• The Journal of the Convergence on Culture Technology
• /
• v.9 no.6
• /
• pp.957-966
• /
• 2023

In this paper, we propose a new real-time adaptive PID temperature control technique. This is a technique that prevents overshoot by introducing a model that represents the control object. To prevent excessive integration that causes overshoot, integral control adjusts the integral gain to track the heat loss of the model in real time. In the conventional PID control, the integration was dependent on proportional control and the gain was fixed to a constant. As a result, applying two gains that mismatch each other could cause excessive overshoot. However, the proposed adaptive control actively eliminates overshoot so that the integral control amount does not always exceed the heat loss. The cause of overshoot in PID control is integration. Basically, proportional control does not cause overshoot. Therefore, according to the proposed technique, adaptive PID control without the need for tuning experiments can be realized.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2000.04a
• /
• pp.53-58
• /
• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it requires a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis considering the exothermic reaction. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.24 no.11
• /
• pp.2853-2865
• /
• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it takes a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20 mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one, and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• Progress in Superconductivity and Cryogenics
• /
• v.20 no.4
• /
• pp.65-69
• /
• 2018

Due to large in-field current carrying capacity and strong mechanical strength, a REBCO wire has been regarded as a viable high temperature superconductor (HTS) option for high field MRI and > 1 GHz (>23.5 T) NMR magnets. However, a REBCO magnet is well known to have an inherent problem of field inhomogeneity, so-called 'Screening Current induced magnetic Field (SCF)'. Recently, 'field shaking' and 'current overshoot operation' techniques have been successfully demonstrated to mitigate the SCF and enhance the field homogeneity by experiments. To investigate the effectiveness of current overshooting operation technique, a numerical simulation is conducted for a test REBCO magnet composed of a stack of double pancake coils using '2D edge-element magnetic field formulation' combined with 'domain homogenization' scheme. The simulation result demonstrates that an appropriate amount of current overshoot can negate the SCF. To verify the simulation results, current overshoot experiments are conducted for the REBCO magnet in liquid nitrogen. Experimental results also demonstrate the possible application of current overshoot technique to mitigate the SCF and enhance the field homogeneity.

• Transactions of Materials Processing
• /
• v.10 no.7
• /
• pp.565-572
• /
• 2001

It is well known that a multicomponent $Zr_{4l.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ bulk metallic glass alloy shows good bulk glass forming ability due to its high resistance to crystallization in the undercooled liquid state. DSC and XRD have been performed to confirm the amorphous structure of the master alloy. To investigate the mechanical properties and deformation behavior of the bulk metallic $Zr_{4l.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy, a series of compression tests has been carried out at the temperatures ranging from $351^{\circ}C$ to $461^{\circ}C$at the various initial strain rates from $2{\times}10^4s^1$ to $2{\times}10^2s^1$. Three types of nominal stress-strain curves have been identified such as linear stress-strain relationship meaning fracture at maximum stress, plastic deformation including stress overshoot and steady-state flow, plastic deformation without stress overshoot depending on the strain rate and test temperature. Also DSC analysis for the compressed specimens was carried out to investigate the change of structure, thermal stability and crystallization behavior for the various test conditions.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.10 no.6
• /
• pp.861-869
• /
• 1986

A numerical study has been conducted on the development of the velocity and temperature fields in a laminar flow through an eccentric annular duct. A bipolar coordinates system is adopted, and a numerical program is developed to analyze 3-dimensional parabolic flow problems. In the analysis of the velocity field, the entrance length has been defined as the distance where the axial pressure gradient is greater than that of the developed velocity field by 5%. The dimensionless hydrodynamic entry length increases with increasing eccentricity. In the transverse flow fields, the reverse flow region along the wall due to the developing axial velocity near the entrance of the duct is found. In the analysis of the temperature field, the thermal entry length has been defined as the axial distance where the mean fluid temperature is 5% less than that of the developed temperature field. The dimensionless thermal entry length increases as eccentricity or Prandtl number increases. The overshoot of the mean Nusselt number over the developed value at the zero-temperature wall is encountered, and the rate of the overshoot increases with the increase of the eccentricity and Prandtl number.

• Journal of the Korean Society of Propulsion Engineers
• /
• v.6 no.2
• /
• pp.53-63
• /
• 2002

The steady-state and transient performance simulation program for a turboprop engine(PT6A-62) was developed. Specially this program included some algorithms, such as flat-rated behaviors in performance and limit control algorithms to prevent the compressor surge and the compressor-turbine inlet limit temperature overshoot. In order to minimize analysis errors, on interpolation method in component characteristics using matching errors and specific heat and specific heat ratio, which are functions of temperatures were used. The developed steady state performance analysis program can handle various conditions such as altitude, bleed extraction, inlet temperature and pressure and part throttle, and the transient performance analysis program incorporated a general mode for transient simulation and a control mode for prevention of the compressor surge and the turbine inlet limit temperature overshoot.

• 제어로봇시스템학회:학술대회논문집
• /
• 2000.10a
• /
• pp.62-62
• /
• 2000

An auto-tuning PID controller which is adequate for temperature control is developed based on relay-control and pole-placement Using the critical frequency which is obtained from relay-control parameters of assumed model are identified. Pole/zero-placement PID controller is designed for the identified model. The desired pole/zeros are determined so that the closed-loop has overshoot free step response. The developed auto-tuning PID controller was successfully applied to the temperature control of RTP.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.8 no.2
• /
• pp.115-120
• /
• 2008

Carrier velocity in the MOSFET channel is the main driving force for improved transistor performance with scaling. We report measurements of the drift velocity of electrons and holes in silicon inversion layers. A technique for extracting effective carrier velocity which is a more accurate extraction method based on the actual inversion charge measurement is used. This method gives more accurate result over the whole range of $V_{ds}$, because it does not assume a linear approximation to obtain the inversion charge and it does not limit the range of applicable $V_{ds}$. For a very short channel length device, the electron velocity overshoot is observed at room temperature in 37 nm MOSFETs while no hole velocity overshoot is observed down to 36 nm. The electron velocity of short channel device was found to be strongly dependent on the longitudinal field.

• 제어로봇시스템학회:학술대회논문집
• /
• 1997.10a
• /
• pp.77-80
• /
• 1997

In this paper presented is a temperature controller for a semiconductor test handler. Using ARMAX model and least square method, the chamber model for the design of a controller is identified through experiment. With the identified model an LQG/LTR controller is designed. Experiment with a real test handler demonstrated good performance in that its overshoot is small and response time is fast.