• Journal of the Korean Solar Energy Society
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• v.39 no.5
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• pp.65-78
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• 2019

In this study, we investigated the paraffin encapsulation using double-walled encapsulation technique. The first encapsulation used methyl methacrylic acid as the main component in acrylic polymer and the second encapsulation used melamine polymer. Particles size and distribution of the capsules were analyzed using scanning electron microscopy. In the first encapsulation, the stable capsules were obtained at 67% of phase change material ratio to methyl methacrylic acid monomer and the size of the capsule was from 0.2 to $0.3{\mu}m$. In the second encapsulation, the size of the capsules was almost the same with those capsules prepared in the first encapsulation. The particle size of single wall and double wall was about $0.3{\mu}m$. As a result of the encapsulation of paraffin using double-walled encapsulation technique, it was confirmed that the particle size was determined in the process of encapsulating using the acrylic polymer at the first wall material, and the physical and thermal stability of the capsules were imparted using melamine at the secondary wall material.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.4
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• pp.443-447
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• 2004

In this study, we investigated the necessity of encapsulation layer to maximize flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer han a significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that han a significant effect on internal thermal stress. To compare the magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.1-4
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• 2017

Encapsulation of organic based devices is essential issue due to easy deterioration of organic material by water vapor. Atomic layer deposition (ALD) is a promising solution because of its low temperature deposition and quality of the deposited film. Moisture permeation has a mechanism to pass through defects, Thin Film Encapsulation using inorganic / organic / inorganic hybrid film has been used as promising technology. $Al_2O_3$ / Polymer / $Al_2O_3$ multilayer film has shown excellent environmental protection characteristics despite of thin thicknesses of the films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.473-476
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• 2003

This paper shows necessity of encapsulation layer to maximite flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer have an significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that have a significant effect on internal thermal stress. To compare magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.26-34
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• 2016

In this study, core-crosslinked amphiphilic polymer (CCAP) nanoparticles prepared using a reactive amphiphilic polymer precursor (RARP) were used for preparing some valuable compounds encapsulated polymer nanoparticles with high payload through nanoprecipitation process. Various solvents (acetone, ethanol, and THF) having different polarity and CCAP nanoparticles prepared using different amphiphilicity were used for the preparation of ${\alpha}$-tocopherol encapsulated polymer nanoparticles to investigate their effects on the encapsulation efficiency, payload, nanoparticle size, and stability. CCAP dissolved in hydrophobic solvent, THF, could form ${\alpha}$-tocopherol encapsulated polymer nanoparticles dispersed in water with the high payload of ${\alpha}$-tocopherol and encapsulation efficiency. Because of their physically and chemically robust nano-structure originated from crosslinking of the hydrophobic core, CCAP nanoparticles could encapsulate ${\alpha}$-tocopherol with the high payload (33 wt%) and encapsulation efficiency (97%), and form 70 nm-sized stable nanoparticles in water.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.137-142
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• 2011

Individual solar cells must be connected together to give the appropriate current and voltage levels and they must also be protected from damage by the environment. [1] PV module consists of a glass/ polymer encapsulation/ solar cell string/ polymer encapsulation/ back sheet. Usually, encapsulation materials is used EVA(ethylene vinyl acetate), PVB(polyvinyl butyral), PO(polyolefin)sheet. This study is about fabrication of module using silicone material instead of above them. We got to know advantage that is fabrication time and efficiency of modules.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.825-827
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• 2002

The polymer encapsulation of white inorganic $TiO_2$ pigment particles was prepared by a two stage dispersion polymerization technique for applications in electrophoretic displays (EPDs). In order to give functionality for inorganic pigment particles in the EPD, we have investigated the density of the polymer encapsulated $TiO_2$ particles. The average density of the polymer encapsulated $TiO_2$ particles was 2.2 at 25$^{\circ}C$. The average density of the polymer encapsulated $TiO_2$ particles is suitable to 1.7, due to density matching with suspending media. Therefore, we will attempt density compatibility of dispersion polymerization technique for encapsulation of $TiO_2$ particles in suspending media.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1034-1037
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• 2006

We have developed a novel thin film encapsulation method for thin-cathode OLED by introducing organic (not polymer)/inorganic multiple thin films to protect device, which is shown to slow down the permeation rate of moisture and oxygen. From the stability test of devices, the projected lifetime of thin-cathode OLED device with thin film encapsulation was similarly to that with glass lid encapsulation.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.167-167
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• 2006

Photo-/electroactive donor-acceptor (D-A) chromophores were synthesized and investigated for energy- and electron-transfer (ET/eT) properties, for which the chromophores are supramolecularly integrated by encapsulation with helical amylose, rendering the chromophores aggregation-free and rigidified along the helical axis and thus, a remarkably enhanced fluorescence intensity. Fluorescence quenching studies indicated that the helical encapsulation gives the ET/eT a clear D-A distance dependence unlike with the encapsulation-free counterparts, being reflected in their florescence decay profile. Another notable difference is that the helical supramolecule of the chromophores forms a perpendicularly oriented self-assembly. Transport behavior in the solid state will be also discussed.

• Polymer(Korea)
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• v.35 no.3
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• pp.254-259
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• 2011

In electrospraying of polymer solutions, metal sample collectors are often ineffective in fully removing solvent from sprayed particles and recovering redispersable sprayed particles. Herein, a novel electro spraying system, where sprayed particles were dispersed into laminar flow of dispersant (coagulation liquid), was designed for the nano-encapsulation of protein drugs. Chitosan and polyacrylic acid were used as the encapsulation materials. Aggregation of particles could be prevented by using this new electrospraying system, and unimodal size distribution was observed at an applied voltage between 4~16 kV and a low flow rate. The effects of the applied voltage on mean particle size were not significant on the other hand.