대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
- /
- Pages.1051-1053
- /
- 1999
대전류 통전시 배전반내의 열적 현상에 관한 연구
Investigations on the Thermal Phenomena in High Current Electric Switchboard
- 이방욱 (LG산전(주) 전력연구소 전력기기 연구팀) ;
- 강종성 (LG산전(주) 전력연구소 전력기기 연구팀) ;
- 손종만 (LG산전(주) 전력연구소 전력기기 연구팀) ;
- 최원준 (LG산전(주) 전력연구소 전력기기 연구팀) ;
- 서정민 (LG산전(주) 전력연구소 전력기기 연구팀)
- Lee, B.W. (Electric Equipment Team, Electrotechnology R&D center, LG Industrial Systems) ;
- Kang, J.S. (Electric Equipment Team, Electrotechnology R&D center, LG Industrial Systems) ;
- Sohn, J.M. (Electric Equipment Team, Electrotechnology R&D center, LG Industrial Systems) ;
- Choi, W.J. (Electric Equipment Team, Electrotechnology R&D center, LG Industrial Systems) ;
- Seo, J.M. (Electric Equipment Team, Electrotechnology R&D center, LG Industrial Systems)
- 발행 : 1999.11.20
초록
In this work, thermal phenomena and temperature rise due to thermal source in electric switchboard were investigated using analytical measures. Electric switchboards are assemblies of panels on which are mounted switches, circuit breakers, high current busbars, meter, fuses and terminals essential to the operation of electric equipment. It is very difficult to predict the temperature rise in switchboard due to the existence of several heat sources. To overcome this situations, we focused on the eddy current distribution on the panel of switchboard caused by high current busbars as a fundamental basis. And thermal sources including busbar and switchgear have been considered. Furthermore, thermal transfer phenomena in switchboard was considered theoretically. Finally, three-dimensional thermal model for eddy current analysis has been adopted and FEM analysis was conducted. As a result, three-dimensional numerical analysis found to be applicable to the analysis of thermal phenomena in switchboard.
키워드