Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.04a
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- Pages.87-96
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- 2000
Properties of Interlayer Low Dielectric Polyimide during Aluminum Etching with Electron Cyclotron Resonance Etcher System
- Kim, Sang-Hoon (Department of Materials Engineering, Hanyang University) ;
- Ahn, Jin-Ho (Department of Materials Engineering, Hanyang University)
- Published : 2000.04.01
Abstract
The properties of polyimide for interlayer dielectric applications are investigated during plasma etching of aluminum on it. Chlorine-based plasma generally used for aluminum etching results in an increase in the (dielectric constant of polyimide, while
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