• Proceedings of the Materials Research Society of Korea Conference
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• 2007.05a
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• pp.41.2-41.2
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• 2007

• The Journal of Natural Sciences
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• v.8 no.1
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• pp.47-51
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• 1995

Several intermediate glasses are investigated to bond the alumina and the hydroxyapatite (HAp). The chemical compositions of the intermediate glasses are chosen as $CaO-Al_2O_3$. The mole ratio of CaO/$Al_2O_3$ is changed from 0.5 to 3.0. The lowest melting is observed at $1355^{\circ}C$ in the specimen of CaO/$Al_2O_3$ at the mole ratio of 2. With increasing contents of $Al_2O_3$, the melting temperatures gradually increase and a number of pores are observed. The sectional microstructure shows that the good wetability is observed in higher contents of CaO specimens. This implies that the good wetability is obtained in the mole ratio range of CaO/$Al_2O_3geq2$. The phase transformations are observed after treatment but the major peaks of HAp still exist.

• Journal of the Korean Applied Science and Technology
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• v.26 no.3
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• pp.233-239
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• 2009

A reaction device raising a generation yield by efficiently removing water generated in an esterified reaction between diethylene glycol monoethyl ether and succinic acid with mixture of an azeotropic point was newly developed as a new product in development of more stabilized emulsifier with a semi-solid phase(cream) in an emulsified phase of interfacial activity. The bis-(diethylene glycol monoethyl ether succinate(hereinafter, called as BDGS) with a high yield of more than 95% was obtained. As this has a property containing amphoteric emulsified functions such as W/O type or O/W type, etc., and has a merit that can be used regardless of any emulsified phase, there is no need using other emulsified surfactant. therefore, as this has excellent skin wetability in the cosmetics industry, a product having a wider range in quality compatibility or cost saving, etc. as a humectant has been developed.

• Journal of Welding and Joining
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• v.16 no.2
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• pp.122-128
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• 1998

This investigation was performed to collect fundamental informations concerning the behavior of glass solders on ceramic joining process. The wettability of glasses on two types of alumina was evaluated by sessile drop method. SiO$_2$-CaO-Al$_2$O$_3$system glasses were selected as solder glasses, and alumina that have different purities were used for substrate materials. It is indicated that contact angles of glasses on 99% purity of alumina substrate do not change as increasing time at elevated temperature, however the contact angles on the 92% purity of alumina substrate exhibit the strong time dependency. The time-dependent property on 92% alumina was due to the interlayer reactions occurred between the glass solder and impurities on the substrate.

• Elastomers and Composites
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• v.31 no.1
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• pp.23-32
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• 1996

PVB was blended with PMMA in order to recycle scraped PVB material which recovered in the safety glass manufactories. The purpose of this research on PVB/PMMA blend was applied with excellent tackiness and transparency of PVB as a material of high strength to make the maximum use. Also, the blending of PVB with PMMA was aimed at the increase of impact strength of PMMA because the elastic property of PVB might decrease the brittleness of PMMA due to the lack of inner impact resistance. Izod impact resistance was propotional to increase the content of PVB, which was predominantly increased in the addition of 10phr above MBS. High rate impact resistance showed a tendency to Increase but it showed a tendency to decrease maximum load and energy if the contents of PVB increased. On the other hand total energy and ductile index showed a tendency to increase excellent impact resistance in the addition of MBS contents. As a result of observed surface of PVB/PMMA blends, the size of PVB domain increased distribution homogenuously, in the addited MBS contents increased it showed distribution homogeneously and partially a wetability.

• KSTLE International Journal
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• v.9 no.1_2
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• pp.22-25
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• 2008

This paper investigated the wetting and adhesion property of undulated DLC film with surface morphology controlled for a reduced real area of contact. The undulated DLC Films were prepared by 13.56 MHZ radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) by using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM, AFM analysis showed that the after repeated deposition and plasma induced damage with Ar ions, the surface was nanoscale undulated. This phenomenon changed the surface morphology of DLC surface. Raman spectra of film with changed morphology revealed that the plasma induced damage with Ar ions significantly suppressed the graphitization of DLC structure. Also, it was observed that while the untreated flat DLC surfaces had wetting angle starting ranged from $72^{\circ}$ and adhesion force of 333ni. Had wetting angle the undulated DLC surfaces, which resemble the surface morphology of a cylindrical shape, increased up to $104^{\circ}$ and adhesion force decreased down to 11 nN. The measurements agree with Hertz and JKR models. The surface undulation was affected mainly by several factors: the surface morphology affinity to cylindrical shape, reduction of the real area of contact and air pockets trapped in cylindrical asperities of the surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• Polymer(Korea)
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• v.37 no.2
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• pp.184-195
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• 2013

Acrylic pressure sensitive adhesive (PSA) tapes were used for the automotive, the electrical and the electronic industries and the display module junction. In this study, the manufacture of high-strength structural tape used 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC), and UV irradiation for photo-polymerization, and the semi-structural properties of acrylic PSA tape with the AAC content and inorganic filler $SiO_2$ content were investigated. The initial adhesion strength was lowered by the rigidity of molecule chains due to the use of AAC, and the adhesion strength increased with increasing wetting time. The wetability, contact angle, and SEM images of PSA tapes with various contents of AAC were determined. Without filler, the peel strength and dynamic shear strength of PSA tape showed inverse correlation but the peel strength and dynamic shear strength increased with increasing filler content. From these correlations the PSA tapes could be optimized for the applications requiring high performance.

• Korean Journal of Food Science and Technology
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• v.6 no.4
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• pp.214-218
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• 1974

Eight different baking powders available in the domestic market have been analyzed and all of them have been found to belong to the sulfate type except for the sample H which is the phosphate type. The qualities of these baking powders have been compared based upon the results of sensory evaluation for the plain cakes prepared using them. It turned out from the sensory evaluation that the baking powder C was the best whereas E and H are of low quality. Strong alkaline odor and taste were detected in the cake of the sample E and in case of the sample H the appearance and internal structure of the cake were inferior. Such results are also in accord with those of wetability and sand retention tests and volume measurements of the cakes. The texture of the cakes was also measured by means of the texturometer. In summary, the baking powder C is the top whereas E and H are low in quality, the remainder being suitable.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.1-5
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• 2003

In this project, the efficiency of localized heating for micro systems packaging is developed by using a forced potential scheme microheater. Less than 0.2 Mpa contact pressure was used for bonding with a 200 mA current input for $50{\mu}m$ width, $2{\mu}m$ height and $8mm{\times}8mm$, $5mm{\times}5mm$, $3mm{\times}3mm$ sized phosphorus-doped poly-silicon microheater. The temperature can be raised at the bonding region to $800^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3 minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional microheaters. For performing the gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for conducting a gross leak check. The pass ratio of bonded dies was 67%, for conventional localized heating, and 85% for our newly developed FP scheme. The bonding strength was more than 25Mpa for FP scheme packaging, which shows that FP scheme can be a good candidate for micro-scale hermetic packaging.