Integration of an Optical Waveguide Isolator by Wafer Direct Bonding

  • Roh J. W. (Photonic Research Center, Korea Institute of Science and Technology) ;
  • Yang J. S. (Photonic Research Center, Korea Institute of Science and Technology) ;
  • Ok S. H. (Photonic Research Center, Korea Institute of Science and Technology) ;
  • Choi U. K. (Photonic Research Center, Korea Institute of Science and Technology) ;
  • Lee S. (Photonic Research Center, Korea Institute of Science and Technology) ;
  • Lee W. Y. (Department of Material Science and Engineering, Yonsei University)
  • Published : 2004.12.01

Abstract

An integrated waveguide optical isolator by wafer direct bonding has been studied. The isolation ratio was found to be 2.9dB in our device. We found that wafer direct bonding between the InP and GGG is effective for the integration of a waveguide optical isolator.

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