• 한국작물학회지
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• 제33권4호
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• pp.400-403
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• 1988

할맥의 도정율별 가공특성과 취반성을 구명하여 동정율을 향상하고 가공중 소요전력을 절감할 수 있는 방안을 모색하기 위하여 81년 전라남도지역에서 생산한 쌀보리 '영산보리'를 공시곡으로 하여 할맥한 후 도정율별로 가공하여 가공중 소요전력과 할맥의 형태 및 취반특성에 대하여 검토하였던 바 다음과 같은 결과를 얻었다. 1. 할맥의 도정율별 입장, 입폭, 입두께 및 천립중은 도정율이 높을수록 컸다. 2. 할맥가공중 소요전력은 할맥의 도정율이 높을수록 낮았으며 도정도를 일반보리쌀과 같은 수준으로 도정하였을 때는 일반보리쌀 보다 약간 높았으나 72.85 %부터는 일반보리쌀 보다 낮았다. 특히 도정율이 70.10% 일 때는 50.2kw/10 kg로 일반보리쌀의 105.1 kw/ 1,000 kg 에 비해 55.1 %의 소요전력으로 가공제품이 생산되었다. 3. 할맥의 화학성분중 단백질함량은 도정율별로 큰 차가 없었으나 인산, 가리, 마그네슘, 망간은 도정율이 높을수록 그들 함량이 높았다. 4. 할맥의 취반특성중 백도, 흡수율 및 팽장용적은 도정율이 높을수록 낮아 졌으나 일반보리쌀에 비하여는 높았다.

• 한국정밀공학회지
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• 제20권6호
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• pp.27-36
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• 2003

The Electro-Rheological (ER) fluid has been used to the ultraprecision polishing of single crystal silicon as new polishing slurry whose properties such as yield stress and particle structure changed with the application of an electric field. In this work, it is aimed to find the effective parameters in the ER fluid on material removal in the polishing system whose structure is similar to that of the simple hydrodynamic bearing. The generated pressure in the gap between a moving wall and a workpiece, as well as the electric field-induced stress of the mixture of ER fluid-abrasives, is evaluated experimentally, and their influence on the polishing of single crystal silicon is analyzed. Moreover, the behavior of abrasive and ER particles is described.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권7호
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• pp.311-315
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• 2002

Chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD), inter-level dielectric (ILD) layers of multi-layer interconnections. In this paper, we studied the characteristics of polishing pad, which can apply shallow trench isolation (STI)-CMP process for global planarization of multi-level interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was detected less than 2 on JR111 pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and device yield.

• 한국전기전자재료학회논문지
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• 제16권5호
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1873-1876
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• 2003

Magneto-rheological polishing is a new technology used in precision polishing. It utilizes magneto-rheological fluid. nonmagnetic polishing abrasive, aqueous carrier fluids in magnetic field to remove material from a part surface. Silicon micro channel as work piece is fixed in the slurry which is made of MR fluid and CeO$_2$(10 vol%) abrasive particles. And permanent magnet rotate in the slurry to transfers magnetic force to abrasive particles by increasing yield strength of MR fluid. so, the obtained bottom surface roughness of micro channel by experiment reduced to Ra 0.010 $\mu\textrm{m}$ Rmax 0.103 $\mu\textrm{m}$ and finwall surface roughness of micro channel reduced to Ra 0.018 $\mu\textrm{m}$ Rmax 0.468 $\mu\textrm{m}$. At optimum conditions of variables, the workpiece as silicon micro channel have about 24 times smaller surface roughness than before polishing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.178-181
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• 2002

We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

• 한국식품과학회지
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• 제22권2호
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• pp.199-205
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• 1990

우리나라 쌀의 품종별 도정 및 품위특성을 조사하여 합리적인 시장성을 평가할 수 있는 방법을 모색하고자 일반계 쌀과 다수계 쌀의 품종별로 품위 및 도정특성을 조사 분석한 결과는 다음과 같다. 유형별 도정률은 일반계가 높고 쇄미율은 통일계가 높았으나 미강률은 큰 차이가 없었으며 벼에서 쌀까지의 도정률은 현미의 용적중, 제현율 및 현백률이 높은 품종이 요구되고 현미의 쇄립률, 심복백립률, 왕겨율, 쇄미율 및 미강률이 낮은 품종은 쌀의 품위 및 수율이 향상되었다.

• Design & Manufacturing
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• 제11권3호
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• pp.8-12
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• 2017

In general, metallic bio-materials is more widely used in solid tissue like bone or tooth than flexible tissue such as skin or muscle. Especially, Cobalt Chrome Molybdenum(Co-Cr-Mo), which is used in tooth surgery, has a great corrosion resistance. Because this bio-material is non-toxic in human body, and has a bio-compatibility that the vital reaction is not occurred with tissue in body. However the chemical reaction is occurred by fatal matter that deteriorate the property of material surface in conventional polishing, and it can affect to fatal disease in human body or decrease the material properties such as hardness, yield strength or bio-compatibility. This surface in poor condition can cause development of corrosion or bacteria. In this study, MR fluid polishing is used to minimize the scratch, pit or surface flaws generated in conventional polishing. Surface roughness is measured according to the polishing condition to obtain fine surface condition.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1265-1268
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• 2005

Due to the increase of the need for reliable high density information storage devices, the demand for precise machining of the slider in HDD is rapidly growing. The present fabrication process of slider bears some serious problems such as low yield ratio in mass production, which is mainly caused by inefficient machining processes in shaping camber and crown on the slider. In order to increase slider yield ratio in HDD, a new systematic machining process is proposed and developed in this work. This new machining process includes the use of magnetorheological (MR) fluid, a smart polishing material generally used for ultra-fine surface finishing of micro structures. It is shown that the process proposed in this work enables to make camber and crown pattern in the scale of few tens of nanometers. Experiment results shows that the MR polishing can be also used for shaping process of micro structures.

• 디지털콘텐츠학회 논문지
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• 제3권1호
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• pp.113-122
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• 2002

반도체와 관련한 실리콘웨이퍼의 평탄도는 양질의 웨이퍼를 보증하는 가장 중요한 요소이다. 따라서 평탄도(flatness)를 측정하고 제어하는 Polishing이라는 공정은 웨이퍼 생산의 여러 라인중 특별히 중요시 되는 과정이며 현재 이 공정에서는 담당 엔지니어가 웨이퍼의 모형을 모니터에서 육안으로 관찰하여 판단하고 평탄도를 높이기 위한 제어를 하고 있다. 그러나 사람에 의한 것이므로 많은 경험이 필요하고 일일이 체크해야하는 번거로움이 있다. 본 연구는 이러한 비효율적인 작업의 효율화를 위해 이루어 졌으며 Polishing 공정에 있어 평탄도를 사람이 아닌 시스템에 의해 자동으로 측정하여 제어하는 알고리즘을 제안한다. 여기서 제안한 시스템은 보간 다항식을 이용하여 웨이퍼 전역의 두께를 추정하고 Polishing공정에서 평탄도를 높이기 위해 제어 가능한 모형별로 분류할 수 있도록 하였다.