한국정보디스플레이학회:학술대회논문집

The Korean Infomation Display Society (한국정보디스플레이학회)
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Electrical Effects of the Adhesion Layer Using the VDP Process on Dielectric

  • Lee, Dong-Hyun (Dept. of Information Display Eng. & Center for Organic Materials and Information Devices, Hongik Univ) ;
  • Pyo, Sang-Woo (Center for Organic Materials and Information Devices, Hongik Univ , Dept. of Electrical Information & Control Eng., Hongik Univ) ;
  • Hyung, Gun Woo (Center for Organic Materials and Information Devices, Hongik Univ , Dept. of Information Display Eng., Hongik Univ) ;
  • Kim, Young-Kwan (Center for Organic Materials and Information Devices, Hongik Univ , Dept. of Information Display Eng., Hongik Univ)
  • Published : 2005.07.19
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Abstract

In the present paper, it was investigated that adhesion layer on gate insulator could affect the electrical characteristics for the organic thin film transistors (OTFTs). The polyimide (PI) as organic adhesion layer was fabricated by using the vapor deposition polymerization (VDP) processing . It was found that electrical characteristics improved comparing OTFTs using adhesion layer to another. We researched adhesion layer as a function of thickness. For inverted-staggered top contact structure, field effect mobility, threshold voltage, and on-off current ratio of OTFTs using adhesion layer of PI 15 nm thickness on the gate insulator with a thickness of 0.2 ${\mu}m$ were about 0.5 $cm^2/Vs$, -0.8 V, and $10^6$, respectively.

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