Consolidation of Cu-based amorphous particles

Cu계 비정질 입자의 가압 성형

  • 강은영 (한국과학기술연구원 신금속재료연구센터, 연세대학교 금속공학과) ;
  • 정영훈 (한국과학기술연구원 신금속재료연구센터) ;
  • 유호근 (한국과학기술연구원 신금속재료연구센터, 국립서울산업대학교, 신소재공학과) ;
  • 박종우 (한국과학기술연구원 신금속재료연구센터)
  • Published : 2005.10.01

Abstract

Packing characteristics of amorphous alloy particles were investigated by scanning electron microscopy, compositional analysis, micro-hardness test and finite element method (FEM). Electroless Ni-plating was made on the surface of the Cu-based amorphous particles before consolidation in ambient atmosphere at an intermediate region of glass transition and crystallization temperatures $(T_g\;and\;T_x)$. Some parts of the Ni-layer in the interfaces of the consolidated particles disappeared, while some of them still remained without appreciable change in compositions. No cracks or fractures were found in the particles, which may occur at low temperatures below or near $T_g$ as anticipated by the FEM analysis. Crystallization and change in hardness were not observed after consolidation.

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