• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.4
• /
• pp.71-77
• /
• 2011

Main parameters of the screen printing were determined and the printing parameters were optimized for 0402, 0603, and 1005 chips in this study. The solder pastes used in this study were Sn-3.0Ag-0.5Cu and Sn-0.7Cu. The process parameters were stencil thickness, squeegee angle, printing speed, stencil separating speed and gap between stencil and PCB. The printing pressure was fixed at 2 $kgf/cm^2$. From ANOVA results, the stencil thickness and the squeegee angle were determined to be main parameters for the printing efficiency. The printing efficiency was optimized with varying two main parameters, the stencil thickness and the squeegee angle. The printing efficiency increased as the squeegee angle was lowered under 45o for all chips. For the 0402 and the 0603 chips, the printing efficiency increased as the stencil thickness decreased. On the other hand, for the 1005 chip, the printing efficiency increased as the stencil thickness increased.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.1
• /
• pp.26-32
• /
• 2012

In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.

• ETRI Journal
• /
• v.42 no.2
• /
• pp.272-281
• /
• 2020

Three-dimensional (3D) selfie services, one of the major 3D printing services, print 3D models of an individual's face via scanning. However, most of these services require expensive full-color supporting 3D printers. The high cost of such printers poses a challenge in launching a variety of 3D printing application services. This paper presents a stencil-based 3D facial relief creation method employing a low-cost RGBD sensor and a 3D printer. Stencil-based 3D facial relief is an artwork in which some parts are holes, similar to that in a stencil, and other parts stand out, as in a relief. The proposed method creates a new type of relief by combining the existing stencil techniques and relief techniques. As a result, the 3D printed product resembles a two-colored object rather than a one-colored object even when a monochrome 3D printer is used. Unlike existing personalization-based 3D printing services, the proposed method enables the printing and delivery of products to customers in a short period of time. Experimental results reveal that, compared to existing 3D selfie products printed by monochrome 3D printers, our products have a higher degree of similarity and are more profitable.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.20 no.2
• /
• pp.31-43
• /
• 2002

Screen printing is a stencil process whereby ink is transferred to the substrate through a stencil supported by a fine fabric mesh. Therefore screen had a tendency to distort and swell, as ink was deposited between the fibers, and were difficult to clean. The tow importance of stencil parameters that affect print quality are stencil thread diameter and the fabric thickness because of their influence on both ink deposit and print definition. Since screen printing inks can be formulated to adhere to almost any surface, and the printing process itself can be handled almost any substrate in a wide variety of shape, screen printing is a very versatile process. The small size pronting is reproduced image used screen printing because the surface of substrates is not suited at screen printing method. In screen printing, the need of high definition printing is gradually increasing according to developing special inks. A conventional haftone, so called AM screening, is simple and easy to implement, but the haftone dot patterns by using this method are not free for the moire fringe. This paper is used densitometry and image analysis to investigate relation with printing according to screen mesh, opening size and resolution of copy in image reproduction used FM screen. We had the good result of dot gain and tone reproduction on the screen printing of high definition using FM screen.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.1
• /
• pp.47-53
• /
• 2010

In this study, analyses on the stencil printing using solder paste were carried out. The key design parameters in the stencil printing process are printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of physical properties of solder paste such as viscosity, surface tension, and contact angle on the stencil printing process were investigated. The analyses were performed for simple geometry and boundary conditions. In the analysis, solder paste was pushed into a stencil hole by pressure instead of printer pad. Considering the geometry and computational efficiency, axisymmetric analyses were adopted. A commercial software (COMSOL), which is well known in the area of micro-fluids analysis, was used. From the results, it was shown that viscosity of solder paste had an effect on the filling speed, while surface tension and contact angle had an effect on the filling shape.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.6
• /
• pp.483-489
• /
• 2014

In this study, experiments were conducted for micro pattern printing to combine solution atomization process and stencil printing based on electrospray deposition. The stencil mask fabricated by etching the photosensitive glass placed below 0.3 mm distance to substrate has 100 um line width. The process parameters of electrospray deposition system for the atomization of the solution are applied voltage and supply flow rate of the solution. Meniscus angle of cone-jet was optimized by varying the supply flow rate from 0.3 ml/hr to 0.7 ml/hr. Voltage condition was verified having symmetric cone-jet angle and no pulsation at 8.5 kV applied voltage. In addition, a number of micro patterns are printed using a single 1 step process by solution atomization process. Variable line width of approximate 100 um was confirmed by changing conditions of solution atomization regardless of the pattern size of stencil mask.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.3
• /
• pp.408-414
• /
• 2012

Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.28 no.1
• /
• pp.65-75
• /
• 2010

Environmentally friendly, stencil and screen printing for cost-effective for maskless. In this study, UV -LED light source for the dispersion characteristics and high competence photoresist coating was prepared. Wavelength of 365nm UV-LED exposure device using the maskless lithography, 1.7kgf/$cm^2$ $2600mmH_2O$ the injection pressure and the suction pressure by using a dry photoconductor symptoms were dry emulsion on the market as a result, curing properties and adhesion, hardness, solvent resistance and excellent reproduction of fine patterns and ecological stencil technology was available and could be confirmed as a possibility.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.4
• /
• pp.83-89
• /
• 2014

Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.115-118
• /
• 2001