Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 1995.10a
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- Pages.110-112
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- 1995
Study on Initial Strength of Solder Joints
Solder 접합부의 초기 강도에 관한 연구
Abstract
Initial solder joint strengths of various solder pastes, such as Sn-Pb(63-37wt%), Sn-In(52-48wt%), Sn-In-Ag(77.5-20-2.5wt%), and Sn-Ag(96.5-3.5wt%) has been studied. A system that can control the solder joint interface temperature during bonding process was also desined and implemented to improve solder joint integrity.
Keywords