• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.1-7
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• 2012

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

• Applied Chemistry for Engineering
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• v.19 no.2
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• pp.228-235
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• 2008

Nickel plating thickness increased with the electric current density, and the augmentation was more thick in $6{\sim}10A/dm^2$ than low current. Hull-cell analysis was tested to evaluate the current density. Optimum thickness was obtained at a temperature of $60^{\circ}C$, and the pH fluctuation of 3.5~4.0. Over the Nickel ion concentration of 300 g/L, plating thickness increased with the current density. The rate of decrease in nickel ion concentration was increased with the current density. The quantity of plating electro-deposition was increased at the anode surface, which was correlated with the increase of plating thickness. The plating thickness was increased because of the quick plating speed. However, the condition of the plating surface becomes irregular and the minuteness of nickel plating layer was reduced with the plating rate. After the corrosion test of 25 h, it was resulted in that maintaining low electric current density is desirable for the excellent corrosion resistance in lustered nickel plating. According to the program simulation, the thickness of diffusion layer was increased and the concentration of anode surface was lowered for the higher current densities. The concentration profile showed the regular distribution at low electric current density. The field plating process was controlled by the electric current density and the plating thickness instead of plating time for the productivity. The surface physical property of plating structure or corrosion resistance was excellent in the case of low electric current density.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.4
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• pp.104-112
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• 2017

In the sand casting process, the flow of liquid metal affects the quality of casting products and their die life. To determine the optimal bush part design process, this study performed various analyses using commercial finite element analysis S/W. The simulation focused on the molten metal behaviors during the mold filling and solidification stages of sand casting. This study aims to develop methods to reduce the cost and increase the tool life of the continuous hot zinc plating roll.

• Clean Technology
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• v.17 no.2
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• pp.103-109
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• 2011

The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.29 no.3
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• pp.336-342
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• 2019

Introduction: An unexpected death was reported in a beginner immediately after starting the work at a plating factory. After the incident, air sampling was performed using a simulation of the situation as it had been at the time. Methods: To evaluate the airborne concentration of hydrogen cyanide, a total of six samples were collected: one personal sample, three area samples, and two background samples (office and outdoors). Hydrogen cyanide measurement was performed according to the standard sampling protocol recommended by the U.S. NIOSH (National Institute of Occupational Safety and Health). Results: The highest concentration of hydrogen cyanide was 0.938 ppm measured in a sample collected from the plating bath area with local exhaust ventilation. This value was approximately 20% of the ceiling occupational exposure limit. The personal sample showed a concentration of 0.135 ppm. Samples collected near the bath in which the incident occurred and a dehydrator showed hydrogen cyanide concentrations of 0.236 ppm and 0.101 ppm, respectively. Hydrogen cyanide was not detected in the background samples (office and outdoors). Conclusions: It is necessary to use proper ventilation systems and respirators in plating factories to prevent acute poisoning. Furthermore, it is important to educate and train new workers dealing with toxic substances.

• 한국전산유체공학회:학술대회논문집
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• 2008.08a
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• pp.60.2-60.2
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• 2008

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.174-178
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• 2006

Pyramid shape of micro pattern is applied to the light guide panel (LGP) to enhance the uniformity of the brightness of the LCD. The micro pyramids are molded in intaglio on the surface of the LGP. The size of each pyramid is 5$\mu$m $\times$ 5$\mu$m on bottom and the height is about 3.5$\mu$m. The pyramids are distributed on the LGP surface randomly to be sparser where the light comes in and denser at the opposite side as a result of a simulation using lightools$^{TM}$ Based on this design, a silicon pattern master and a nickel stamper are fabricated by MEMS process and electro plating process. Intaglio micro pyramids are fabricated on the 6' of silicon wafer from the anisotropic etching using KOH and the process time, temperature of the KOH solution, etc are optimized to obtain precise shape of the pattern. A Wi stamper is fabricated from this pattern master by electro plating process and the embossed pyramid patterns turns out to be well defined on the stamper. Adopting this stamper to the mold base with two cavities, 1.8' and 3.6' LGPs are injection molded.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.2
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• pp.710-713
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• 2005

Recently, in the area of shipbuilding, automobile and electronics, the products which electroplating was applied to are developed and put into practice in the field. The extension of the field of applications electroplated objects is to complex shape and thus the rate of faults in electroplating is being increased in the process of manufacture. On the subject of the plating process in this study, the geometric factor, which influenced electroplating, was extracted by doing a comparative analysis of the findings in the plating bath and the results of performing computer simulation of 3D. Considering these factors, the study on the optimization of designing was conducted to make the plating quantity of plated objects uniform in terms of 3D.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.7
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• pp.769-776
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• 2011

In order to cope with the requirements of smaller patterns, larger surfaces and lower costs in the fields of displays, optics and energy, greater attentions is now being paid to the development of micro-pattern machining technology. Compared with flat molds, roll molds have the advantages of short delivery, ease of manufacturing larger surfaces, and continuous molding. This paper presents the state-of-the-art of the micro pattern machining technology on the roll molds and introduces some research results on the machining process technology. The copper and nickel-phosphorous-alloy plating process, machining process technology for uniform micro patterns. micro cutting simulation and the real time monitoring system for micro machining are summarized. The developed technologies have led the complete localization of the prism sheets and will be applied to the direct forming process with succeeding research & development.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.4
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• pp.759-764
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• 2012

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N at thermo-compression process. Through the simulation work, it was proved that the CPTB decreased in its size of conduction area as time passes, however it was largely affected by the copper oxidation.