한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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공정조성의 SnPb 및 SnAgCu 선형 솔더의 electromigration 특성 평가

Electromigration charateristics of eutectic SnPb and SnAgCu thin stripe lines

  • Yoon Min-Seung (School of Materials Science and Engineering, Seoul National University) ;
  • Lee Shin-bok (School of Materials Science and Engineering, Seoul National University) ;
  • Joo Young-Chang (School of Materials Science and Engineering, Seoul National University)
  • 발행 : 2003.11.01
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초록

Electromigration characteristics of $SnAg_3Cu_{0.7}$ and eutectic SnPb solder were studied using thin stripe-type test structures. Significant changes in the microstructure of two solders were observed after electromigration test, in which the temperature and the current density were varied from 90 to $110^{\circ}C$ and from $4.0\times10^4\;A/cm^2\;to\;9.2\times10^4\;A/cm^2$. In SnAgCu solders, hillocks were main]y observed near the anode end. From resistance measurements, it was calculated that the activation energy of the SnAgCu solder for electromigration was 1.04 eV And in eutectic SnPb without the effect of pads, while depleted region was found near cathode end, Sn-rich hillocks were observed near the anode end. During eutectic SnPb electromigration, it were observed that electromigration behavior had two migration modes.

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