• Title/Summary/Keyword: thermal residual stress

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Thermal Viscoelastic Analysis of Plastic Part Considering Residual Stress (온도 및 잔류응력을 고려한 플라스틱 부품의 점탄성 해석)

  • Moon, H.I.;Kim, H.Y.;Choi, C.W.;Jeong, K.S.
    • Transactions of Materials Processing
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    • v.17 no.7
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    • pp.496-500
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    • 2008
  • Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But plastic parts are usually distorted after injection molding due to the residual stress after filling, packing, cooling process, and etc. And plastic material is to be deteriorated according to various temperature conditions and operating time, which can be characterized by stress relaxation and creep. The viscoelastic behavior of plastic materials in time domain can be expressed by the Prony series of the commercial code, ABAQUS. In the paper, the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.

Thermal Viscoelastic Analysis of Plastic Part Considering Residual Stress (온도 및 잔류응력을 고려한 플라스틱 부품의 점탄성 해석)

  • Moon, H.I.;Kim, H.Y.;Choi, C.W.;Jeong, K.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.05a
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    • pp.288-292
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    • 2008
  • Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But plastic parts are usually distorted after injection molding due to the residual stress after filling, packing, cooling process, and etc. And plastic material is to be deteriorated according to various temperature conditions and operating time, which can be characterized by stress relaxation and creep. The viscoelastic behaviour of plastic materials in time domain can be expressed by the Prony series of the commercial code, ABAQUS. In the paper, the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.

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Fatigue Life Evaluation on Compressive & Tensional Residual Stress Induced Materials and Residual Stress Measurement using Hole Drilling Method (HDM을 이용한 잔류응력측정과 압축·인장 잔류응력이 인가된 재료의 피로수명평가)

  • Baek, Seung Yeb
    • Journal of Welding and Joining
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    • v.31 no.2
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    • pp.43-48
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    • 2013
  • This paper Investigated the characteristics of residual stress in weld is composed of typical specimens, are investigated by using three dimensional thermal elasto-plastic FEM analysis. Numerically calculated residual stresses in the gas welds were then compared with experimental results obtained by the hole-drilling method. Using the stress amplitude (${\sigma}a$)R at the hot spot point of gas weld, the relations obtained as the fatigue test results for typical specimens having various dimensions and shapes were systematically rearranged to obtain the (${\sigma}a$)R-Nf relationship. It was found that more systematic and accurate evaluation of the fatigue strength of plug- and ring-type gas-welded joints can be achieved by using (${\sigma}a$)R.

Effects of Contact Damage and Residual Stress in Dental Layered Ceramics (치아응용을 위한 층상 세라믹스에서의 접촉손상 및 잔류응력의 영향)

  • 정종원;최성철
    • Journal of the Korean Ceramic Society
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    • v.37 no.3
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    • pp.288-293
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    • 2000
  • Effects of contact damage and residual stress for two kinds of dental restorative layered ceramics, porcelain/alumina and porcelain/zirconia bilayers, were observed with Hertzian and Vickers indentation methods. Indentation stress-strain behavior of each material, strength degradation of the coating material, and crack propagation behavior in the coating layer after Vickers indentation were examined by an optical microscope. As a result, porcelain as coating materials showed the classical brittleness. It was inferred that damage and strength in two bilayer system were dependent on thermal expansion mismatch between the coating material and the substrate, which affected the strength degradation. Residual stress resulting from thermal expansion mismtch was formed in the coating layer, and specially in the case of porcelain/zirconia, residual stress was eliminated as coating thickness decreased.

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The Effect of Welding Residual Stress on Whole Structure with T-Joint RHS

  • Rajesh S. R.;Bang H. S.;Kim H.
    • International Journal of Korean Welding Society
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    • v.5 no.1
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    • pp.60-65
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    • 2005
  • In the field of welding the mechanical behavior of a welded structure under consideration may be predicted via heat transfer and welding residual stress analysis. Usually such numerical analyses are limited to small regular mesh models or test specimens. Nevertheless, there is very few strength assessment of the whole structure that includes the effect of welded residual stress. The present work is based on the specialized finite element codes for the calculation of nonlinear heat transfer details and residual stress including the external load on the welded RHS (Rectangular Hollow Section) T-joint connections of the whole structure. First the thermal history of the combined fillet and butt-welded T-joint equal width cold-formed RHS are calculated using nonlinear finite element analysis (FEA) considering the quarter model of the joint. Then using this thermal history the residual stress around the joints has been evaluated. To validity the FEA result, the calculated residual stresses were compared with the available experimental results. The residual stress obtained from the quarter model is mapped to the full model and then to the whole structure model using FEM codes. The results from the FEM codes were exported to the commercial package for visualization and further analysis applying loads and boundary conditions on the whole structure. The residual stress redistribution along with the external applied load is examined computationally.

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A study on the Thermal Stress Distribution for Wire Electrical Discharge by Finite Element Method (와이어 방전 가공 시 발생되는 열응력 분포에 관한 유한요소법적 고찰)

  • 반재삼;김승욱;김선진;조규재
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.210-213
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    • 2002
  • The Purpose of this study is to know temperature and thermal stress distribution in specimens during processing of WEDM. If it is constant to the cutting speed and the thickness of material, it is very important to the effect of temperature and the thermal stress distribution after cutting processing. This paper show the analysis result of the distribution of temperature and the residual stress along the direction of thickness before processing of WEDM and after when the cooling temperature is$20^{\circ}C$. The maximum temperature of edge of specimens is $1600^{\circ}C$. It has little temperature gradient in the depth which is 5mm away from edge of specimens. Equivalent residual stress is result in 180.7 MPa at maximum temperature.

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Study for Thermal Stability of Liquid Crystal Device (액정 소자의 열적 안전성에 관한 연구)

  • 이상극;황정연;서대식;이준웅
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.4
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    • pp.439-442
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    • 2004
  • In this study, we investigated about electrooptics characteristic of three kinds of TN cell on the polyimide surface. Monodomain alignments of thermal stressed TN cell over temperature of liquid crystal isotropic phase were almost the same as that of no thermal stressed TN cells. However, the thermal stressed TN cells have many defects. Also, threshold voltage and response time of thermal stressed TN cells show the same performances as no thermal stressed TN cells. There were little changes of value in these TN cells. However, transmittances of TN cells on the polyimide surface decrease with increasing thermal stress time. Finally, the residual DC voltage of the thermal stressed TN cell on the polyimide surface shows decrease of characteristics as increasing thermal stress time. Therefore, the thermal stability of TN cell was decreased by high thermal stress for the long times.

The Plane-Deformation Thermal Elasto-Plastic Analysis During Welding of Plate (평판용접에 관한 평면변형 열탄소성 해석)

  • 방한서;한길영
    • Journal of Ocean Engineering and Technology
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    • v.8 no.1
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    • pp.33-40
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    • 1994
  • Welding of structure produces welding residual stresses which influence buckling strength, brittle fracture strength and cold crack on the weld parts. Therefore, it is very important to accurately analyze the residual stress before welding in order to guarantee the safety of weldment. If the weld length is long enough compared to the thickness and the breadth of plate, thermal and mechanical behaviors in the middle portion of the plate are assumed to be uniform along the thickness direction(z-axis). Thus, the following conditions(so-called plane deformation) can be assumed for the plate except near its end;1) distributions of stress and strain are independent on the z-axis;2) plane normal to z-axis before deformation remains plane during and after deformation. In this paper, plane-deformation thermal elasto-plastic problem is formulated by being based on the finite element method. Moreover special regards and paid to the fact that material properties in elastic and plastic region are temperature-dependence. And the method to solve the plane-deformation thermal elasto-plastic problem is shown by using the incremental technique. From the results of analysis, the characterisics of distribution of welding residual stress and plastic strain with the production mechanism are clarified.

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Application of Laser Interferometry for Assessment of Surface Residual Stress by Determination of Stress-free State (무잔류 응력상태 결정을 통한 표면 잔류응력장 평가에의 레이저 간섭계 적용)

  • 김동원;이낙규;나경환;권동일
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.2
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    • pp.35-40
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    • 2004
  • The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...

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Thermal Deformation and Residual Stress Analysis of Lightweight Piezo-composite Curved Actuator (복합재료와 압전재료로 구성된 곡면형 작동기의 열변형 및 잔류응력 해석)

  • 정재한;박기훈;박훈철;윤광준
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2001.05a
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    • pp.126-129
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    • 2001
  • LIPCA (LIghtweight Piezo-composite Curved Actuator) is an actuator device which is lighter than other conventional piezoelectric ceramic type actuator. LIPCA is composed of a piezoelectric ceramic layer and fiber reinforced light composite layers, typically a PZT ceramic layer is sandwiched by a top fiber layer with low CTE (coefficient of thermal expansion) and base layers with high CTE. LIPCA has curved shape like a typical THUNDER (thin-layer composite unimorph feroelectric driver and sensor), but it is lighter an than THUNDER. Since the curved shape of LIPCA is from the thermal deformation during the manufacturing process of unsymmetrically laminated lay-up structure, an analysis for the thermal deformation and residual stresses induced during the manufacturing process is very important for an optimal design to increase the performance of LIPCA. To investigate the thermal deformation behavior and the induced residual stresses of LIPCA at room temperature, the curvatures of LIPCA were measured and compared with those predicted from the analysis using the classical lamination theory. A methodology is being studied to find an optimal stacking sequence and geometry of LIPCA to have larger specific actuating displacement and higher force. The residual stresses induced during the cooling process of the piezo-composite actuators have been calculated. A lay-up geometry for the PZT ceramic layer to have compression stress in the geometrical principal direction has been designed.

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