• Composites Research
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• v.31 no.2
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• pp.76-81
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• 2018

In this study, the elemental mercury removal behaviors of silver-plated porous carbons materials were investigated. The pore structures and total pore volumes of the hybrid materials were analyzed by $N_2$ adsorption/desorption analysis at 77 K. The pore structures and surface morphologies of the hybrid materials were characterized by XRD and SEM, respectively. The elemental mercury adsorption capacities of all silver-plated porous carbons hybrid materials were higher than those of the as-received samples, despite the fact that the specific surface areas and total pore volumes decreased with increasing metal loading time. It was found that silver nanoparticles showed excellent elemental mercury removal behaviors in carbonaceous hybrid materials.

• Structural Engineering and Mechanics
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• v.8 no.4
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• pp.343-360
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• 1999

This work applies a structural analysis method based on an analytical solution from the Fourier series which transforms a half-range cosine expansion into a static solution involving plated structures. Two sub-matrices of in-plane and plate-bending problems are also formulated and coupled with the prescribed boundary conditions for these variables, thereby providing a convenient basis for a numerical solution. In addition, the plate connection are introduced by describing the connection between common boundary continuity and equilibrium. Moreover, a simple computation scheme is proposed. Numerical results are then compared with finite element results, demonstrating the numerical scheme's versatility and accuracy.

• Computational Structural Engineering
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• v.2 no.2
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• pp.101-112
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• 1989

Development of a procedure for improved modeling of orthogonally stiffened plated grillages is the primary subject of this paper. In the method developed here a modified static condensation procedure is used to get a complete 2-dimensional grillage which represents the stiffness of the original orthogonally stiffened plated structure. The theory and numerical model are applied to a typical structure and the method has been demonstrated to work well for the analysis of orthogonally stiffened plate structures.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of the Korean Ceramic Society
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• v.52 no.4
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• pp.264-268
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• 2015

Cu films were plated in an eco-friendly electroless bath (No-Formaldehyde) on Ni/screen printed Ag pattern/PET substrate. For electroless Cu plating, we used sodium-phosphinate ($NaH_2PO_2{\cdot}H_2O$) as reducing agent instead of Formaldehyde. All processes were carried out in electroless solution of pH 7 to minimize damage to the PET substrate. According to the increase of sodium-phosphinate, the deposition rate, the granule size, and rms roughness of the electroless Cu film increased and the Ni content also increased. The electroless Cu films plated using 0.280 M and 0.575 M solutions of sodium-phosphinate were made with Cu of 94 at.% and 82 at.%, respectively, with Ni and a small amount P. All electroless Cu plated films had typical FCC crystal structures, although the amount of co-deposited Ni changed according to the variation of the sodium-phosphinate contents. From these results, we concluded that a formation of higher purity Cu film without surface damage to the PET is possible by use of sodium-phosphinate at pH 7.

• Carbon letters
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• v.2 no.1
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• pp.15-21
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• 2001

In this work, activated carbon fibers (ACFs) were plated with copper metal using electroless plating method and the effects of surface properties and pore structures on chromium adsorption properties were investigated. Surface properties of ACFs have been characterized using pH and acid/base values. BET data with $N_2$ adsorption were used to obtain the structural parameters of ACFs. The electroless copper plating did significantly lead to a decrease in the surface acidity or to an increase in the surface basicity of ACFs. However, all of the samples possessed a well-developed micropore. The adsorption capacity of Cr(III) for the electroless Cu-plated ACFs was higher than that of the as-received, whereas the adsorption capacity of Cr(VI) for the former was lower than that of the latter. The adsorption rate constants ($K_1$, $K_2$, and $K_3$) were also evaluated from chromium adsorption isotherms. It was found that $K_1$ constant for Cr(III) adsorption depended largely on surface basicity. The increase of Cr(III) adsorption and the decrease of Cr(VI) adsorption were attributed to the formation of metal oxides on ACFs, resulting in increasing the surface basicity.

• Steel and Composite Structures
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• v.7 no.1
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• pp.1-18
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• 2007

Additional cutouts in the floorbeam webs of orthotropic plated bridge decks relieve the highly stressed lower flange of the ribs passing through these floorbeam webs from possible fatigue damage. Conversely, the floorbeam webs themselves suffer from high stress concentrations, especially along the free edges of the additional cutouts. These stresses result from a combination of direct introduction of vertical traffic loads in the weakened web and from the truss action of the floorbeam. The latter differs from a simple beam action due to the presence of the openings and corresponds more to the behaviour of a Vierendeel truss. Close assessment of the appearing stresses, highly relevant for fatigue resistance, requires the use of elaborate finite element modelling. However, a full finite element analysis merely provides the results of total stresses, leaving the researcher or designer the difficult task of finding the origin of these stress components. This paper presents a calculation method for cutout stresses based on a combination of a framework analysis and a two dimensional finite element analysis of much smaller parts of the floorbeam. This method provides more insight in the origin of the stress components, as well as it simplifies any comparison of different additional cutout geometries, independent of the floorbeam topology.

• Steel and Composite Structures
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• v.16 no.6
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• pp.559-576
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• 2014

A new mathematical model and its finite element formulation for the non-linear stress-strain analysis of a planar beam strengthened with plates bolted or adhesively bonded to its lateral sides is presented. The connection between the layers is considered to be flexible in both the longitudinal and the transversal direction. The following assumptions are also adopted in the model: for each layer (i.e., the beam and the side plates) the geometrically linear and materially non-linear Bernoulli's beam theory is assumed, all of the layers are made of different homogeneous non-linear materials, the debonding of the beam from the side-plates due to, for example, a local buckling of the side plate, is prevented. The suitability of the theory is verified by the comparison of the present numerical results with experimental and numerical results from literature. The mechanical response arising from the theoretical model and its numerical formulation has been found realistic and the numerical model has been proven to be reliable and computationally effective. Finally, the present formulation is employed in the analysis of the effects of two different realizations of strengthening of a characteristic simply supported flexural beam (plates on the sides of the beam versus the tension-face plates). The analysis reveals that side plates efficiently enhance the bearing capacity of the flexural beam and can, in some cases, outperform the tensile-face plates in a lower loss of ductility, especially, if the connection between the beam and the side plates is sufficiently stiff.

• Journal of the Society of Naval Architects of Korea
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• v.34 no.1
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• pp.68-76
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• 1997

The welding-induced initial imperfections such as residual stresses and initial strains in plated structures of ships and offshore structures can be effectively evaluated by the thermal elasto-plastic analysis method proposed in this paper. In the analysis of heat conduction of plate structures, both the analytical method and the numerical method are used. For the thermal elasto-plastic analysis of plates, the finite element analysis is performed, based on the initial strain method. In the plastic domain during incremental process, the 2nd order terms of stress increments and yield stress increments were considered, so that time increment could be controlled for more stable solution. To measure temperature distribution and angular distortion of plates during welding, bead-on-plate experiment are perform with various heat input and plate thickness. Measured data show good agreement with the calculated results.