• KOREAN JOURNAL OF CROP SCIENCE
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• v.33 no.4
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• pp.400-403
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• 1988

This study was conducted to evaluate the polishing process that affects the polishing properties and cooking qualities of cut-polished barley. Naked barley, Youngsanbori (Sedohadaka), which was produced in Cheonnam province, Korea in 1981, was cut and polished to have the polished yield per cent of four grades, 68.27, 72.85, 75.51 and 78.70, in contrast to the conventionally polished barley which was polished up to 70.10 per cent. Length. thickness and width of the kernels and weight of 1,000 kernels of the cut-polished barley were increased with improving the grade of the polishing yield. Energy consumption was found to be reduced according to increasing the polishing yield of the cut-polished barley. As polishing yield of the cut-polished barley were increased. the contents of P$_2$O$\_$5/, K$_2$O, MgO and Mn were increased. Also whiteness, water uptake and expanding volume of cooked barley were increased in accordance with upgrading the polishing yield of the cut-polished barley.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.27-36
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• 2003

The Electro-Rheological (ER) fluid has been used to the ultraprecision polishing of single crystal silicon as new polishing slurry whose properties such as yield stress and particle structure changed with the application of an electric field. In this work, it is aimed to find the effective parameters in the ER fluid on material removal in the polishing system whose structure is similar to that of the simple hydrodynamic bearing. The generated pressure in the gap between a moving wall and a workpiece, as well as the electric field-induced stress of the mixture of ER fluid-abrasives, is evaluated experimentally, and their influence on the polishing of single crystal silicon is analyzed. Moreover, the behavior of abrasive and ER particles is described.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.7
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• pp.311-315
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• 2002

Chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD), inter-level dielectric (ILD) layers of multi-layer interconnections. In this paper, we studied the characteristics of polishing pad, which can apply shallow trench isolation (STI)-CMP process for global planarization of multi-level interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was detected less than 2 on JR111 pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and device yield.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1873-1876
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• 2003

Magneto-rheological polishing is a new technology used in precision polishing. It utilizes magneto-rheological fluid. nonmagnetic polishing abrasive, aqueous carrier fluids in magnetic field to remove material from a part surface. Silicon micro channel as work piece is fixed in the slurry which is made of MR fluid and CeO$_2$(10 vol%) abrasive particles. And permanent magnet rotate in the slurry to transfers magnetic force to abrasive particles by increasing yield strength of MR fluid. so, the obtained bottom surface roughness of micro channel by experiment reduced to Ra 0.010 $\mu\textrm{m}$ Rmax 0.103 $\mu\textrm{m}$ and finwall surface roughness of micro channel reduced to Ra 0.018 $\mu\textrm{m}$ Rmax 0.468 $\mu\textrm{m}$. At optimum conditions of variables, the workpiece as silicon micro channel have about 24 times smaller surface roughness than before polishing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.178-181
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• 2002

We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

• Korean Journal of Food Science and Technology
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• v.22 no.2
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• pp.199-205
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• 1990

With a view to improving the method of rice marketing quality estimation, vaietal milling characteristics and apparent qualities were studied and their statistical interrelationships were computed for 2 years crops, using 22 varieties of Japonica type and Japonica x Indica type (Tongil). The milling yield was the highest for Japonica, while the broken rice yields was the highest for Japa.xInd. type. But bran yield did not show any significant differences among rice types. Milling factors were volume weight of brown rice, dehulling yield, and Polishing yields; the better these factors, the higher the yield. High apparent quality milled rice with high milling yield were produced from rice types whose broken rice, chalked rice, husk yield and bran yield were little and/or low.

• Design & Manufacturing
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• v.11 no.3
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• pp.8-12
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• 2017

In general, metallic bio-materials is more widely used in solid tissue like bone or tooth than flexible tissue such as skin or muscle. Especially, Cobalt Chrome Molybdenum(Co-Cr-Mo), which is used in tooth surgery, has a great corrosion resistance. Because this bio-material is non-toxic in human body, and has a bio-compatibility that the vital reaction is not occurred with tissue in body. However the chemical reaction is occurred by fatal matter that deteriorate the property of material surface in conventional polishing, and it can affect to fatal disease in human body or decrease the material properties such as hardness, yield strength or bio-compatibility. This surface in poor condition can cause development of corrosion or bacteria. In this study, MR fluid polishing is used to minimize the scratch, pit or surface flaws generated in conventional polishing. Surface roughness is measured according to the polishing condition to obtain fine surface condition.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1265-1268
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• 2005

Due to the increase of the need for reliable high density information storage devices, the demand for precise machining of the slider in HDD is rapidly growing. The present fabrication process of slider bears some serious problems such as low yield ratio in mass production, which is mainly caused by inefficient machining processes in shaping camber and crown on the slider. In order to increase slider yield ratio in HDD, a new systematic machining process is proposed and developed in this work. This new machining process includes the use of magnetorheological (MR) fluid, a smart polishing material generally used for ultra-fine surface finishing of micro structures. It is shown that the process proposed in this work enables to make camber and crown pattern in the scale of few tens of nanometers. Experiment results shows that the MR polishing can be also used for shaping process of micro structures.

• Journal of Digital Contents Society
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• v.3 no.1
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• pp.113-122
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• 2002

The flatness of a silicon wafer concerned with ULSI chip is one of the most critical parameters ensuring high yield of wafers. The polishing process that measures and controls the flatness of a silicon wafer is one of the important process in various processes for production silicon wafer, which are still being done today by manual. But engineers in polishing process are requested to have many experiences and to check silicon wafers one by one. In this paper, we propose an algorithm used interpolation that estimates wafer's shape and sorts wafers automatically, then we can control the flatness of wafers in polishing process by automatic system.