공정조건에 따른 함몰된 다결정실리콘/실리콘($n^{+}$) - 실리콘(p) 접합의 특성

Properties of Recessed Polysilicon/Silicon($n^{+}$) - Silicon(P) Junction with Process Condition

  • 이종호 (원광대학교 전자재료공학과) ;
  • 최우성 (원광대학교 전자재료공학과) ;
  • 박춘배 (원광대학교 전자재료공학과) ;
  • 이종덕 (서울대학교 전자공학과)
  • 발행 : 1994.05.01

초록

A recessed $n^{+}$-p junction diode with the serf-aligned structure is proposed and fabricated by using the polysilicon as an $n^{+}$ diffusion source. The diode structure can be applicable to the emitter-base formation of high performance bipolar device and the $n^{+}$ polysilicon emitter has an important effect on the device characteristics. The considered parameters for the polysilicon formation are the deposition condition $As^{+}$ dose for the doping of the polysilicon, and the annealing using RTP system. The vertical depth profiles of the fabricated diode are obtained by SIMS. The eleotrical characteristics are analyzed in trims of the ideality factor of diode (n), contact resistance arid reverse leakage current. The $As_{+}$ dose for the formation of good junction is current. The $As^{+}$ dose for the formation of goodjunctions is about 1∼2${\times}$$10^{16}$$cm^{-2}$ at given RTA condition ($1100^{\circ}C$, 10 sec). The $n^{+}$-p structure is successfully applied to the self-aligned bipolar device adopting a single polysilicon technology.

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