Influence of Bead Size during Ceria Abrasive Milling Process on High Selectivity and Light Point Defect (LPD) Formation alter STI-CMP

  • Moon, Seung-Hyun (Division of Electrical and Computer Engineering, Hanyang University) ;
  • Lee, Keun-Hoo (Division of Electrical and Computer Engineering, Hanyang University) ;
  • Kim, Jun-Seok (Nano SOI Process Laboratory, Hanyang University) ;
  • Kang, Hyun-Goo (Nano SOI Process Laboratory, Hanyang University) ;
  • Paik, Un-Gyu (Department of Ceramic Engineering, Hanyang University) ;
  • Park, Jea-Gun (Nano SOI Process Laboratory, Hanyang University)
  • Published : 2006.05.19