• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.499-505
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• 2005

We compared the effects of a representative aromatic acid amplifier, 2-hydroxy-2'-tosylory biphenyl, doped in poly(tort-butyl methacrylate) (PTBMA), poly (tetrahydropyranylmethacrylate) (pTHPMh) or poly[tert-butoxycarbonyloxystyrene) (pTBOCST) resin film as acid labile polymer in view of thermal stability and photosensitivity enhancement. The acid amplifier was stable up to 60 min in pTBMA and pTBOCST film and up to 10 min in pTHPMA film at $120^{\circ}C$. pTBMA and pTHPMA film doped with the acid amplifier showed 9 times and 3 times higher photosensitivity, respectively. But pTBOCST film showed a negligible photosensitivity enhancement. Photosensitivity enhancement and thermal stability of the acid amplifier were found to be affected by the resin.

• Journal of ILASS-Korea
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• v.21 no.2
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• pp.111-115
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• 2016

This paper experimentally reports the effect of suspension stability on the thermal conductivity of water-based Au nanofluids. For this purpose, the water-based Au nanofluids are prepared by the one-step method called electro-chemical method with volume fraction of 0.0005%. The thermal conductivity of water-based Au nanofluids is measured from $22^{\circ}C$ to $42^{\circ}C$ using the transient hot wire method. To quantify the suspension stability of Au nanofluids, the suspension stability of nanofluids is evaluated using the in-house developed laser scattering system at a fixed wavelength of 632.8nm with the elapsed time. Based on the experimental results, the both thermal conductivity and suspension stability of water-based Au nanofluids are gradually decreased according to the time. These results experimentally show that the suspension stability of water-based Au nanofluids is the one of the important factor of thermal conductivity.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.3-3
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• 2001

Recently TiN, TiAlN, CrN hardcoatings have adapted many industrial application such as die, mold and cutting tools because of good wear resistant and thermal stability. However, in terms of high speed process, general hard coatings have been limited by oxidation and thermal hardness drop. Especially in the case of PCB drill, high speed cutting and without lubricant process condition have not adapted these coatings until now. Therefore more recently, superhard nanocomposite coating which have superhard and good thermal stability have developed. In previous works, WC-TiAlN new nanocomposite film was investigated by cathodic arc ion plating system. Control of AI concentration, WC-TiAlN multi layer composite coating with controlled microstructure was carried out and provides additional enhancement of mechanical properties as well as oxidation resistance at elevated temperature. It is noted that microhardness ofWC-TiA1N multi layer composite coating increased up to 50 Gpa and got thermal stability about $900^{\circ}C$. In this study WC-TiAlN nanocomposite coating was deposited on PCB drill for enhancement of life time. The parameter was A1 concentration and plasma cleaning time for edge sharpness maintaining. The characteristic of WC-TiAlN film formation and wear behaviors are discussed with data from AlES, XRD, EDS and SEM analysis. Through field test, enhancement of life time for PCB drill was measured.

• 한국전산유체공학회:학술대회논문집
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• 2008.03b
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• pp.474-478
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• 2008

It has been shown that a nanofluid consisting of nanoparticles dispersed in base fluid has much higher effective thermal conductivity than pure fluid. In this study, four kinds of nanofluids such as multiwalled carbon nanotube (MWCNT) in water, CuO in water, SiO2in water, and CuO in ethylene glycol, are produced. Their thermal conductivities are measured by a transient hot-wire method. The thermal conductivity of water-based MWCNT nanofluid is shown to be increased by up to 11.3% at a volume fraction of 0.01. The measured thermal conductivities of MWCNT nanofluids are higher than those calculated with Hamilton-Crosser's model due to neglecting solid-liquid interaction at the interface. The results show that the thermal conductivity enhancement of nanofluids depends on the thermal conductivities of both particles and the base fluid. Stability of nanofluids is estimated by UV-vis spectrum analysis. Stability of nanofluid depends on the type of base fluid and the suspended particles. Also it can be improved in addition of a surfactant.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.376-376
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• 2012

Semiconductor nanowires (NWs) are future building block for nano-scale devices. Especially, Ge NWs are fascinated material due to the high electrical conductivity with high carrier mobility. It is strong candidate material for post-CMOS technology. However, thermal stability of Ge NWs are poor than conventional semiconductor material such as Si. Especially, when it reduced size as small as nano-scale it will be melted around CMOS process temperature due to the melting point depression. Recently, Graphene have been intensively interested since it has high carrier mobility with single atomic thickness. In addition, it is chemically very stable due to the $sp^2$ hybridization. Graphene films shows good protecting layer for oxidation resistance and corrosion resistance of metal surface using its chemical properties. Recently, we successfully demonstrated CVD growth of monolayer graphene using Ge catalyst. Using our growth method, we synthesized Ge/graphene core/shell (Ge@G) NW and conducted it for highly thermal stability required devices. We confirm the existence of graphene shell and morphology of NWs using SEM, TEM and Raman spectra. SEM and TEM images clearly show very thin graphene shell. We annealed NWs in vacuum at high temperature. Our results indicated that surface melting phenomena of Ge NWs due to the high surface energy from curvature of NWs start around $550^{\circ}C$ which is $270^{\circ}C$ lower than bulk melting point. When we increases annealing temperature, tip of Ge NWs start to make sphere shape in order to reduce its surface energy. On the contrary, Ge@G NWs prevent surface melting of Ge NWs and no Ge spheres generated. Furthermore, we fabricated filed emission devices using pure Ge NWs and Ge@G NWs. Compare with pure Ge NWs, graphene protected Ge NWs show enhancement of reliability. This growth approach serves a thermal stability enhancement of semiconductor NWs.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.157-157
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• 2010

Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.

• 한국생물공학회:학술대회논문집
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• 2002.04a
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• pp.73-74
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• 2002

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.5
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• pp.1042-1046
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• 2007

In this study, we investigated the mechanism responsible for the thermal stability of CoSi by addition of a foreign chemical element. Addition of W was found to increase the heat of formation of CoSi. This increase was claimed to inhibit the glass formation, which is preferred by silicide formation kinetics depicted by the maximum system energy degradation rate. In this case, there forms at the interface between CoSi and Si wafer a crystalline structure, the effective diffusion coefficient of which is much less than the self-diffusion rate provided by the glass. It was stated that the phase transition requires a higher thermal energy as the consequence, thereby enhancing the thermal stability of CoSi.

• Applied Chemistry for Engineering
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• v.16 no.2
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• pp.262-266
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• 2005

We compared the effects of a representative aliphatic acid amplifier, 4-hydroxy-4'-p-tosyloxy isopropylidene dicyclohexane, doped in poly[tert-butyl methacrylate] (pTBMA), poly[tetrahydropyranyl methacrylate] (pTHPMA) or poly[tert-butoxycarbonyloxystyrene] (pTBOCST) resin film as acid labile polymer in view of thermal stability and photosensitivity enhancement. The acid amplifier was stable up to 20 min in pTBMA and pTBOCST film and up to 5 min in pTHPMA film at $120^{\circ}C$. pTBMA and pTHPMA films doped with the acid amplifier showed four times and two times higher photosensitivity, respectively. But pTBOCST showed negligible photosensitivity enhancement. Photosensitivity enhancement and thermal stability were found to be affected by the resin.

• Journal of the Korean Society for Heat Treatment
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• v.14 no.6
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• pp.345-349
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• 2001

This study has investigated the effect of thermal stability and mechanical property of $Fe_{80-X}P_{10}C_6B_4M_X$(X=2, 4, 6, M=transition metal) amorphous alloys fabricated by the melt-spun process. The glass transition temperature($T_g$), crystallization temperature($T_x$) and hardness increase with decreasing electron concentration (e/a) from about 7.38 to 7.18. The decrease of e/a implies the increase in the attractive bonding state between the M elements and other constituent element. The decrease in a/e leads to the enhancement of the attractive bonding state among the constituent elements which is favorable for the increase in $T_g$, $T_x$ and hardness.