• Journal of Technologic Dentistry
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• v.30 no.2
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• pp.17-22
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• 2008

The purpose of this study was to observe the thermal expansion of the inlay waxes at temperature. Inlay pattern wax shows not only a high coefficient of expansion but also a tendency to warp or distort when allowed to stand unrestrained. The thermal expansion of inlay waxes was tested according to the treatment conditions for 10 minutes at $40^{\circ}C$ The thermal expansion of inlay waxes at various temperatures was measured with an electro dial gauge. The results were as fellows: 1. It is shown that the rate of thermal expansion of wax A is 0.2%, wax B is 0.29%, wax C is 0.38%, and wax D is 0.22% at $40^{\circ}C$ 2. It is shown that the coefficient of thermal expansion of wax A is $106{\times}10^{-6}/^{\circ}C$, wax B is $152{\times}10^{-6}/^{\circ}C$, wax C is $199{\times}10^{-6}/^{\circ}C$, and wax D is $116{\times}10^{-6}/^{\circ}C$ at $40^{\circ}C$ 3. The thermal expansion of the inlay waxes at $40^{\circ}C$ was shown to increase in the order of wax C, B, D, A.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 2000.06a
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• pp.179-193
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• 2000

Aluminium titanate (Al₂TiO5) with an excellent thermal shock resistant and a low the expansion coefficient was obtained by solid solution with MgO, SiO₂, and ZrO₂ in the Al₂TiO5 lattice or in the grain boundary solution through electrofusion in an arc furnace. However, these materials have low mechanical strength due to the presence of microcracks developed by a large difference in thermal expansion coefficients along crystallographic axes. Pure Al₂TiO5 tends to decompose into α-Al₂O₃ and TiO₂-rutile in the temperature range of 750-1300℃ that rendered it apparently useless for industrial applications. Several thermal shock tests were performed: Long therm thermal annealing test at 1100℃ for 100h; and water quenching from 950 to room temperature (RT). Cyclic thermal expansion coefficients up to 1500℃ before and after decomposition tests was also measured using a dilatometer, changes in the microstructure, thermal expansion coefficients, Young's modulus and strengths were determined. The role of microcracks in relation to thermal shock resistance and thermal expansion coefficient is discussed.

• Journal of Industrial Technology
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• v.23 no.A
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• pp.157-163
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• 2003

The properties of mechanics and durability of LMC have been performed actively. However, little studies on analysis and properties of thermal expansion has been on the temperature variation. Especially, the low of bonding strength and tensile cracking are caused by difference of thermal expansion between LMC and the substrate concrete. Therefore, this study focused on effect of thermal expansion behavior and properties of LMC according to temperature variation. To identify the property of thermal expansion of LMC, tests of modulus of thermal expansion were carried out at 28 days after casting specimen, subjected to temperature variation between $10^{\circ}C$ and $60^{\circ}C$. The results of this study showed the modulus of elastic of LMC was similar to that of ordinary portland concrete(OPC). It means that stresses caused by difference of modulus of elastic did not occur on interface between LMC and existing concrete. The modulus of thermal expansion of LMC had a little smaller than that of OPC. The modulus of thermal expansion of polymer modified concrete is generally larger than OPC, but the result of this test is disagree with the fact, which may be due to the humidity evaporation difference and aggregate properties.

• Composites Research
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• v.25 no.1
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• pp.26-30
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• 2012

This study was focused on the measurement of thermal expansion coefficients for GRP pipe through strain gage circuits. First of all, thermal expansion coefficients of aluminum beam were measured to examine the validity of the suggested method by using various types of strain gage circuits. Thermal expansion coefficients of GRP pipes along axial and hoop directions were measured to investigate the effect of the location of strain gages, number of repeated measurements, and strain gage types with different thermal expansion coefficients on the thermal strains and the repeatability of measured results. According to the results, thermal expansion coefficients of GRP pipes along hoop direction were lower than those along axial direction due to the constraint effect of reinforced glass fibers on thermal strains along hoop direction. As measurements were repeated, thermal expansion coefficients of GRP pipes were slightly increased, but the degree of increase became smaller. Finally, the same thermal expansion coefficients were obtained irrespective of different types of strain gages with different thermal expansion coefficients if thermal strains of strain gages were compensated by using reference compensation specimen.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.14-14
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• 2011

Graphene is known to possess excellent thermal properties, including high thermal conductivity, that make it a prime candidate material for heat management in ultra large scale integrated circuits. For device applications, the key parameters are the thermal expansion coefficient and the thermal conductivity. There has been no reliable experimental determination on the thermal expansion coefficient of graphene whereas the estimates of the thermal conductivity vary widely. In this work, we estimate the thermal expansion coefficient of graphene on silicon dioxide by measuring the temperature dependence of the Raman spectrum. The shift of the Raman peaks due to heating or cooling results from both the intrinsic temperature dependence of the Raman spectrum of graphene and the strain on the graphene film due to the thermal expansion mismatch with silicon dioxide. By carefully comparing the experimental data against theoretical calculations, it is possible to determine the thermal expansion coefficient. The thermal conductivity is measured by estimating the thermal profile of a graphene film suspended over a circular hole of the substrate.

• International Journal of Highway Engineering
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• v.15 no.6
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• pp.25-32
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• 2013

PURPOSES : The purpose of this study is to provide the method of how to measure the coefficient of thermal expansion of concrete using temperature compensation principle of electrical resistance strain gauge. METHODS : The gauge factor compensation method and thermal output(temperature-induced apparent strain) correction method of self-temperature compensation gauge were investigated. From the literature review, coefficient of thermal expansion measurement method based on the thermal output differential comparison between reference material(invar) and unknown material(concrete) was suggested. RESULTS : Thermal output is caused by two reasons; first the electrical resistivity of the grid conductor is changed by temperature variation and the second contribution is due to the differential thermal expansion between gauge and the test material. Invar was selected as a reference material and it's coefficient of thermal expansion was measured as $2.12{\times}10^{-6}m/m/^{\circ}C$. by KS M ISO 11359-2. The reliability of the suggested measurement method was evaluated by the thermal output measurement of invar and mild steel. Finally coefficient of thermal expansion of concrete material for pavement was successfully measured as $15.45{\times}10^{-6}m/m/^{\circ}C$. CONCLUSIONS : The coefficient of thermal expansion measurement method using thermal output differential between invar and unknown concrete material was evaluated by theoretical and experimental aspects. Based on the test results, the proposed method is considered to be reasonable to apply for coefficient of thermal expansion measurement.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.355-356
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• 2009

The change of thermal expansion and mechanical behaviors by cold working has been investigated in Fe-29%Ni-17%Co low thermal expansion Kovar alloy. Fe-29%Ni-17%Co alloy was cold rolled gradually and prepared to plates having reduction ratio of 0%, 20%, 40%, 60%, and 80%. Annealing effect on the properties was also studied. Thermal expansion was measured from $25^{\circ}C$ to $600^{\circ}C$ with a heating rate of $5^{\circ}C$/min by using vacuum differential dilatometer. It was found that thermal expansion coefficient ($\alpha_{30{\sim}400}$) slightly decreased (reduction ration of 20%) and then remarkably increased (above reduction ration of 40%) with increasing reduction ratio of cold rolling. Thermal expansion coefficient ($\alpha_{30{\sim}400}$) was sharply decreased after annealing heat-treatment. Yield and tensile strengths were continuously increased and elongation was decreased by cold roiling. Microstructural observation and X-ray diffraction analysis results showed that the $\alpha$ phase significantly increased as the reduction ratio increased. The slight decrease of thermal expansion coefficient bellow reduction ration of 20% could be explained by the destroying short-range ordering and the decreasing of grain size. The significant increase of thermal expansion coefficient with cold rolling mainly attributed to the appearance of $\alpha$ phase. The correlation between the microstructural cause and invar phenomena for the low thermal expansion behavior was also discussed.

• Journal of the Korean Ceramic Society
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• v.24 no.5
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• pp.411-416
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• 1987

Thermal expansions and thermal expansion coefficients of cordierite ceramics reinforced by SiC whiskers up to 40 vol. % were investigated. The composite specimens were hot pressed at 1523K for 30 min under 28.5 MPa pressing pressure in Ar atmosphere. Thermal expansions of the hot pressed composites were measured using a differential dilatometer up to 1262 K in air. Thermal expansions and thermal expansion coefficient of the composites increased with SiC whisker content. Thermal expansion behaviors of the composites were well explained by modelling parallel slabs randomly distributed on the whisker plane as the microstructural element of the composites.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1064-1069
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• 2010

Thin films have been used in a large variety of technological applications such as solar cells, optical memories, photolithographic masks, protective coatings, and electronic contacts. If thin films experience frequent temperature changes, thermal stresses are generated due to the difference in the coefficient of thermal expansion between the film and substrate. Thermal stresses may lead to damage or deformation in thin film used in electronic devices and micro-machined structures. Thus, knowledge of the thermomechanical properties of thin films, such as the coefficient of thermal expansion, is an important issue in determining the stability and reliability of the thin film devices. In this study, thermal cycling of Cu and Ag thin films with various microstructures was employed to assess the coefficient of thermal expansion of the films. The result revealed that the coefficient of thermal expansion (CTE) of the Cu and Ag thin films increased with an increasing grain size. However, the effect of film thickness on the CTE did not show a remarkable difference.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.4
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• pp.81-85
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• 2007

A safety valve is used for protecting the pressure vessel and facilities by discharging the operating fluid into the valve from the accident when the pressure is over the designated value. The fluid is sulfurous acid and nitric acid. etc. in the semi-conductor assembly line. Thus the valve elements material must be acid resistance. Teflon, which is used generally as inner parts of a valve, tends to easily sticks to sliding surface by thermal expansion under high temperature. Some studies are performed to change teflon to another material and shape to have a better fluidity under the condition. The analysis of the thermal expansion is conducted by commercial FEM software to improve the problems. Boundary conditions were temperature and load in this study. From the analysis, the thermal expansion of stainless steel is verified to be lower than that of teflon under high temperature. Thus coupled teflon/stainless steel-made valve is applied to assembly line without danger due to thermal expansion.