Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Solder Paste Inspection of PCB using Laser Sensor

Laser 거리센서를 이용한 PCB에서의 납 도포상태검사

  • 오승용 (경희대학교 전자공학과) ;
  • 최경진 (경희대학교 전자공학과) ;
  • 이용현 (강남대학교 지식정보 공학부) ;
  • 박종국 (경희대학교 전자공학과)
  • Published : 2003.11.21
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Abstract

In this paper, 2D and 3D inspection algorithm for printed solder on PCB is introduced. The aim of inspection is the detection of error such as rich solder poor solder and missing solder. For Inspection, laser distance sensor is used. For 2D inspection, laser image that is created by normalizing laser data between 0 and 255 are used. Reference Image is made using gerber file. Image processing algorithm is used for 2D inspection. By adding thickness of metal stencil to laser image, volume for solder can be calculated and 3D inspection is carried out.

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