대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)

대한용접접합학회 (The Korean Welding and Joining Society)
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유도가열에 의한 Sn-3.5Ag 솔더 범프의 접합 특성에 관한 기초연구

Joining characteristics of Sn-3.5Ag solder bump by induction heating

  • 최준기 (조선대학교 일반대학원 선박해양공학과) ;
  • 방희선 (조선대학교 항공조선공학부) ;
  • ;
  • 방한서 (조선대학교 항공조선공학부)
  • 발행 : 2006.10.19
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초록

This paper studies the mechanical behaviors of Sn-3.5Ag solder joint against substrate(such as Au/Ni/Cu, Au/cu, Ni/Cu and Cu pad) after induction heating, a new soldering method. It was found that the solder bump formation depends on the time and current of the induction heating system. Also the heating value of the solder bump were found to vary with respect to the thermal conductivity of the pads on the substrate. In case of Au/Ni/Cu pad and Au/Cu pad, solder bump's shear strength were high for the heating time of $1.5{\sim}2sec$. For Ni/Cu pad, solder bump's shear strength were found to increase with time increment.

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