Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.11a
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- Pages.374-375
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- 2006
Development of CMP Pad by Using Biodegradable Polymer
생분해 폴리머를 이용한 CMP 연마 패드의 개발
- Chang, One-Moon (Mecha & Prec. Eng Dept, PNU) ;
- Park, Ki-Hyun (Mecha & Prec. Eng Dept, PNU) ;
- Ahn, Dae-Young (Mechanical Eng. Dept., PNU) ;
- Kim, Sun-Dae (Mechanical Eng. Dept., PNU) ;
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Jeong, Hae-Do
(Mechanical Eng. Dept., PNU)
- Published : 2006.11.09
Abstract
The purpose of this paper is to investigate the propriety of biodegradable polymer pad in spite of exchanging from existing polyurethane pad used in CMP(Chemical Mechanical Planarization). Poli 400 of G&P Technology for CMP and Ellipsometer of Rudolph AutoEL-III for measurement were used in this experiment. From this experiment, it is proven that the biodegradable polymer pad is sufficiently suitable in CMP process. Therefore, it is expected that, by using the biodegrable pad CMP manufacturing process, and will be decreased. Especially, wafer scratch can be decreased.