트렌치 깊이에 따른 트랜지스터와 소자분리 특성

Characteristics of Transistors and Isolation as Trench Depth

  • 박상원 (현대전자산업주식회사 선행기술연구소 소자연구 1실) ;
  • 김선순 (현대전자산업주식회사 선행기술연구소 소자연구 1실) ;
  • 최준기 (현대전자산업주식회사 선행기술연구소 소자연구 1실) ;
  • 이상희 (현대전자산업주식회사 선행기술연구소 소자연구 1실) ;
  • 김용해 (현대전자산업주식회사 선행기술연구소 소자연구 1실) ;
  • 장성근 (현대전자산업주식회사 선행기술연구소 소자연구 1실) ;
  • 한대희 (현대전자산업주식회사 선행기술연구소 소자연구 1실) ;
  • 김형덕 (현대전자산업주식회사 선행기술연구소 소자연구 1실)
  • 발행 : 1999.06.01

초록

Shallow Trench Isolation (STI) has become the most promising isolation scheme for ULSI applications. The stress of STI structure is one of several factors to degrade characteristics of a device. The stress contours or STI structure vary with the trench depth. Isolation characteristics of STI was analyzed as the depth of trench varied. And transistor characteristics was compared. Isolation punch-through voltage for n$^{+}$ to pwell and p$^{+}$ to nwell increased as trench depth increased. n$^{+}$ to pwell leakage current had nothing to do with trench depth but n$^{+}$ to pwell leakage current decreased as trench depth increased. In the case of transistor characteristics, short channel effect was independent on trench depth and inverse narrow width effect was greater for deeper trenches. Therefore in order to achieve stable device, it is important to minimize stress by optimizing trench depth.

키워드