 전극 (TCO)은 LED, electronic display, solar cell, touch screen panel (TSP) 등 다양한 분야에 많이 사용되고 있다. TCO는 높은 광 투과도와 전도성으로 인해 여러 분야에 많이 사용되고 있으며, 특히 ITO (Sn-doped indium oxide)가 display 분야에 많이 적용되고 있다. 하지만, ITO는 투과도와 면저항의 반비례 관계를 가지므로 더 낮은 면저항이 요구되는 대면적 TSP 분야에 적용되기에는 많은 개선이 필요하다. 따라서, 본 연구에서는 metal mesh film의 연구를 통해 TSP 분야에 사용되는 ITO를 대체하고자 한다. 제작된 mesh film은 모두 면저항은 $15{\Omega}/{\square}$ 이하, 광 투과도 90% (@550nm) 이상을 나타내었다.

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A study on processing characteristics of plasma etching using photo lithography (Photo lithography을 이용한 플라즈마 에칭 가공특성에 관한 연구)

  • Baek, Seung-Yub
    • Design & Manufacturing
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    • v.12 no.1
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    • pp.47-51
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    • 2018
  • As the IT industry rapidly progresses, the functions of electronic devices and display devices are integrated with high density, and the model is changed in a short period of time. To implement the integration technology, a uniform micro-pattern implementation technique to drive and control the product is required. The most important technology for the micro pattern generation is the exposure processing technology. Failure to implement the basic pattern in this process cannot satisfy the demands in the manufacturing field. In addition, the conventional exposure method of the mask method cannot cope with the small-scale production of various types of products, and it is not possible to implement a micro-pattern, so an alternative technology must be secured. In this study, the technology to implement the required micro-pattern in semiconductor processing is presented through the photolithography process and plasma etching.

Vertical Alignment of Zinc Oxide Micro Rod with Array of 2-Dimensions (2차원 배열구조를 갖는 ZnO 마이크로 막대 구조체의 수직정렬)

  • Lee, Yuk-Kyoo;Jeon, Chan-Wook;Nam, Hyo-Duk
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.459-460
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    • 2008
  • Zinc oxide micro rods were fabricated using as chemical bath deposition ok photolithography. Vertically aligned Zinc Oxide rod array as grown by chemical bath deposition method on Zinc Oxide template layer. The ZnO template layer was deposited on glass and the pattering was made by standard photolithography technique. The selective growth of ZnO micro rods were achieved with the masked ZnO template layer substrate. The fabricated ZnO micro rods were found to be single crystalline and have grown along hexagonal c-axis direction of (0002) which is same as the preferred growth orientation of ZnO template layer. The ZnO micro-rod array structure was implemented as a window layer in Cu(InGa)Se2 solar cell and its effect on photovoltaic efficiency was examined.

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Friction Property of Angle and Width Effect for Micro-grooved Crosshatch Pattern under Lubricated Sliding Contact (Micro-scale Grooved Crosshatch Pattern의 각도 및 폭에 따른 실험적 미끄럼마찰특성)

  • Chae, Young-Hun;Kim, Seock-Sam
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.10 no.2
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    • pp.110-116
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    • 2011
  • The current study investigated the friction property of angle and width effect for micro-scale grooved crosshatch pattern on SKD11 steel surface against bearing steel using pin-on-disk type. The samples fabricated by photolithography process and then these are carry out the electrochemical etching process. We discuss the friction property due to the influence of a hatched-angle and a width of groove on contact surface. We could be explained the lubrication mechanism for a Stribeck curve. So It was found that the friction coefficient depend on an angle of the crosshatch on contact surface. It was thus verified that micro-scale crosshatch grooved pattern could affect the friction reduction. Also, it is play an important a width of groove to be improved the friction property. I was found that friction property has a relationship between a width and an angle for micro-grooved pattern.

A Study on Characteristics of SAW Filter by Impulse Sampling (임펄스 표본화에 의한 탄성표면파 필터의 특성에 관한 연구)

  • Lee, Dong-Yoon;Lee, Jong-Pil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.325-326
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    • 2007
  • SAW filter was designed by optimization technique using impulse sampling. To carry out characteristics of SAW filter the uniform IDT was adapted. And SAW filter was fabricated on $LiNbO_3$ substrates to evaluate frequency response. To apply properties of photolithography, lift off method was used. Lift off method was superior to etch method in fabrication process, frequency response property was measured by network analyzer. From a measurement of acoustic property, SAW propagation velocity was 2663.5m/sec.

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Dual Surface Modifications of Silicon Surfaces for Tribological Application in MEMS

  • Pham, Duc-Cuong;Singh, R. Arvind;Yoon, Eui-Sung
    • KSTLE International Journal
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    • v.8 no.2
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    • pp.26-28
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    • 2007
  • Si(100) surfaces were topographically modified i.e. the surfaces were patterned at micro-scale using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterned shapes included micro-pillars and microchannels. After the fabrication of the patterns, the patterned surfaces were chemically modified by coating a thin DLC film. The surfaces were then evaluated for their friction behavior at micro-scale in comparison with those of bare Si(100) flat, DLC coated Si(100) flat and uncoated patterned surfaces. Experimental results showed that the chemically treated (DLC coated) patterned surfaces exhibited the lowest values of coefficient of friction when compared to the rest of the surfaces. This indicates that a combination of both the topographical and chemical modification is very effective in reducing the friction property. Combined surface treatments such as these could be useful for tribological applications in miniaturized devices such as Micro-Electro-Mechanical-Systems (MEMS).

Characteristics of hybrid mask mold for combined nanoimprint and photolithography technique

  • MOON KANSHUN;CHOI BANGLIM;PARK IN-SUNG;HONG SUNSHUM;YANG KIHYUN;LEE HEON;AHN JINHO
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2005.09a
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    • pp.147-150
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    • 2005
  • We process a novel approach cal led combined nanoimprint and photolithography (CNP) to greatly simplify the fabrication in conventional nanoimprint lithography (NIL). In this study, a novel HMM with anti-sticking $SiO_2$ layer is introduced to improve the quality of transferred pattern. The surface property was investigated using contact angle measurement and spectrophotometer. Replicate pattern with CNP using HMM showed complete pattern transfer without defect.

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Optimized O2 Plasma Surface Treatment for Uniform Sphere Lithography on Hydrophobic Photoresist Surfaces

  • Yebin Ahn;Jongchul Lee;Hanseok Kwon;Jungbin Hong;Han-Don Um
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.2
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    • pp.188-194
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    • 2024
  • This paper introduces an optimized oxygen (O2) plasma surface treatment technique to enhance sphere lithography on hydrophobic photoresist surfaces. The focus is on semiconductor manufacturing, particularly the creation of finer structures beyond the capabilities of traditional photolithography. The key breakthrough is a method that makes substrate surfaces hydrophilic without altering photoresist patterns. This is achieved by meticulously controlling the O2 plasma treatment duration. The result is the consistent formation of nano and microscale patterns across large areas. From an academic perspective, the study deepens our understanding of surface treatments in pattern formation. Industrially, it heralds significant progress in semiconductor and precision manufacturing sectors, promising enhanced capabilities and efficiency.