• Advances in concrete construction
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• 제9권5호
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• pp.437-448
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• 2020

In high rise buildings that utilize precast large panel system for construction, the shear wall provides strength and stiffness during earthquakes. The performance of a wall panel system depends mainly on the type of connection used to transfer the forces from one wall element to another wall element. This paper presents an experimental investigation on different types of construction detailing of the precast wall to wall vertical connections under reverse cyclic loading. One of the commonly used connections in India to connect wall to wall panel is the loop bar connection. Hence for this study, three types of wet connections and one type of dry connection namely: Staggered loop bar connection, Equally spaced loop bar connection, U-Hook connection, and Channel connection respectively were used to connect the precast walls. One third scale model of the wall was used for this study. The main objective of the experimental work is to evaluate the performance of the wall to wall connections in terms of hysteretic behaviour, ultimate load carrying capacity, energy dissipation capacity, stiffness degradation, ductility, viscous damping ratio, and crack pattern. All the connections exhibited similar load carrying capacity. The U-Hook connection exhibited higher ductility and energy dissipation when compared to the other three connections.

• 콘크리트학회논문집
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• 제26권3호
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• pp.255-266
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• 2014

이 논문은 새로운 수직 접합부와 현장타설 습식 접합부를 가진 T형 프리캐스트 벽체의 내진 성능에 관한 연구이다. 반복하중을 받는 T형 PC 벽체의 하중-변위 관계, 강도, 연성도, 파괴 모드, 그리고 변형 능력에 대해 알아보았다. 실험체 주요 변수는 전단력 전달을 위한 대각 철근의 유무이다. 벽체의 양단에 위치한 길이방향 주철근이 먼저 항복을 하였고 최종 변형은 C형 접합부의 파괴에 의해 결정되었다. 그리고 전단력 전달을 위한 대각 철근은 균열 제어에 효과적인 것으로 나타났다. 단면 해석을 통해 구한 강도와 변형은 실험값과 대체로 일치하였다.

• 한국해양공학회지
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• 제6권2호
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• pp.113-124
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• 1992

The offshore industry created a need for quality wet weld repairs. Wet welding is a fast method of repair providing sound, structural quality welds. It requires less support equipment than a similar underwater dry weld repair or the alternative mechanical connections. Compared to welds made in air, underwater wet welds are plagued by increased hardness due to rapid quenching by the surrounding water. In this paper is described the experimntal study of improving the cooling rates of wet welds of TMCP steel plate by shielding around weld arc surroundings. The principal results of this experimental investigation can be summarized as follows : By shielding around weld arc surrounding, the cooling rates resulting from wet welds on TMCP steel plate could be lower than that of nonshielded wet welds and the fesibility on high quality of mecanical properties of wet weld on TMCP steel plate was carried out with shielded weld arc surrounding.

• Advances in concrete construction
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• 제9권3호
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• pp.235-248
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• 2020

Progressive collapse in a structure occurs when load bearing members are failed and the adjoining structural elements cannot resist the redistributed forces and fails subsequently, that leads to complete collapse of structure. Recently, construction using precast concrete technology is adopted increasingly because it offers many advantages like faster construction, less requirement of skilled labours at site, reduced formwork and scaffolding, massive production with reduced amount of construction waste, better quality and better surface finishing as compared to conventional reinforced concrete construction. Connections are the critical elements for any precast structure, because in past, major collapse of precast structure took place because of connection failure. In this study, behavior of four different precast wet connections with U shaped reinforcement bars provided at different locations is evaluated. Reduced 1/3^rd scale precast beam column assemblies having two span beam and three columns with removed middle column are constructed and examined by performing experiments. The response of precast connections is compared with monolithic connection, under column removal scenario. The connection region of test specimens are filled by cast-in-place micro concrete with and without polypropylene fibers. Performance of specimen is evaluated on the basis of ultimate load carrying capacity, maximum deflection at the location of removed middle column, crack formation and failure propagation. Further, Finite element (FE) analysis is carried out for validation of experimental studies and understanding the performance of structural components. Monolithic and precast beam column assemblies are modeled using non-linear Finite Element (FE) analysis based software ABAQUS. Actual experimental conditions are simulated using appropriate boundary and loading conditions. Finite Element simulation results in terms of load versus deflection are compared with that of experimental study. The nonlinear FE analysis results shows good agreement with experimental results.

• 한국지진공학회논문집
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• 제27권5호
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• pp.203-211
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• 2023

For fast-built and safe precast concrete (PC) construction, the dry mechanical splicing method is a critical technique that enables a self-sustaining system (SSS) during construction with no temporary support and minimizes onsite jobs. However, due to limited experimental evidence, traditional wet splicing methods are still dominantly adopted in the domestic precast industry. For PC beam-column connections, the current design code requires achieving emulative connection performances and corresponding structural integrity to be comparable with typical reinforced concrete (RC) systems with monolithic connections. To this end, this study conducted the standard material tests on mechanical splices to check their satisfactory performance as the Type 2 mechanical splice specified in the ACI 318 code. Two PC beam-column connection specimens with dry mechanical splices and an RC control specimen as the special moment frame were subsequently fabricated and tested under lateral reversed cyclic loadings. Test results showed that the seismic performances of all the PC specimens were fully comparable to the RC specimen in terms of strength, stiffness, energy dissipation, drift capacity, and failure mode, and their hysteresis responses showed a mitigated pinching effect compared to the control RC specimen. The seismic performances of the PC and RC specimens were evaluated quantitatively based on the ACI 374 report, and it appeared that all the test specimens fully satisfied the seismic performance criteria as a code-compliant special moment frame system.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2021년도 봄 학술논문 발표대회
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• pp.12-13
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• 2021

Methods for the manufacture, erection, and assembly of heavy frame modules were proposed. Interferences among precast members were prevented by using bolted metal plates for dry precast beam-to-column joints during assembly with a clearance for tolerance implementing grouted concrete filler plates instead of metal filler plates. Clearances for tolerances were provided to avoid conflictions among components during erection phases. These gaps were, then, grouted by high-strength mortar. The constructability of new connections of a beam-to-column joint using bolted metal plates for precast structures was examined using a full-scale assembly test in which practical observations indicated that members could be aligned and placed accurately in both horizontal and vertical directions, leading to a fast and convenient assembling. Bolt holes of the endplate were properly aligned using couplers with 30 mm fastened length embedded in the columns. The assembly test demonstrated the erection safety and structural stability of the proposed joints that were without filler plates when they were subjected to heavy loads at the time of their erection. The facile and rapid assembly of precast beam-to-column connections with a 30 mm tolerance was observed. The proposed assembly method is rapid, sustainable, and resilient, replacing the conventional methods of concrete frame construction, offering a connection that can be used in constructing infrastructure, such as buildings and pipe-rack frames.

• 한국수자원학회:학술대회논문집
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• 한국수자원학회 2021년도 학술발표회
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• pp.241-241
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• 2021

Recent developments recommend the use of SSS to prevent combined sewer overflows and reduce excessive pollutant deposition in the receiving waters; however, other studies also suggest that SSS have minimal or no advantage over CSS in terms of reducing the pollutant loads being discharged in natural waterways. This study was conducted to evaluate the effectiveness of employing SSS in improving the water quality of the rivers in Okcheon-gun, South Korea. The former combined sewer outfalls (CSOs) were monitored to determine the presence of illicit connections or leaks in the newly-established SSS. Dry and wet-day monitoring was conducted alongside the collection of water samples on 14 points along the reach of the rivers and four former CSOs to determine water quality changes and patterns of pollutant loading. Among the 34 former CSOs in the study area, eight former CSOs exhibited dry-day discharges, implying the possibility of having illicit connections, leaks, or illegal wastewater discharge in the system. Moreover, relatively high biochemical oxygen demand (BOD) chemical oxygen demand (COD) concentrations, ranging from 4.8 mg/L to 24.9 mg/L and 6.4 mg/L to 10.1 mg/L, respectively were observed on three out of the four monitored CSOs. Fluctuations in the pollutant concentrations in the different monitored points along the river was also observed due to the presence of pipes discharging polluted water. Ultimately, further studies are necessary to identify the sources of dry-day discharges in the CSOs to successfully improve the water quality of the rivers in the area.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 대한기계학회논문집
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• 제13권3호
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• pp.547-553
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• 1989

본 연구에서는 작동유체로서 수증기와 거동이 유사한 습공기를 대기 흡입식 풍동을 사용하여 원호 노즐로서 팽창시키는 경우에 대하여 응축충격파가 발생하는 흐름이 측정부내에 쐐기를 설치하여 발생시킨 경사충격파에 미치는 영향에 대해 실험적으로 조사하였다.