• Applied Chemistry for Engineering
• /
• v.20 no.6
• /
• pp.622-627
• /
• 2009

Using an alkali-solution developable photosensitive resin and a carbon black as a conductive filler, photo-patternable pastes for polymer thick film resistor were fabricated and evaluated. A photo solder resist (PSR), which is usually used as protecting layer of printed circuit board (PCB), was used as a photosensitive resin so that ultraviolet exposure and alkali-aqueous solution development of paste were possible. After fabricating the photosensitive polymer resistor paste, the electrical properties of thick film resistors were measured using PCB test boards. Sheet resistance was decreased with increasing amount of carbon black, but the developability was limited in excess loading of carbon black. The sheet resistance was also reduced by re-curing and the change rate was smaller in higher carbon black loading. Moreover, finely patterned meander-type thick film resistors were fabricated using photo-process and large resistance up to several tens of sheet resistance could be obtained in small area by this technique.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.11 no.1
• /
• pp.71-84
• /
• 1993

Practically to put use high-photosensitive polymer, poly(vinyl cinnamoyl acetate), we investigated and confirmed UCHIDA`s synthesis, according to control solvent, which is the esterification of poly (vinyl alcohol) with monochloroacetic acid and can be freely conrolled the successive cinnamoyl acetoxyl esterfication of PVCiA, and intruducing photosensitizers,studied the photosensitivity of PVCiA.

• Journal of the Korean Society for Precision Engineering
• /
• v.24 no.5
• /
• pp.97-103
• /
• 2007

A novel selective metallization process to fabricate the fine conductive line based on inkjet printing has been investigated. Recently, Inkjet printing has been widely used in flat panel display, electronic circuits, biochips and bioMEMS because direct inkjet printing is an alternative and cost-effective technology for patterning and fabricating objects directly from design without masks. The photosensitive etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity at ambient temperature. A piezoelectric-driven inkjet printhead is used to dispense 20-30 ${\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. Repeatability of circuitry fabrication is closely related to the formation of steady droplets, adhesion between etching resist and copper substrate. Therefore, the ability to form small and stable droplets and surface topography of the copper surface and chemical attack must be taken into consideration for fine and precise patterns. In this study, factors affecting the pattern formation such as adhesion strength, etching mechanism, UV curing have been investigated. As a result, microscale copper patterns with tens of urn high have been fabricated.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.29 no.3
• /
• pp.55-63
• /
• 2011

The convex printing plate in particular securities is classified three physical properties. The main ingredient(component)of photosensitive plastic is composed of thermosetting polyamide. After being hardened specimen at $80^{\circ}C$ is shown to resist highly, the Glass Transition Temperatures of photosensitive plastic are $85^{\circ}C$. When hardened plate has reached at $80^{\circ}C$, abrasion loss is minimized. the cause is considered it is more effective in hardening when the temperature of photosensitive plastic is $80^{\circ}C$-the vitrification temperature of those. The hardness and the durability of the convex printing plate in particular securities are affected to the hardening treatment temperature. And the resolution of original drawing has being better when the durability is superior.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.1269-1271
• /
• 2008

We find some array mura are caused by S/D bridge or channel open in 4 mask process. The gray tone PR thickness non-uniformity is the main reason of these defects. By the adjustment of exposure and dry etch parameters, S/D bridge and channel open ratio drops by 10.87%.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.2
• /
• pp.311-315
• /
• 2012

Diaphragm type noncontact automatic control valve is a valve for controling acidic PR(Photo Resist) liquid used in the semiconductor process. PR is photosensitive liquid that changes phases depending on light transmittance. PR is very toxic and expensive; the purpose of this paper is to address methods that prevent loss due to leaks. The design of noncontact precise automatic control valve is expected to play an important role in controlling fluid flow, therefore influencing energy conservation and environmental improvement. In this paper, diaphragm type automatic control valve's part design, assembly and simulation are introduced. Also, through the analysis of fluid flow the valve's internal velocity, pressure, and turbulent intensity are interpreted. This paper proposes to contribute to the improvement of the valve's performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.421-421
• /
• 2008

Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

• Polymer(Korea)
• /
• v.31 no.5
• /
• pp.442-446
• /
• 2007

Alkali soluble and photo-curable polyesters were prepared from fluorene epoxy acrylate and various aromatic dianhydrides. To make a black matrix for LCD color-filter application, photo-resist solution was made by mixing synthesized polyester as binder, carbon black as pigment, initiator and multifunctional monomer in solvent. Black matrix pattern was formed on the glass substrate by lithography process. In this study, we synthesized various polyester-based binder polymers for LCD color-filter applications, and compared the analytical properties of those polymers and lithography patterns.

• Journal of the Korean Society of Visualization
• /
• v.9 no.2
• /
• pp.34-39
• /
• 2011

This paper presents a novel direct fabrication method of the thin metal film RTD temperature sensor array on an arbitrary curved surface by using MEMS technology to measure a distributed temperature field up to $300^{\circ}C$ without disturbing a fluid flow. In order to overcome the difficulty in the three dimensional photography of sensor patterning, the UV pre-irradiated photosensitive dry film resist technology has been developed newly. This method was applied to the fabrication of the temperature sensor array on a glass tube, which is arranged parallel and transverse to a main flow. Gold was used as a temperature sensing material. The resistance change was measured in a thermally controlled oven by increasing the environmental temperature. The linear increase in resistance change and a constant slope were obtained. Also, the sensitivity of each RTD temperature sensor was evaluated.

• Polymer(Korea)
• /
• v.35 no.1
• /
• pp.87-93
• /
• 2011

We developed a fluorene-containing multifunctional binder polymer for LCD color filter resist, and employing the binder polymer, carbon black based black photoresist (CBR) was prepared in order to apply it to the black matrix (BM). To obtain the multifunction of the binder polymer, we synthesized bisphenol fluorene epoxy acrylate-containing unsaturated polyester and identified the binder polymer structure with $^1H$ NMR, GPC and FTIR. The corresponding BFEA-polyester binder polymer was compared with the commercially available acryl binder toward the application to the CBR. From the BM lithography test, we found that the synthesized BFEA-polyester binder had better photocrosslinking capability and alkali solubility. In addition, the newly developed binder gave a good process margin, good resolution and adhesion property on a glass substrate.